公开(公告)号：US08854836B2

公开(公告)日：2014-10-07

申请号：US13452753

申请日：2012-04-20

Applicant: Hongyu Deng ,  Yunpeng Song ,  Maziar Amirkiai ,  Martin Kalberer

Inventor： Hongyu Deng ,  Yunpeng Song ,  Maziar Amirkiai ,  Martin Kalberer

IPC: H05K7/00

CPC classification number: G02B6/4279 ,  G02B6/4206 ,  G02B6/4246 ,  G02B6/4263 ,  G02B6/428 ,  G02B6/4281 ,  G02B6/4292

Abstract: An example embodiment includes a TO can including a header, an RF pin opening, an internal volume, an RF pin, a submount, and a flex circuit. The header defines the RF pin opening. The internal volume is defined by a TO can housing and an interior header surface. The RF pin extends through the RF pin opening such that a first surface connection is located in the internal volume and a second surface connection is located outside of the internal volume and extends past an exterior header surface. The submount is located in the internal volume and the submount includes a submount trace. The submount trace includes a pin connection portion in-line with the RF pin and electrically coupled to the first surface connection. The flex circuit includes a flex trace further including a flex trace connection in-line with the RF pin and electrically coupled to the second surface connection.

Abstract translation: 示例性实施例包括TO可以包括报头，RF引脚开口，内部卷，RF引脚，子基座和柔性电路。 标头定义RF引脚开口。 内部容积由TO罐壳体和内部集管表面限定。 RF引脚延伸穿过RF引脚开口，使得第一表面连接位于内部容积中，并且第二表面连接位于内部容积的外部并且延伸经过外部集管表面。 子安装板位于内部卷中，子安装板包含一个子安装架跟踪。 副安装座轨迹包括与RF引脚成直线并且电耦合到第一表面连接的引脚连接部分。 柔性电路包括柔性迹线，其还包括与RF引脚成直线并且电耦合到第二表面连接的挠曲迹线连接。

公开(公告)号：US20130279139A1

公开(公告)日：2013-10-24

申请号：US13452753

申请日：2012-04-20

Applicant: Hongyu Deng ,  Yunpeng Song ,  Maziar Amirkiai ,  Martin Kalberer

Inventor： Hongyu Deng ,  Yunpeng Song ,  Maziar Amirkiai ,  Martin Kalberer

IPC: H05K7/02

CPC classification number: G02B6/4279 ,  G02B6/4206 ,  G02B6/4246 ,  G02B6/4263 ,  G02B6/428 ,  G02B6/4281 ,  G02B6/4292

Abstract: An example embodiment includes a TO can including a header, an RF pin opening, an internal volume, an RF pin, a submount, and a flex circuit. The header defines the RF pin opening. The internal volume is defined by a TO can housing and an interior header surface. The RF pin extends through the RF pin opening such that a first surface connection is located in the internal volume and a second surface connection is located outside of the internal volume and extends past an exterior header surface. The submount is located in the internal volume and the submount includes a submount trace. The submount trace includes a pin connection portion in-line with the RF pin and electrically coupled to the first surface connection. The flex circuit includes a flex trace further including a flex trace connection in-line with the RF pin and electrically coupled to the second surface connection.

Abstract translation: 示例性实施例包括TO可以包括报头，RF引脚开口，内部卷，RF引脚，子基座和柔性电路。 标头定义RF引脚开口。 内部容积由TO罐壳体和内部集管表面限定。 RF引脚延伸穿过RF引脚开口，使得第一表面连接位于内部容积中，并且第二表面连接位于内部容积的外部并且延伸经过外部集管表面。 子安装板位于内部卷中，子安装板包含一个子安装架跟踪。 副安装座轨迹包括与RF引脚成直线并且电耦合到第一表面连接的引脚连接部分。 柔性电路包括柔性迹线，其还包括与RF引脚成直线并且电耦合到第二表面连接的挠曲迹线连接。

