公开(公告)号：US07531059B2

公开(公告)日：2009-05-12

申请号：US10798816

申请日：2004-03-10

申请人： Nicole S Carpenter ,  Joseph R Drennan ,  Alison K Easton ,  Casey J Grant ,  Andrew S Hoadley ,  Kenneth F McAvey, Jr. ,  Joel M Sharrow ,  William A Syverson ,  Kenneth H Yao

发明人： Nicole S Carpenter ,  Joseph R Drennan ,  Alison K Easton ,  Casey J Grant ,  Andrew S Hoadley ,  Kenneth F McAvey, Jr. ,  Joel M Sharrow ,  William A Syverson ,  Kenneth H Yao

IPC分类号： H01L21/00 ,  C23C16/00 ,  C23C14/00

CPC分类号： B08B7/0014

摘要： An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.

摘要翻译： 提供了用于从诸如半导体晶片的衬底表面去除污染颗粒物质的装置和方法。 该方法和装置使用材料，优选液体可固化聚合物，其作为牺牲涂层施加到其上含有污染颗粒物质的基材的表面上。 使用能量源将污染颗粒物质从晶片的表面移走到牺牲涂层中，使得颗粒被部分或完全包封并悬浮在牺牲涂层中。 然后去除牺牲涂层。 涂层优选形成薄膜以通过拉（剥离）提供更清洁的基底表面的薄膜来去除涂层。

公开(公告)号：US06670283B2

公开(公告)日：2003-12-30

申请号：US09989389

申请日：2001-11-20

申请人： Faye D. Baker ,  Casey J. Grant ,  Mousa H. Ishaq ,  Joel M. Sharrow ,  James D. Weil

发明人： Faye D. Baker ,  Casey J. Grant ,  Mousa H. Ishaq ,  Joel M. Sharrow ,  James D. Weil

IPC分类号： H01L2131

CPC分类号： H01L21/02164 ,  H01L21/02115 ,  H01L21/0217 ,  H01L21/022 ,  H01L21/02271 ,  H01L21/02274 ,  H01L21/31612

摘要： Disclosed is a method of fabricating a semiconductor device, comprising: (a) providing a bare semiconductor substrate, the substrate having a frontside and a backside; (b) forming one or more protective films on the backside of the substrate; and (c) performing one or more wafer fabrication steps. Some or all the protective films may be removed and the method repeated multiple times during fabrication of the semiconductor device.

摘要翻译： 公开了一种制造半导体器件的方法，包括：（a）提供裸半导体衬底，所述衬底具有前侧和后侧; （b）在衬底的背面形成一个或多个保护膜; 和（c）执行一个或多个晶片制造步骤。 可以去除一些或全部保护膜，并且在制造半导体器件期间该方法重复多次。

公开(公告)号：US06340601B1

公开(公告)日：2002-01-22

申请号：US09476237

申请日：1999-12-30

申请人： Thomas F. Curran, Jr. ,  Timothy C. Krywanczyk ,  Michael S. Lube ,  Matthew D. Moon ,  Rock Nadeau ,  Clark D. Reynolds ,  Dean A. Schaffer ,  Joel M. Sharrow ,  Paul H. Smith, Jr. ,  David C. Thomas ,  Eric J. White ,  Kenneth H. Yao

发明人： Thomas F. Curran, Jr. ,  Timothy C. Krywanczyk ,  Michael S. Lube ,  Matthew D. Moon ,  Rock Nadeau ,  Clark D. Reynolds ,  Dean A. Schaffer ,  Joel M. Sharrow ,  Paul H. Smith, Jr. ,  David C. Thomas ,  Eric J. White ,  Kenneth H. Yao

IPC分类号： H01L214763

CPC分类号： H01L21/76892

摘要： A method of reworking copper metallurgy on semiconductor devices which includes selective removal of insulator, selective removal of copper, non-selective removal of copper and insulator followed by the redeposition of an insulating copper barrier layer and at least one metallurgical interconnect layer.

