公开(公告)号：US20070241440A1

公开(公告)日：2007-10-18

申请号：US11499285

申请日：2006-08-04

Applicant: Dinhphuoc Hoang ,  Thomas Noll ,  Anil Agarwal ,  Robert Warren ,  Matthew Read ,  Anthony LoBianco

Inventor： Dinhphuoc Hoang ,  Thomas Noll ,  Anil Agarwal ,  Robert Warren ,  Matthew Read ,  Anthony LoBianco

IPC: H01L23/49

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

Abstract translation: 根据一个示例性实施例，包覆成型的包装包括位于基底上的部件。 包覆成型的包装进一步包括位于组件和衬底之上的包覆成型。 包覆成型的包装还包括位于衬底上方和覆盖模制件中的引线键合框架，其中引线键合框架围绕组件，并且其中引线键合框架包括多个引线键。 引线键盘在组件周围形成EMI屏蔽。 根据该示例性实施例，包覆成型的封装还包括位于包覆模制体的顶表面上并连接到引线键合框架的导电层，其中导电层在部件上形成EMI屏蔽。

公开(公告)号：USD576515S1

公开(公告)日：2008-09-09

申请号：US29283988

申请日：2007-08-28

Applicant: Steven Matthew Read

Designer： Steven Matthew Read

公开(公告)号：USD522914S1

公开(公告)日：2006-06-13

申请号：US29215307

申请日：2004-10-18

Applicant: Steven Matthew Read

Designer： Steven Matthew Read