Prepreg, metal-clad laminate, and printed circuit board obtained from these
    1.
    发明授权
    Prepreg, metal-clad laminate, and printed circuit board obtained from these 有权
    预浸料,覆金属层压板和由这些得到的印刷电路板

    公开(公告)号:US06524717B1

    公开(公告)日:2003-02-25

    申请号:US09913726

    申请日:2001-08-17

    IPC分类号: B32B1508

    摘要: This invention relates to a prepreg which comprises a substrate and a resin composition containing a resin, an inorganic filler in an amount of 25% by volume based on the total volume of a solid component of the resin composition and a silicone polymer, which resin composition being impregnated into the substrate, and to a metal-clad-laminated board which comprises at least one metal foil being laminated on both surfaces or one surface of the prepreg mentioned above, or a laminated board of the prepregs under heating and pressure.

    摘要翻译: 本发明涉及一种预浸料,其包括基材和含有树脂的树脂组合物,相对于树脂组合物的固体成分的总体积为25体积%的无机填料和硅氧烷聚合物,该树脂组合物 浸渍在基材中,以及包含层叠在上述预浸料坯的两面或一个表面上的至少一层金属箔的金属包覆层压板或加热和压力下的预浸料坯的层压板。