公开(公告)号：US06255738B1

公开(公告)日：2001-07-03

申请号：US08940477

申请日：1997-09-30

申请人： Thomas H. Distefano ,  Craig Mitchell ,  Mark Thorson ,  Zlata Kovac

发明人： Thomas H. Distefano ,  Craig Mitchell ,  Mark Thorson ,  Zlata Kovac

IPC分类号： H01L2329

CPC分类号： H01L23/4985 ,  H01L23/24 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： Filled, curable siloxane encapsulant compositions containing a curable siloxane base resin with functional groups reactive with functional groups of a hardener compound to form a polysiloxane, and filler particles with surface functional groups reactive with the hardener compound functional groups, wherein the filler particles have at least a bi-modal particle packing distribution of first filler particles having a first diameter and second filler particles having a second diameter smaller than the first diameter, and the first and second filler particles are present in amounts effective to provide a particle packing distribution with a relative bulk volume of at least about 90 percent. Tri-modal particle packing distributions of the first and second filler particles with third filler particles having a third diameter smaller than the second diameter are preferred, with the first, second and third filler particles being present in amounts effective to provide a tri-modal particle packing distribution with a relative bulk volume of at least about 95 percent. Encapsulant kits, cured encapsulant compositions in which filler particles are individually covalently bonded to one or more polysiloxane polymer chains, microelectronic assemblies incorporating the cured encapsulant compositions, and methods for preparing the curable encapsulant compositions are also disclosed.

摘要翻译： 含有具有与硬化剂化合物的官能团反应形成聚硅氧烷的官能团的可固化硅氧烷基础树脂的填充的可固化的硅氧烷密封剂组合物和具有与硬化剂化合物官能团反应的表面官能团的填料颗粒，其中填料颗粒至少具有 具有第一直径的第一填料颗粒和具有小于第一直径的第二直径的第二填料颗粒的双模式颗粒填充分布，并且第一和第二填料颗粒以有效提供颗粒填充分布的量存在于相对 体积至少约90％。 优选具有第三直径小于第二直径的第三填料颗粒的第一和第二填料颗粒的三模式颗粒填充分布，其中第一，第二和第三填料颗粒以有效提供三模式颗粒的量存在 填料分布的相对体积体积至少约95％。 还公开了封装剂试剂盒，固化的密封剂组合物，其中填料颗粒单独地共价键合到一个或多个聚硅氧烷聚合物链上，结合固化的密封剂组合物的微电子组件以及制备可固化的密封剂组合物的方法。

公开(公告)号：US6133639A

公开(公告)日：2000-10-17

申请号：US842313

申请日：1997-04-24

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas H. Distefano ,  John W. Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas H. Distefano ,  John W. Smith

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/60 ,  H01L23/28 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174

摘要： A method and an apparatus for providing a planar and compliant interface between a semiconductor chip and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The complaint interface is comprised of a plurality of compliant pads defining channels between adjacent pads. The pads are typically compressed between a flexible film chip carrier and the chip. A compliant filler is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness.

摘要翻译： 一种用于在半导体芯片和其支撑衬底之间提供平面和兼容接口以适应其间的热膨胀失配的方法和装置。 投诉界面由在相邻的焊盘之间限定通道的多个柔性焊盘构成。 垫通常在柔性膜芯片载体和芯片之间被压缩。 在通道内进一步布置柔顺填料以形成具有受控厚度的均匀包封层。

公开(公告)号：US5659952A

公开(公告)日：1997-08-26

申请号：US365699

申请日：1994-12-29

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas H. Distefano ,  John W. Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas H. Distefano ,  John W. Smith

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/60 ,  H01L23/28 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174

摘要： A method and an apparatus for providing a planar and compliant interface between a semiconductor chip and its supporting substrate to accommodate for the thermal coefficient of expansion mismatch therebetween. The compliant interface is comprised of a plurality of compliant pads defining channels between adjacent pads. The pads are typically compressed between a flexible film chip carrier and the chip. A compliant filler is further disposed within the channels to form a uniform encapsulation layer having a controlled thickness.

