NOVEL MASSIVELY PARALLEL SUPERCOMPUTER
    3.
    发明申请
    NOVEL MASSIVELY PARALLEL SUPERCOMPUTER 有权
    新的大型并行超级计算机

    公开(公告)号:US20090259713A1

    公开(公告)日:2009-10-15

    申请号:US12492799

    申请日:2009-06-26

    摘要: A novel massively parallel supercomputer of hundreds of teraOPS-scale includes node architectures based upon System-On-a-Chip technology, i.e., each processing node comprises a single Application Specific Integrated Circuit (ASIC). Within each ASIC node is a plurality of processing elements each of which consists of a central processing unit (CPU) and plurality of floating point processors to enable optimal balance of computational performance, packaging density, low cost, and power and cooling requirements. The plurality of processors within a single node may be used individually or simultaneously to work on any combination of computation or communication as required by the particular algorithm being solved or executed at any point in time. The system-on-a-chip ASIC nodes are interconnected by multiple independent networks that optimally maximizes packet communications throughput and minimizes latency. In the preferred embodiment, the multiple networks include three high-speed networks for parallel algorithm message passing including a Torus, Global Tree, and a Global Asynchronous network that provides global barrier and notification functions. These multiple independent networks may be collaboratively or independently utilized according to the needs or phases of an algorithm for optimizing algorithm processing performance. For particular classes of parallel algorithms, or parts of parallel calculations, this architecture exhibits exceptional computational performance, and may be enabled to perform calculations for new classes of parallel algorithms. Additional networks are provided for external connectivity and used for Input/Output, System Management and Configuration, and Debug and Monitoring functions. Special node packaging techniques implementing midplane and other hardware devices facilitates partitioning of the supercomputer in multiple networks for optimizing supercomputing resources.

    摘要翻译: 数百个teraOPS级别的新型大规模并行超级计算机包括基于片上系统技术的节点架构,即每个处理节点包括单个专用集成电路(ASIC)。 在每个ASIC节点内是多个处理元件,每个处理元件由中央处理单元(CPU)和多个浮点处理器组成,以实现计算性能,封装密度,低成本以及功率和冷却​​要求的最佳平衡。 单个节点内的多个处理器可以单独使用或同时使用,以在任何时间点解决或执行的特定算法所要求的任何计算或通信组合上工作。 片上系统ASIC节点通过多个独立网络互连,从而最大限度地最大限度地提高了分组通信吞吐量并最大限度地减少了延迟。 在优选实施例中,多个网络包括用于并行算法消息传递的三个高速网络,包括提供全局障碍和通知功能的环形,全局树和全球异步网络。 这些多个独立网络可以根据用于优化算法处理性能的算法的需求或阶段来协同或独立地利用。 对于特定类别的并行算法或并行计算的部分,该架构具有出色的计算性能,并且可以启用对新类并行算法执行计算。 为外部连接提供附加网络,用于输入/输出,系统管理和配置以及调试和监控功能。 实现中平面和其他硬件设备的特殊节点打包技术有助于在多个网络中划分超级计算机,以优化超级计算资源。

    NOVEL MASSIVELY PARALLEL SUPERCOMPUTER
    5.
    发明申请
    NOVEL MASSIVELY PARALLEL SUPERCOMPUTER 有权
    新的大型并行超级计算机

    公开(公告)号:US20120311299A1

    公开(公告)日:2012-12-06

    申请号:US13566024

    申请日:2012-08-03

    IPC分类号: G06F15/80

    摘要: A novel massively parallel supercomputer of hundreds of teraOPS-scale includes node architectures based upon System-On-a-Chip technology, i.e., each processing node comprises a single Application Specific Integrated Circuit (ASIC). Within each ASIC node is a plurality of processing elements each of which consists of a central processing unit (CPU) and plurality of floating point processors to enable optimal balance of computational performance, packaging density, low cost, and power and cooling requirements. The plurality of processors within a single node individually or simultaneously work on any combination of computation or communication as required by the particular algorithm being solved. The system-on-a-chip ASIC nodes are interconnected by multiple independent networks that optimally maximizes packet communications throughput and minimizes latency. The multiple networks include three high-speed networks for parallel algorithm message passing including a Torus, Global Tree, and a Global Asynchronous network that provides global barrier and notification functions.

