Semiconductor integrated circuit device
    1.
    发明授权
    Semiconductor integrated circuit device 有权
    半导体集成电路器件

    公开(公告)号:US07190593B2

    公开(公告)日:2007-03-13

    申请号:US10022732

    申请日:2001-12-20

    IPC分类号: H05K7/10 H05K7/12

    摘要: A semiconductor integrated circuit device is provided in which (i) inspection pads are arranged along one side or two opposite sides of the semiconductor integrated circuit device for bonding pads arranged along the sides other than the side or the two opposite sides and (ii) the bonding pads are connected to their respective inspection pads by connection wires The inspection is carried out by applying probe needles to the pads (inspection pads and bonding pads) arranged only along one side or two opposite sides of the semiconductor integrated circuit device. The invention also provides a semiconductor integrated circuit package with leads on four sides includes a semiconductor integrated circuit device with bonding pads laid along one pair of opposite sides of the four sides, and a table for supporting the semiconductor integrated circuit device. While the bonding pads along the pair of opposite sides of the semiconductor integrated circuit device are connected with leads along the four sides of the package, and some leads are bent toward the respective pads. The present invention the inspection of a plurality of semiconductor integrated circuit devices with probe needles at a time.

    摘要翻译: 提供了一种半导体集成电路器件,其中(i)检查焊盘沿着半导体集成电路器件的一侧或两个相对侧布置,用于沿着除了侧面或两个相对侧之外的侧面布置的焊盘,以及(ii) 接合焊盘通过连接线连接到它们各自的检查焊盘。通过将探针施加到仅沿着半导体集成电路器件的一侧或两个相对侧布置的焊盘(检查焊盘和焊盘)来进行检查。 本发明还提供了一种半导体集成电路封装,其四边具有引线,包括具有沿四个侧面的一对相对侧布置的接合焊盘的半导体集成电路器件,以及用于支撑半导体集成电路器件的工作台。 虽然沿着半导体集成电路器件的这对相对侧的接合焊盘沿着封装的四边与引线连接,并且一些引线朝着相应的焊盘弯曲。 本发明一次检测具有探针的多个半导体集成电路器件。