摘要翻译： 一种用于在半导体芯片和其支撑衬底之间提供平面和兼容接口以适应其间的热膨胀失配的方法和装置。 兼容接口包括限定相邻焊盘之间的通道的多个柔性焊盘。 垫通常在柔性膜芯片载体和芯片之间被压缩。 在通道内进一步布置柔顺填料以形成具有受控厚度的均匀包封层。

公开(公告)号：US5491302A

公开(公告)日：1996-02-13

申请号：US308741

申请日：1994-09-19

申请人： Thomas H. Distefano ,  Zlata Kovac ,  John Grange

发明人： Thomas H. Distefano ,  Zlata Kovac ,  John Grange

IPC分类号： H01L21/60 ,  H01L21/00 ,  H01L21/607 ,  H05K3/32 ,  H05K13/04 ,  H05K1/14

CPC分类号： H01L21/67144 ,  H01L24/86 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T29/4913 ,  Y10T29/49135

摘要： A method of connecting a semiconductor chip assembly having at least first and second contacts to a connection component including at least first and second connection leads by means of a tool consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component is juxtaposed with the semiconductor chip assembly so that the first and second connection leads are aligned with the first and second contacts in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool substantially downwardly and towards the second contact in the second direction.

摘要翻译： 一种将具有至少第一和第二触点的半导体芯片组件连接到包括至少第一和第二连接引线的连接部件的连接部件，该连接部件通过工具组成，该工具包括将引线并联连接到对应的触点。 连接部件与半导体芯片组件并置，使得第一和第二连接引线与第一和第二触点对准，使得第一连接引线在第一方向上偏离第一触点，而第二连接引线 在相同的第一方向上偏离第二接触。 第一连接引线通过工具基本上向下移动并且在与第一方向相反的第二方向上朝着第一接触移动，使得在第一连接引线和第二触点之间形成开放空间，并且导致 所述第二连接引线由所述工具大致向下移动并朝向所述第二方向的所述第二接触。

公开(公告)号：US5706174A

公开(公告)日：1998-01-06

申请号：US812202

申请日：1997-03-06

申请人： Thomas H. Distefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

发明人： Thomas H. Distefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/64 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40

CPC分类号： H01L24/81 ,  H01L21/4839 ,  H01L21/563 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/3025 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49149

摘要： A compliant microelectronic mounting device. An area array of conductive contact pads are connected into rows by conductive leads on a first side of a flexible substrate. Each of the conductive leads bridges a bonding hole in the substrate which is situated between successive contact pads. Each of the conductive leads further has a frangible portion within or near each bonding hole. A plurality of compliant dielectric buttons, typically composed of an elastomer material, are attached to a second side of the substrate and typically positioned under each contact pad. The component may be attached to a microelectronic device having contacts so that a stand-off is created between the substrate and the device by the compliant dielectric buttons. The frangible portions allow the leads to be cleanly broken, bent and secured into electrical contact with opposed contact pads on the microelectronic device. Each of these connections may be supported by a compliant layer, typically an uncured elastomer which fills the area around the dielectric pads and is then cured.

摘要翻译： 符合微电子的安装装置。 导电接触焊盘的区域阵列通过柔性基板的第一侧上的导电引线连接成行。 每个导电引线桥接位于连续接触焊盘之间的衬底中的结合孔。 每个导电引线还在每个结合孔内或附近还具有易碎部分。 通常由弹性体材料组成的多个柔性介质按钮被附接到基板的第二侧并且通常位于每个接触垫下方。 该部件可以附接到具有触点的微电子器件，使得通过柔性介质按钮在基板和器件之间产生间隔。 易碎部分允许引线被干净地折断，弯曲并固定成与微电子器件上的相对接触焊盘电接触。 这些连接中的每一个可以由柔性层（通常是填充介电垫周围区域的未固化的弹性体）支撑，然后固化。

