公开(公告)号：US20110155708A1

公开(公告)日：2011-06-30

申请号：US12988883

申请日：2009-05-28

Applicant: Matthias Luetke ,  Lothar Morgenthal ,  Thomas Himmer ,  Eckhard Beyer

Inventor： Matthias Luetke ,  Lothar Morgenthal ,  Thomas Himmer ,  Eckhard Beyer

IPC: B23K26/00

CPC classification number: B23K26/402 ,  B23K2103/40 ,  B23K2103/42 ,  B23K2103/50

Abstract: A method is for cutting machining of a workpiece using a laser beam. The method includes (a) directing the focused laser beam onto a surface of the workpiece for a formation of a kerf; and (b) removing a material exclusively by ablation. The laser beam has a power density in a focal point of at least 1*107 W/cm2. The laser beam has a feed speed taking account of an absorption capability of the material to be removed of at least 150 m/min up to a maximum of 1200 m/min.

Abstract translation: 一种用于使用激光束切割加工工件的方法。 该方法包括（a）将聚焦的激光束引导到工件的表面上以形成切口; 和（b）仅通过消融去除材料。 激光束的焦点功率密度至少为1×10 7 W / cm 2。 激光束的进给速度考虑到要去除的材料的吸收能力至少为150m / min，最高达1200m / min。

公开(公告)号：US09522442B2

公开(公告)日：2016-12-20

申请号：US12988883

申请日：2009-05-28

Applicant: Matthias Luetke ,  Lothar Morgenthal ,  Thomas Himmer ,  Eckhard Beyer

Inventor： Matthias Luetke ,  Lothar Morgenthal ,  Thomas Himmer ,  Eckhard Beyer

IPC: B23K26/00 ,  B23K26/08 ,  B23K26/40

CPC classification number: B23K26/402 ,  B23K2103/40 ,  B23K2103/42 ,  B23K2103/50

Abstract: A method is for cutting machining of a workpiece using a laser beam. The method includes (a) directing the focused laser beam onto a surface of the workpiece for a formation of a kerf; and (b) removing a material exclusively by ablation. The laser beam has a power density in a focal point of at least 1*107 W/cm2. The laser beam has a feed speed taking account of an absorption capability of the material to be removed of at least 150 m/min up to a maximum of 1200 m/min.

Abstract translation: 一种用于使用激光束切割加工工件的方法。 该方法包括（a）将聚焦的激光束引导到工件的表面上以形成切口; 和（b）仅通过消融去除材料。 激光束的焦点功率密度至少为1×10 7 W / cm 2。 激光束的进给速度考虑到要去除的材料的吸收能力至少为150m / min，最高达1200m / min。