公开(公告)号：US20240262738A1

公开(公告)日：2024-08-08

申请号：US18638458

申请日：2024-04-17

Applicant: Schott Japan Corporation

Inventor： Yutaka ONEZAWA ,  Akira OKUNO ,  Kazuhito MIYAWAKI

IPC: C03C4/00 ,  H01L23/06 ,  H01L23/08 ,  H01L23/15 ,  H01L23/28 ,  H01L23/498 ,  H05K1/11

CPC classification number: C03C4/0007 ,  H01L23/15 ,  H01L23/49827 ,  H05K1/113 ,  H01L23/06 ,  H01L23/08 ,  H01L23/28 ,  H05K2201/0162 ,  H05K2201/095

Abstract: A biocompatible glass substrate with through electrodes includes a glass plate of a biocompatible glass, and through electrodes made of a biocompatible metal that are provided by penetrating the glass plate. A biocompatible electronic device using this is the biocompatible electronic device including a biocompatible glass substrate with through electrode having a glass plate of a biocompatible glass, and through electrodes made of a biocompatible metal provided by penetrating the glass plate, and an electric/electronic device sealed onto the above described glass plate and is electrically connected to the above described through electrodes, and has bumps for connection on the through electrodes of the biocompatible electronic device.

公开(公告)号：US20180188851A1

公开(公告)日：2018-07-05

申请号：US15857355

申请日：2017-12-28

Applicant: LG Display Co., Ltd.

Inventor： Suk CHOI

IPC: G06F3/044 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/28 ,  G06F3/047

CPC classification number: G06F3/044 ,  G06F3/047 ,  G06F2203/04102 ,  G06F2203/04103 ,  H05K1/0283 ,  H05K1/0313 ,  H05K3/0014 ,  H05K3/107 ,  H05K3/28 ,  H05K2201/0108 ,  H05K2201/0162 ,  H05K2201/0195 ,  H05K2201/026 ,  H05K2201/09036

Abstract: Disclosed are a stretchable touchscreen, a method for manufacturing the same and a display device including the same. After using a material having a high elastic restoring force as a substrate and determining regions where touch electrodes are formed by defining grooves thereon, touch electrodes are formed by filling the grooves with nanowires. Accordingly, it is possible to maintain elastic restoring force of the substrate and electrical connection between wires of nanowires, so that the touch electrode neither breaks nor factures despite being stretched any direction, and reliable stretchable touchscreens can be provided due to no resistance increase.

公开(公告)号：US20180134847A1

公开(公告)日：2018-05-17

申请号：US15654058

申请日：2017-07-19

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Kuei-Yi CHUANG ,  Feng-Po TSENG ,  Kuo-Chan CHIOU

IPC: C08G73/10 ,  H01B3/30 ,  H05K1/03 ,  C08K5/5415 ,  C08K5/5455 ,  H01B3/40 ,  B32B27/20

CPC classification number: C08G73/106 ,  B32B27/20 ,  B32B2307/3065 ,  C08K5/5415 ,  C08K5/5455 ,  H01B3/306 ,  H01B3/40 ,  H05K1/024 ,  H05K1/0346 ,  H05K1/0353 ,  H05K2201/0154 ,  H05K2201/0162

Abstract: A polymer is provided. The polymer includes a first repeating unit represented by Formula (I) and a second repeating unit represented by Formula (II): wherein Y1 and Y2 are independently —H, —CH3, or —CH2CH3; n is an integer ranging from 1 to 25; and the molar ratio of the first repeating unit to the second repeating unit is from 5:95 to 15:45. A resin composition including the aforementioned polymer is also provided.