公开(公告)号：US5619017A

公开(公告)日：1997-04-08

申请号：US551458

申请日：1995-11-01

申请人： Thomas H. Distefano ,  Zlata Kovac ,  John Grange

发明人： Thomas H. Distefano ,  Zlata Kovac ,  John Grange

IPC分类号： H01L21/60 ,  H01L21/00 ,  H01L21/607 ,  H05K3/32 ,  H05K13/04 ,  H05K1/14

CPC分类号： H01L21/67144 ,  H01L24/86 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T29/4913 ,  Y10T29/49135

摘要： A method of connecting a semiconductor chip assembly having at least first and second contacts to a connection component including at least first and second connection leads by means of a tool consisting of the steps of juxtaposing moving and connecting the leads to the corresponding contacts. The connection component is juxtaposed with the semiconductor chip assembly so that the first and second connection leads are aligned with the first and second contacts in such a manner that the first connection lead is offset from the first contact in the first direction and the second connection lead is offset from the second contact in the same first direction. The first connection lead is moved by means of the tool substantially downwardly and towards the first contact in a second direction which is opposite to the first direction, so that an open space is formed between the first connection lead and the second contact and lead to facilitate movement of the second connection lead by the tool substantially downwardly and towards the second contact in the second direction.

摘要翻译： 一种将具有至少第一和第二触点的半导体芯片组件连接到包括至少第一和第二连接引线的连接部件的连接部件，该连接部件通过工具组成，该工具包括将引线并联连接到对应的触点。 连接部件与半导体芯片组件并置，使得第一和第二连接引线与第一和第二触点对准，使得第一连接引线在第一方向上偏离第一触点，而第二连接引线 在相同的第一方向上偏离第二接触。 第一连接引线通过工具基本上向下移动并且在与第一方向相反的第二方向上朝着第一接触移动，使得在第一连接引线和第二触点之间形成开放空间，并且导致 所述第二连接引线由所述工具大致向下移动并朝向所述第二方向的所述第二接触。

公开(公告)号：US5766987A

公开(公告)日：1998-06-16

申请号：US532235

申请日：1995-09-22

申请人： Craig Mitchell ,  Thomas H. Distefano

发明人： Craig Mitchell ,  Thomas H. Distefano

IPC分类号： H01L21/56 ,  H01L21/44

CPC分类号： H01L21/565 ,  H01L2924/0002

摘要： Microelectronic assemblies such as semiconductor chip assemblies are encapsulated. During encapsulation, the terminals carried by a dielectric layer in each assembly, and the bottom surface of the semiconductor chip in each assembly are protected by covering layers. The covering layers confine the liquid encapsulant and prevent contamination of the terminals and chip bottom surfaces. The encapsulation process may be conducted by using a tilting fixture. The liquid encapsulant and the assemblies are placed into the fixture, the fixture is closed and evacuated, and the encapsulant is then poured onto the assemblies while maintaining the fixture under vacuum. The fixture is then pressurized and maintained under pressure during cure of the encapsulant.

摘要翻译： 诸如半导体芯片组件的微电子组件被封装。 在封装期间，每个组件中由介电层承载的端子和每个组件中的半导体芯片的底表面由覆盖层保护。 覆盖层限制液体密封剂，并防止端子和芯片底面的污染。 封装过程可以通过使用倾斜夹具进行。 将液体密封剂和组件放入固定装置中，将固定装置关闭并抽真空，然后将密封剂倒入组件上，同时将固定装置保持在真空状态。 然后将固定装置加压并在密封剂固化期间保持压力。

公开(公告)号：US5932254A

公开(公告)日：1999-08-03

申请号：US12079

申请日：1998-01-22

申请人： Craig Mitchell ,  Thomas H. Distefano

发明人： Craig Mitchell ,  Thomas H. Distefano

IPC分类号： H01L21/56 ,  B29C45/14

CPC分类号： H01L21/565 ,  H01L2924/0002

摘要： A fixture for encapsulating microelectronic devices includes a structure defining a device-receiving pocket and a well communicating with the pocket so that the passage and well define an interior space whereby the pocket is disposed above the well when the structure is in a first orientation and the well is disposed above the pocket when the structure is in a second orientation. The fixture also includes an element for sealing the interior space and a port for connecting the sealed interior space to an evacuation device.