    摘要翻译: 数百个teraOPS级别的新型大规模并行超级计算机包括基于片上系统技术的节点架构,即每个处理节点包括单个专用集成电路(ASIC)。 在每个ASIC节点内是多个处理元件,每个处理元件由中央处理单元(CPU)和多个浮点处理器组成,以实现计算性能,封装密度,低成本以及功率和冷却​​要求的最佳平衡。 单个节点内的多个处理器单独或同时工作在要解决的特定算法所要求的计算或通信的任何组合上。 片上系统ASIC节点通过多个独立网络进行互连,从而最大限度地最大限度地提高了分组通信吞吐量并最大限度地减少了延迟。 多个网络包括用于并行算法消息传递的三个高速网络,包括Torus,全局树和提供全局障碍和通知功能的全球异步网络。

    Massively parallel supercomputer
    6.
    发明授权
    Massively parallel supercomputer 有权
    大型并行超级计算机

    公开(公告)号:US08250133B2

    公开(公告)日:2012-08-21

    申请号:US12492799

    申请日:2009-06-26

    IPC分类号: G06F15/16

    摘要: A novel massively parallel supercomputer of hundreds of teraOPS-scale includes node architectures based upon System- On-a-Chip technology, i.e., each processing node comprises a single Application Specific Integrated Circuit (ASIC). Within each ASIC node is a plurality of processing elements each of which consists of a central processing unit (CPU) and plurality of floating point processors to enable optimal balance of computational performance, packaging density, low cost, and power and cooling requirements. The plurality of processors within a single node individually or simultaneously work on any combination of computation or communication as required by the particular algorithm being solved. The system-on-a-chip ASIC nodes are interconnected by multiple independent networks that optimally maximizes packet communications throughput and minimizes latency. The multiple networks include three high-speed networks for parallel algorithm message passing including a Torus, Global Tree, and a Global Asynchronous network that provides global barrier and notification functions.

    摘要翻译: 数百个teraOPS级别的新型大规模并行超级计算机包括基于片上系统技术的节点架构,即每个处理节点包括单个专用集成电路(ASIC)。 在每个ASIC节点内是多个处理元件,每个处理元件由中央处理单元(CPU)和多个浮点处理器组成,以实现计算性能,封装密度,低成本以及功率和冷却​​要求的最佳平衡。 单个节点内的多个处理器单独或同时工作在要解决的特定算法所要求的计算或通信的任何组合上。 片上系统ASIC节点通过多个独立网络互连,从而最大限度地最大限度地提高了分组通信吞吐量并最大限度地减少了延迟。 多个网络包括用于并行算法消息传递的三个高速网络,包括Torus,全局树和提供全局障碍和通知功能的全球异步网络。

    Massively parallel supercomputer
    7.
    发明授权
    Massively parallel supercomputer 有权
    大型并行超级计算机

