公开(公告)号：US06255738B1

公开(公告)日：2001-07-03

申请号：US08940477

申请日：1997-09-30

申请人： Thomas H. Distefano ,  Craig Mitchell ,  Mark Thorson ,  Zlata Kovac

发明人： Thomas H. Distefano ,  Craig Mitchell ,  Mark Thorson ,  Zlata Kovac

IPC分类号： H01L2329

CPC分类号： H01L23/4985 ,  H01L23/24 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： Filled, curable siloxane encapsulant compositions containing a curable siloxane base resin with functional groups reactive with functional groups of a hardener compound to form a polysiloxane, and filler particles with surface functional groups reactive with the hardener compound functional groups, wherein the filler particles have at least a bi-modal particle packing distribution of first filler particles having a first diameter and second filler particles having a second diameter smaller than the first diameter, and the first and second filler particles are present in amounts effective to provide a particle packing distribution with a relative bulk volume of at least about 90 percent. Tri-modal particle packing distributions of the first and second filler particles with third filler particles having a third diameter smaller than the second diameter are preferred, with the first, second and third filler particles being present in amounts effective to provide a tri-modal particle packing distribution with a relative bulk volume of at least about 95 percent. Encapsulant kits, cured encapsulant compositions in which filler particles are individually covalently bonded to one or more polysiloxane polymer chains, microelectronic assemblies incorporating the cured encapsulant compositions, and methods for preparing the curable encapsulant compositions are also disclosed.

摘要翻译： 含有具有与硬化剂化合物的官能团反应形成聚硅氧烷的官能团的可固化硅氧烷基础树脂的填充的可固化的硅氧烷密封剂组合物和具有与硬化剂化合物官能团反应的表面官能团的填料颗粒，其中填料颗粒至少具有 具有第一直径的第一填料颗粒和具有小于第一直径的第二直径的第二填料颗粒的双模式颗粒填充分布，并且第一和第二填料颗粒以有效提供颗粒填充分布的量存在于相对 体积至少约90％。 优选具有第三直径小于第二直径的第三填料颗粒的第一和第二填料颗粒的三模式颗粒填充分布，其中第一，第二和第三填料颗粒以有效提供三模式颗粒的量存在 填料分布的相对体积体积至少约95％。 还公开了封装剂试剂盒，固化的密封剂组合物，其中填料颗粒单独地共价键合到一个或多个聚硅氧烷聚合物链上，结合固化的密封剂组合物的微电子组件以及制备可固化的密封剂组合物的方法。