公开(公告)号：US20090159912A1

公开(公告)日：2009-06-25

申请号：US12162161

申请日：2007-01-24

Applicant: Moritz Engl ,  Joachim Reill ,  Martin Wüller ,  Lukas Schwenkschuster

Inventor： Moritz Engl ,  Joachim Reill ,  Martin Wüller ,  Lukas Schwenkschuster

IPC: H01L33/00

CPC classification number: H01L33/58 ,  F21S41/14 ,  F21S41/16 ,  F21Y2115/10 ,  H01L33/505 ,  H01L51/5271 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/00

Abstract: What is specified is a housing for a luminescence diode component comprising a housing cavity within which is arranged at least one chip mounting region for a luminescence diode chip and which has an output opening. In accordance with one embodiment, the housing has, at least at a vertical distance from the chip mounting region, inner walls which laterally bound the housing cavity and are at a maximum lateral distance of less than or equal to 500 μm from the chip mounting region. What is additionally specified is a housing in which the housing cavity has at least one partial region which is laterally covered by a housing material that laterally delimits the housing cavity. Moreover, a description is given of a luminescence diode component, in particular for a motor vehicle headlight.

Abstract translation: 指定的是用于发光二极管部件的壳体，其包括壳体腔体，其中布置有用于发光二极管芯片的至少一个芯片安装区域，并具有输出开口。 根据一个实施例，壳体至少在与芯片安装区域垂直的距离处具有横向地限定壳体腔体并且处于与芯片安装区域小于或等于500μm的最大横向距离的内壁 。 额外规定的是壳体，其中壳体空腔具有至少一个部分区域，该局部区域由横向限定壳体空腔的壳体材料横向覆盖。 此外，给出了发光二极管部件的描述，特别是用于机动车辆前灯。

公开(公告)号：US07679100B2

公开(公告)日：2010-03-16

申请号：US11526550

申请日：2006-09-25

Applicant: Lukas Schwenkschuster ,  Martin Wüller ,  Joachim Reill ,  Moritz Engl

Inventor： Lukas Schwenkschuster ,  Martin Wüller ,  Joachim Reill ,  Moritz Engl

IPC: H01L33/00

CPC classification number: H01L33/60 ,  F21K9/00 ,  F21S41/141 ,  F21Y2115/10 ,  H01L33/44 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A housing for an electromagnetic radiation emitting optoelectronic component is specified. The housing comprises a housing base body provided with a recess in which at least one chip mounting surface is disposed. At least one outer surface of the housing base body, disposed on an emission side of the housing and adjoining the recess, is provided with a baffle layer suitable for screening an electromagnetic radiation. An electromagnetic radiation emitting component provided with such a housing and a method of making a corresponding housing or component are also specified.

Abstract translation: 规定了用于电磁辐射发射光电子部件的外壳。 壳体包括设置有凹部的壳体基体，其中设置有至少一个芯片安装表面。 壳体基体的至少一个外表面设置在壳体的发射侧并且邻接凹部，设置有适于屏蔽电磁辐射的挡板层。 还规定了设置有这种壳体的电磁辐射发射部件和制造相应壳体或部件的方法。