    公开(公告)号:US07555566B2

    公开(公告)日:2009-06-30

    申请号:US10468993

    申请日:2002-02-25

    IPC分类号: G06F15/16

    摘要: A novel massively parallel supercomputer of hundreds of teraOPS-scale includes node architectures based upon System-On-a-Chip technology, i.e., each processing node comprises a single Application Specific Integrated Circuit (ASIC). Within each ASIC node is a plurality of processing elements each of which consists of a central processing unit (CPU) and plurality of floating point processors to enable optimal balance of computational performance, packaging density, low cost, and power and cooling requirements. The plurality of processors within a single node may be used individually or simultaneously to work on any combination of computation or communication as required by the particular algorithm being solved or executed at any point in time. The system-on-a-chip ASIC nodes are interconnected by multiple independent networks that optimally maximizes packet communications throughput and minimizes latency. In the preferred embodiment, the multiple networks include three high-speed networks for parallel algorithm message passing including a Torus, Global Tree, and a Global Asynchronous network that provides global barrier and notification functions. These multiple independent networks may be collaboratively or independently utilized according to the needs or phases of an algorithm for optimizing algorithm processing performance. For particular classes of parallel algorithms, or parts of parallel calculations, this architecture exhibits exceptional computational performance, and may be enabled to perform calculations for new classes of parallel algorithms. Additional networks are provided for external connectivity and used for Input/Output, System Management and Configuration, and Debug and Monitoring functions. Special node packaging techniques implementing midplane and other hardware devices facilitates partitioning of the supercomputer in multiple networks for optimizing supercomputing resources.

    摘要翻译: 数百个teraOPS级别的新型大规模并行超级计算机包括基于片上系统技术的节点架构,即,每个处理节点包括单个专用集成电路(ASIC)。 在每个ASIC节点内是多个处理元件,每个处理元件由中央处理单元(CPU)和多个浮点处理器组成,以实现计算性能,封装密度,低成本以及功率和冷却​​要求的最佳平衡。 单个节点内的多个处理器可以单独使用或同时使用,以在任何时间点解决或执行的特定算法所要求的任何计算或通信组合上工作。 片上系统ASIC节点通过多个独立网络互连,从而最大限度地最大限度地提高了分组通信吞吐量并最大限度地减少了延迟。 在优选实施例中,多个网络包括用于并行算法消息传递的三个高速网络,包括提供全局障碍和通知功能的环形,全局树和全球异步网络。 这些多个独立网络可以根据用于优化算法处理性能的算法的需求或阶段来协同或独立地利用。 对于特定类别的并行算法或并行计算的部分,该架构具有出色的计算性能,并且可以启用对新类并行算法执行计算。 为外部连接提供附加网络,用于输入/输出,系统管理和配置以及调试和监控功能。 实现中平面和其他硬件设备的特殊节点打包技术有助于在多个网络中划分超级计算机,以优化超级计算资源。

    High resolution reduction catadioptric relay lens
    10.
    发明授权
    High resolution reduction catadioptric relay lens 失效
    高分辨率降低反射折射中继镜

    公开(公告)号:US5241423A

    公开(公告)日:1993-08-31

    申请号:US738971

    申请日:1991-08-01

    IPC分类号: G02B13/00 G02B17/08 G03F7/20

    摘要: An optical system of a NX reduction catadioptric relay lens having sub-half micron resolution over the ultraviolet band width is described. A spherical mirror with a stop at the mirror is used to work at substantially the desired reduction ratio and the desired high numerical aperture sufficient to provide the desired high resolution. A beam splitting cube with appropriate coatings is used to form an accessible image of an object on an image plane. Refracting correctors in the path of the slow beam incident on the mirror and in the path of the fast beam reflected on the mirror are designed to fix the aberrations of the image formed by the mirror. The beam splitter coatings are chosen in such a way that beams reflected from and transmitted therethrough suffer no net aberration as a result of multiple reflections within the thin film beam splitter coatings and therefore are substantially free of aberration, distortion and apodization which would result from the beam splitting surface in the absence of these coatings.

    摘要翻译: 描述了在紫外线带宽上具有半微米分辨率的NX还原反射折射中继透镜的光学系统。 使用在镜子处具有止动件的球面镜以基本上所需的减小比率和足以提供所需高分辨率的期望的高数值孔径进行工作。 使用具有适当涂层的分束立方体在图像平面上形成物体的可访问图像。 入射在反射镜上的慢光束和在反射镜上反射的快光束的路径中的光束的折射校正器设计成固定由反射镜形成的图像的像差。 选择分束器涂层,使得从薄膜分束器涂层中反射并从其透射的光束不会因薄膜分束器涂层内的多次反射而产生净像差,因此基本上不会产生像差,畸变和变迹 在没有这些涂层的情况下分束表面。