公开(公告)号：US06356653B2

公开(公告)日：2002-03-12

申请号：US09116680

申请日：1998-07-16

申请人： Jeffrey A. Brigante ,  Glenn W. Gale ,  Maurice R. Hevey ,  Frederick W. Kern, Jr. ,  Ben Kim ,  Joel M. Sharrow ,  William A. Syverson

发明人： Jeffrey A. Brigante ,  Glenn W. Gale ,  Maurice R. Hevey ,  Frederick W. Kern, Jr. ,  Ben Kim ,  Joel M. Sharrow ,  William A. Syverson

IPC分类号： G06K900

CPC分类号： H01L22/20 ,  H01L21/268

摘要： A method for removing one or more particles from a surface of an object is provided. The method has first and second steps of detecting and locating the one or more particles on the surface of the object. In a third step, focused energy is directed onto one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface. In preferred variations of the method of the present invention, the object is a semiconductor wafer and the directed focused energy is in the form of a laser. Also provided is an apparatus for removing the plurality of particles from the surface of the object. The apparatus includes a detector for detecting and locating the plurality of particles on the surface of the object, and a laser for directing focused energy on one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface.

摘要翻译： 提供了从物体表面去除一个或多个颗粒的方法。 该方法具有检测和定位物体表面上的一个或多个颗粒的第一和第二步骤。 在第三步骤中，将聚焦的能量引导到一个或多个检测到的颗粒上以破坏一个或多个颗粒与表面之间的键能，从而从表面除去一个或多个颗粒。 在本发明方法的优选变型中，目的是半导体晶片，并且定向的聚焦能是激光的形式。 还提供了用于从物体的表面去除多个颗粒的装置。 该装置包括用于检测和定位物体表面上的多个颗粒的检测器和用于将聚焦能量引导到一个或多个检测到的颗粒上的激光器，以破坏一个或多个颗粒与表面之间的结合能，由此 从表面去除一个或多个颗粒。