公开(公告)号：US08447153B2

公开(公告)日：2013-05-21

申请号：US11740781

申请日：2007-04-26

Applicant: Darin James Douma ,  The 'Linh Nguyen ,  Hongyu Deng ,  Martin Kalberer ,  Maziar Amirkiai

Inventor： Darin James Douma ,  The 'Linh Nguyen ,  Hongyu Deng ,  Martin Kalberer ,  Maziar Amirkiai

IPC: G02B6/35 ,  G02B6/26

CPC classification number: G02B6/4201 ,  G02B6/4279 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01S5/02212 ,  H01S5/02248 ,  H01S5/02284 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A low inductance structure for improving the integrity of data signals carried in an optical subassembly is disclosed. In one embodiment the optical subassembly comprises a housing containing a lens assembly and an optical isolator. The optical subassembly further includes an optoelectronic package having a base defining a mounting surface that cooperates with a cap to define a hermetic enclosure. First and second signal leads of the subassembly include ends that extend into the hermetic enclosure. A submount is disposed on the base mounting surface. A low inductance structure is integrally formed with the submount and includes a dielectric body interposed between the first and second leads. The body includes shaped edges and conductive pad structures in electrical communication with conductive traces disposed on the submount. Each pad structure is also in electrical communication with a respective one of the first and second signal leads via a plurality of wirebonds.

Abstract translation: 公开了一种用于改善在光学子组件中携带的数据信号的完整性的低电感结构。 在一个实施例中，光学子组件包括容纳透镜组件和光隔离器的壳体。 光学子组件还包括光电封装，其具有限定与盖配合以限定密封外壳的安装表面的基座。 子组件的第一和第二信号引线包括延伸到密封外壳中的端部。 底座设置在基座安装面上。 低电感结构与底座一体地形成，并且包括介于第一和第二引线之间的电介质体。 主体包括与设置在底座上的导电迹线电连通的成形边缘和导电焊盘结构。 每个焊盘结构还经由多个引线键与第一和第二信号引线中的相应一个电连通。

公开(公告)号：US20070289764A1

公开(公告)日：2007-12-20

申请号：US11740781

申请日：2007-04-26

Applicant: Darin James Douma ,  The Linh Nguyen ,  Hongyu Deng ,  Martin Kalberer ,  Maziar Amirkiai

Inventor： Darin James Douma ,  The Linh Nguyen ,  Hongyu Deng ,  Martin Kalberer ,  Maziar Amirkiai

IPC: H05K9/00

CPC classification number: G02B6/4201 ,  G02B6/4279 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01S5/02212 ,  H01S5/02248 ,  H01S5/02284 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A low inductance structure for improving the integrity of data signals carried in an optical subassembly is disclosed. In one embodiment the optical subassembly comprises a housing containing a lens assembly and an optical isolator. The optical subassembly further includes an optoelectronic package having a base defining a mounting surface that cooperates with a cap to define a hermetic enclosure. First and second signal leads of the subassembly include ends that extend into the hermetic enclosure. A submount is disposed on the base mounting surface. A low inductance structure is integrally formed with the submount and includes a dielectric body interposed between the first and second leads. The body includes shaped edges and conductive pad structures in electrical communication with conductive traces disposed on the submount. Each pad structure is also in electrical communication with a respective one of the first and second signal leads via a plurality of wirebonds.

Abstract translation: 公开了一种用于改善在光学子组件中携带的数据信号的完整性的低电感结构。 在一个实施例中，光学子组件包括容纳透镜组件和光隔离器的壳体。 光学子组件还包括光电封装，其具有限定与盖配合以限定密封外壳的安装表面的基座。 子组件的第一和第二信号引线包括延伸到密封外壳中的端部。 底座设置在基座安装面上。 低电感结构与底座一体地形成，并且包括介于第一和第二引线之间的电介质体。 主体包括与设置在底座上的导电迹线电连通的成形边缘和导电焊盘结构。 每个焊盘结构还经由多个引线键与第一和第二信号引线中的相应一个电连通。