摘要:
A data transmission method includes a step of dividing each data into two or more low-speed data so as to create two or more sequences of low-speed data which are separated by no-signal intervals, a step of adding a fixed pattern for detecting a head or an end of each low-speed data included in each of the two or more sequences of low-speed data to each of the no-signal intervals included in each of the two or more sequences of low-speed data so as to create two or more sequences of fixed-pattern-added low-speed data, and a step of transmitting the two or more sequences of fixed-pattern-added low-speed data to the transmit station connected to the other network.
摘要:
An RFID tag is characterized in that it includes: a dielectric substrate; a ground conductor portion disposed on one main surface of this dielectric substrate; a patch conductor portion disposed on another main surface of the above-mentioned dielectric substrate and forming a slot; electrical connecting portions internally extending from opposing sides of the above-mentioned slot, respectively; and an IC chip placed in the above-mentioned slot and connected to the above-mentioned electrical connecting portions.
摘要:
A data transmission method includes a step of dividing each data into two or more low-speed data so as to create two or more sequences of low-speed data which are separated by no-signal intervals, a step of adding a fixed pattern for detecting a head or an end of each low-speed data included in each of the two or more sequences of low-speed data to each of the no-signal intervals included in each of the two or more sequences of low-speed data so as to create two or more sequences of fixed-pattern-added low-speed data, and a step of transmitting the two or more sequences of fixed-pattern-added low-speed data to the transmit station connected to the other network.
摘要:
An RFID tag is characterized in that it includes: a dielectric substrate; a ground conductor portion disposed on one main surface of this dielectric substrate; a patch conductor portion disposed on another main surface of the above-mentioned dielectric substrate and forming a slot; electrical connecting portions internally extending from opposing sides of the above-mentioned slot, respectively; and an IC chip placed in the above-mentioned slot and connected to the above-mentioned electrical connecting portions.