公开(公告)号：US09765236B2

公开(公告)日：2017-09-19

申请号：US14208388

申请日：2014-03-13

Applicant: ELANTAS GmbH

Inventor： Kim Bastian Bebenroth ,  Andreas Steinmann ,  Gerold Schmidt

IPC: C09D183/04 ,  H05K3/46 ,  H05K3/28 ,  C08L83/04 ,  H05K1/03

CPC classification number: C09D183/04 ,  C08K3/36 ,  C08K5/005 ,  C08K5/05 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H05K1/0326 ,  H05K3/285 ,  H05K3/46 ,  H05K2201/0162 ,  H05K2201/09827 ,  Y10T428/31663

Abstract: One-component, solvent-free organosiloxane composition comprising a) a linear or branched polyorganosiloxane containing at least two alkenyl or alkynyl groups, as component A; b) a linear or branched polyorganosiloxane containing at least 3 Si—H groups, as component B; c) a hydrosilylation catalyst as component C; d) an alkynol of the general formula (I) wherein R1, R2, R3 are selected independently of one another from H, C1-C6-alkyl and substituted or unsubstituted C3-C6-alkyl; or R1 is selected from H, C1-C6-alkyl and substituted or unsubstituted C3-C6-cycloalkyl, and R2, R3 are bonded together and form a 3- to 8-membered ring which can be substituted by one or more C1-C3-alkyl groups, as component D; and e) a fumed silica as component E.

公开(公告)号：US09763326B1

公开(公告)日：2017-09-12

申请号：US14304029

申请日：2014-06-13

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed

IPC: H05K1/11 ,  H05K1/03 ,  A41D1/00 ,  H05K3/30

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. The electrically conductive wire braid is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire braid.

公开(公告)号：US20170199324A1

公开(公告)日：2017-07-13

申请号：US15473035

申请日：2017-03-29

Applicant: Funai Electric Co., Ltd.

Inventor： Akira YOKAWA ,  Yuki KITA ,  Akihiro FUJIKAWA ,  Yasuyuki FUKUMOTO ,  Yasuhiro MORI ,  Yuto SUZUKI ,  Hirofumi HORIUCHI ,  Hirohiko TSUJI ,  Takahito YAMANAKA ,  Hideo YONEZAWA

IPC: F21V8/00

CPC classification number: G02B6/0088 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0085 ,  G02F1/133615 ,  G02F2001/133314 ,  G02F2001/133317 ,  G02F2001/133328 ,  G02F2001/133628 ,  G06F1/20 ,  H05K1/0209 ,  H05K7/20963 ,  H05K2201/0162 ,  H05K2201/09909

Abstract: This display includes a light source portion, a first heat radiation member for radiating heat generated by the light source portion, a rear housing covering the first heat radiation member in a state in contact with the first heat radiation member, and a cover member covering a rear surface of the rear housing so that the rear surface of the rear housing is partially exposed outward. The first heat radiation member is arranged on a region corresponding to a region of the rear housing exposed outward from the cover member as viewed from the side of the rear surface.

公开(公告)号：US20170086312A1

公开(公告)日：2017-03-23

申请号：US15268373

申请日：2016-09-16

Applicant: Syed Taymur Ahmad ,  Bruce Acton

Inventor： Syed Taymur Ahmad ,  Bruce Acton

IPC: H05K5/00 ,  G06F1/16 ,  H04B1/3888 ,  H05K3/28

CPC classification number: H04B1/3888 ,  G06F1/1616 ,  G06F1/1626 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1366

Abstract: Methods for protecting an electronic device from contaminants by applying different polymeric materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying an electrically insulating polymer, such as an acrylic-based polymer, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a polymer capable of carrying a charge, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with a different polymers. Electronic devices that are protected by such polymeric, hydrophobic coatings are also disclosed, such as smart phones, computers, and gaming devices.

公开(公告)号：US20170039984A1

公开(公告)日：2017-02-09

申请号：US15185279

申请日：2016-06-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Yong JOO ,  Jin Hyung LEE

IPC: G09G5/00 ,  H02M1/42 ,  H02M3/335

CPC classification number: G09G5/00 ,  G06F3/147 ,  G09G2330/02 ,  G09G2330/04 ,  H02M1/4225 ,  H02M3/33553 ,  H02M2001/007 ,  H05K1/0256 ,  H05K3/28 ,  H05K2201/0162 ,  H05K2201/0761 ,  H05K2201/09909 ,  Y02B70/126

Abstract: A power supply device of an electronic apparatus includes: a power input portion configured to receive alternating current (AC) power; a rectifier-smoother configured to rectify and smooth the received AC power and output the AC power; a power converter configured to convert a level of a voltage output from the rectifier-smoother to supply operating power to the electronic apparatus; a board on which the power input portion, the rectifier-smoother, and the power converter are provided; and a waterproof coating layer formed in an area on the board corresponding to a position of the power converter to prevent infiltration of moisture from an outside.

