Conductive paste and ceramic electronic part including the same
    4.
    发明授权
    Conductive paste and ceramic electronic part including the same 有权
    导电胶和陶瓷电子部件包括相同

    公开(公告)号:US06198618B1

    公开(公告)日:2001-03-06

    申请号:US09314382

    申请日:1999-05-19

    IPC分类号: H01G4228

    CPC分类号: H01G4/232 C03C8/18

    摘要: Provided is a conductive paste, including a metal powder, glass frit and SiO2 dispersed in an organic vehicle in which the compounding ratio of SiO2 is in the range of 0.3 to 1.5% by weight. The conductive paste can prevent scattering of a solder plating film formed on a thick film electrode during surface mounting of a ceramic electronic part including a thick film electrode (an external electrode) which is formed by coating the ceramic electronic part with the conductive paste and baking.

    摘要翻译: 提供了一种导电膏,其包括分散在有机载体中的金属粉末,玻璃料和SiO 2,其中SiO 2的配混比在0.3至1.5重量%的范围内。 导电糊剂可以防止在包括通过用导电浆料涂覆陶瓷电子部件并烘烤而形成的厚膜电极(外部电极)的陶瓷电子部件的表面安装期间形成在厚膜电极上的焊料镀覆膜的散射 。

    Conducting thick film composition, thick film electrode, ceramic
electronic component and laminated ceramic capacitor
    6.
    发明授权
    Conducting thick film composition, thick film electrode, ceramic electronic component and laminated ceramic capacitor 失效
    传导厚膜组合物,厚膜电极,陶瓷电子元件和层压陶瓷电容器

    公开(公告)号:US5781402A

    公开(公告)日:1998-07-14

    申请号:US578105

    申请日:1995-12-26

    摘要: A conducting thick film composition, a thick film electrode made by sintering this composition, and a ceramic electronic component and a laminated ceramic capacitor in which this thick film electrode is used of which the electrical reliability are improved by the strength of the bond between the ceramic substrate and a thick film electrode being increased by the elimination of blistering and cracking of the electrode during sintering of the composition and the adherence of solder to the electrode being improved by the elimination of glass separation out onto the surface of the electrode during sintering. The conducting thick film composition comprises Cu powder, glass powder and an organic vehicle, the Cu powder comprises spherical powder and scaly powder and the glass powder comprises borosilicate zinc glass and borosilicate barium glass.

    摘要翻译: 导电厚膜组合物,通过烧结该组合物制成的厚膜电极以及陶瓷电子部件和层叠陶瓷电容器,其中使用该厚膜电极,通过陶瓷之间的结合强度提高电可靠性 通过在烧结期间消除电极的起泡和破裂,并且通过在烧结期间消除在电极表面上的玻璃分离来改善焊料对电极的粘附,从而提高了衬底和厚膜电极。 导电厚膜组合物包括Cu粉末,玻璃粉末和有机载体,Cu粉末包含球形粉末和鳞片状粉末,玻璃粉末包含硼硅酸锌玻璃和硼硅酸钡玻璃。