摘要翻译： 用于封装微电子器件的固定器包括限定器件接收凹部和与凹穴连通的阱的结构，使得通道和阱限定内部空间，由此当结构处于第一取向时口袋设置在阱上方，并且 当结构处于第二方向时，井被设置在口袋上方。 固定装置还包括用于密封内部空间的元件和用于将密封的内部空间连接到排气装置的端口。

公开(公告)号：US5929517A

公开(公告)日：1999-07-27

申请号：US365749

申请日：1994-12-29

申请人： Thomas H. Distefano ,  Konstantine Karavakis ,  Craig Mitchell ,  John W. Smith

发明人： Thomas H. Distefano ,  Konstantine Karavakis ,  Craig Mitchell ,  John W. Smith

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/04 ,  H05K13/04

CPC分类号： H01L24/50 ,  H01L21/565 ,  H01L23/3121 ,  H01L2224/50 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/49146

摘要： Semiconductor chip packages and methods of fabricating the same. The package includes a thermally conductive protective structure having an indentation open to a front side and a flange surface at least partially surrounding the indentation and facing to the front of the structure. A chip is disposed in the indentation so that the front surface of the chip, with contacts thereon, faces toward the front of the structure. A flexible dielectric film having terminals thereon is placed on the flange surface, and a compliant material is disposed between the film and the flange surface. The terminals on the film are connected to the contacts on the chip. The individual terminals on the film are movable with respect to the protective structure, which facilitates mounting and compensation for thermal expansion.

摘要翻译： 半导体芯片封装及其制造方法。 该封装包括导热保护结构，其具有向前侧开口的凹口和至少部分地围绕凹口并面向结构前部的凸缘表面。 芯片设置在凹陷中，使得具有触点的芯片的前表面朝向结构的前部。 其上具有端子的柔性电介质膜放置在凸缘表面上，并且柔性材料设置在膜和凸缘表面之间。 胶片上的端子连接到芯片上的触点。 胶片上的各个端子相对于保护结构是可移动的，这有助于热膨胀的安装和补偿。

公开(公告)号：US5663106A

公开(公告)日：1997-09-02

申请号：US246113

申请日：1994-05-19

申请人： Konstantine Karavakis ,  Thomas H. Distefano ,  John W. Smith, Jr. ,  Craig Mitchell

发明人： Konstantine Karavakis ,  Thomas H. Distefano ,  John W. Smith, Jr. ,  Craig Mitchell

IPC分类号： H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L21/60

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3114 ,  H01L24/97 ,  H01L2224/11003 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/3025 ,  Y10T29/49146

摘要： A method of packaging a semiconductor chip assembly includes the encapsulation of the same after establishing an encapsulation area and providing a physical barrier for protecting the terminals of a chip carrier. An alternative or supplement to providing a physical barrier is to provide a preform of an encapsulation material which includes a predetermined volume of such material so that only the encapsulation area is filled. For a semiconductor chip assembly which does not yet have an elastomeric layer, a method of simultaneously forming such an elastomeric layer and encapsulating a semiconductor chip assembly is also provided.

摘要翻译： 封装半导体芯片组件的方法包括在建立封装区域之后对其进行封装，并提供用于保护芯片载体的端子的物理屏障。 提供物理屏障的替代或补充是提供包含材料的预成型件，其包括预定体积的这种材料，使得仅填充封装区域。 对于还没有弹性体层的半导体芯片组件，还提供了同时形成这种弹性体层并封装半导体芯片组件的方法。