Abstract translation: 电子设备的电源装置包括：电力输入部，被配置为接收交流电（AC）电力; 整流器平滑器，被配置为整流和平滑所接收的AC电力并输出AC电力; 电力转换器，被配置为将从整流器平滑器输出的电压的电平转换为向电子设备提供工作电力; 设置有电力输入部，整流器平滑器和功率转换器的电路板; 以及防水涂层，其形成在与所述功率转换器的位置对应的板上的区域中，以防止水分从外部渗入。

公开(公告)号：US09554465B1

公开(公告)日：2017-01-24

申请号：US14593849

申请日：2015-01-09

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Dick Pang ,  Murad Kurwa

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/092 ,  H05K1/0283 ,  H05K1/03 ,  H05K1/0393 ,  H05K1/147 ,  H05K1/183 ,  H05K3/285 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/09218 ,  H05K2201/09227 ,  H05K2201/09263 ,  H05K2201/09281

Abstract: A stretchable interconnect includes a plurality of electrically conductive traces formed as a complex pattern on an elastic substrate. The form of the electrically conductive traces is such that when the elastic substrate is in a relaxed, or non-stretched, state each of the electrically conductive traces forms a tortuous path, such as a waveform, along the elastic substrate. The tortuous path of the electrically conductive traces provides slack such that as the elastic substrate is stretched the slack is taken up. Once released, the elastic substrate moves from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the electrically conductive traces in the form of the original tortuous path.

Abstract translation: 可拉伸互连件包括在弹性基底上形成为复合图案的多个导电迹线。 导电迹线的形式使得当弹性基底处于松弛或非拉伸状态时，每个导电迹线沿着弹性基底形成诸如波形的曲折路径。 导电迹线的弯曲路径提供松弛，使得当弹性基底被拉伸时松弛松弛。 一旦释放，弹性基板从拉伸位置移动到松弛的非拉伸位置，并且以原始曲折路径的形式将松弛重新引入导电迹线。

公开(公告)号：US20170006701A1

公开(公告)日：2017-01-05

申请号：US15125573

申请日：2014-03-11

Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLC

Inventor： Vincenzo CASASANTA, III

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H05K3/12 ,  C08J5/04 ,  B32B5/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/22 ,  B32B27/36 ,  C08J5/00 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K1/0366 ,  B32B3/266 ,  B32B5/02 ,  B32B5/08 ,  B32B5/12 ,  B32B5/22 ,  B32B5/26 ,  B32B9/02 ,  B32B9/04 ,  B32B25/02 ,  B32B25/042 ,  B32B25/08 ,  B32B27/08 ,  B32B27/18 ,  B32B27/22 ,  B32B27/28 ,  B32B27/281 ,  B32B27/283 ,  B32B27/285 ,  B32B27/286 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B27/42 ,  B32B2260/021 ,  B32B2260/04 ,  B32B2260/046 ,  B32B2262/04 ,  B32B2262/062 ,  B32B2262/065 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2262/14 ,  B32B2264/0278 ,  B32B2264/105 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/546 ,  B32B2307/7163 ,  B32B2307/75 ,  B32B2457/08 ,  C08J5/005 ,  C08J5/041 ,  C08J2367/04 ,  C08K3/08 ,  C08K2003/0806 ,  H05K1/0353 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/097 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0011 ,  H05K3/1216 ,  H05K3/1241 ,  H05K3/125 ,  H05K3/1275 ,  H05K3/22 ,  H05K3/4038 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/0162 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0269 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0271 ,  H05K2203/0769 ,  H05K2203/1105 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  C08L67/04

Abstract: Biodegradable printed circuit boards, or PCBs, may be produced from substrate sheets that include at least one biodegradable polymer. In addition, the electrical traces used on the PCBs, may also include a biodegradable polymer incorporated with an electrically conductive material. The PCBs may be composted to degrade the PCBs, and the

Abstract translation: 可生物降解的印刷电路板或PCB可以由包括至少一种可生物降解的聚合物的基材片制成。 另外，PCB上使用的电迹线也可以包括结合有导电材料的可生物降解的聚合物。 PCB可能被堆肥以降解PCBs