摘要翻译： 一种对半导体器件上的铜冶炼进行再加工的方法，包括绝缘体的选择性去除，铜的选择性去除，铜和绝缘体的非选择性去除，然后再沉积绝缘铜阻挡层和至少一个冶金互连层。

公开(公告)号：US06776171B2

公开(公告)日：2004-08-17

申请号：US09892954

申请日：2001-06-27

申请人： Nicole S. Carpenter ,  Joseph R. Drennan ,  Alison K. Easton ,  Casey J. Grant ,  Andrew S. Hoadley ,  Kenneth F. McAvey, Jr. ,  Joel M. Sharrow ,  William A. Syverson ,  Kenneth H. Yao

发明人： Nicole S. Carpenter ,  Joseph R. Drennan ,  Alison K. Easton ,  Casey J. Grant ,  Andrew S. Hoadley ,  Kenneth F. McAvey, Jr. ,  Joel M. Sharrow ,  William A. Syverson ,  Kenneth H. Yao

IPC分类号： B08B700

CPC分类号： B08B7/0014

摘要： An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.

公开(公告)号：US06992014B2

公开(公告)日：2006-01-31

申请号：US10065720

申请日：2002-11-13

申请人： Casey J. Grant ,  Joel M. Sharrow ,  John J. Snyder

发明人： Casey J. Grant ,  Joel M. Sharrow ,  John J. Snyder

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/67253 ,  H01L21/31111

摘要： A method for controlling a process on a substrate. The method comprising: providing the substrate, the substrate having an upper surface, an opposite lower surface and an edge between the upper and lower surfaces; processing the upper surface of the substrate with a first fluid; directing a second fluid against a portion of the lower surface proximate to the edge of the substrate, wherein the second fluid flows adjacent to the edge of the substrate; and controlling the temperature of the second fluid in order to affect a processing of an edge region of the upper side of the substrate.

摘要翻译： 一种用于控制衬底上的工艺的方法。 所述方法包括：提供所述基底，所述基底具有上表面，相对的下表面和所述上表面和所述下表面之间的边缘; 用第一流体处理衬底的上表面; 将第二流体引导靠近所述基底的边缘的所述下表面的一部分，其中所述第二流体邻近所述基底的边缘流动; 以及控制第二流体的温度，以便影响衬底的上侧的边缘区域的处理。

公开(公告)号：US06884722B2

公开(公告)日：2005-04-26

申请号：US09964918

申请日：2001-09-27

申请人： Casey J. Grant ,  Robert K. Leidy ,  Joel M. Sharrow

发明人： Casey J. Grant ,  Robert K. Leidy ,  Joel M. Sharrow

IPC分类号： H01L21/28 ,  H01L21/3213 ,  H01L21/336 ,  H01L21/302

CPC分类号： H01L29/6659 ,  H01L21/28114 ,  H01L21/32134 ,  H01L21/32139

摘要： Disclosed is a method of fabricating a polysilicon line, comprising: forming a patterned hard mask layer over a polysilicon layer; patterning the polysilicon layer to provide a hard mask-capped polysilicon line having a first width; and isotropically removing portions of the polysilicon line to a second width.

摘要翻译： 公开了一种制造多晶硅线的方法，包括：在多晶硅层上形成图案化的硬掩模层; 图案化多晶硅层以提供具有第一宽度的硬掩模帽多晶硅线; 并且将多晶硅线的各向同性地去除到第二宽度。

公开(公告)号：US06939408B1

公开(公告)日：2005-09-06

申请号：US09650103

申请日：2000-08-29

申请人： Francis A. Abramovich ,  Nicole S. Carpenter ,  Joseph R. Drennan ,  Rick H. Gaylord ,  Casey J. Grant ,  Kenneth F. McAvey, Jr. ,  Mark A. Pakulski ,  Joel M. Sharrow ,  William A. Syverson ,  Alison K. Easton ,  Kenneth H. Yao

发明人： Francis A. Abramovich ,  Nicole S. Carpenter ,  Joseph R. Drennan ,  Rick H. Gaylord ,  Casey J. Grant ,  Kenneth F. McAvey, Jr. ,  Mark A. Pakulski ,  Joel M. Sharrow ,  William A. Syverson ,  Alison K. Easton ,  Kenneth H. Yao

IPC分类号： B08B3/00 ,  B08B3/08 ,  H01L21/00 ,  H01L21/306

CPC分类号： H01L21/02052 ,  B08B3/08 ,  H01L21/02019 ,  H01L21/30604 ,  H01L21/67086 ,  Y10S134/902

摘要： A method for preparing a workpiece surface utilizing two more fluids of differing density and miscibility which create one or more fluid interfaces wherein the fluids are chosen such that the solubility or affinity of one of the fluids is high for a material to be removed from the workpiece surface while the other fluid has a low solubility or affinity for the material to be removed. The workpiece surface is treated by passing the workpiece through the fluid interface. The two or more fluids are preferably dispensed into an apparatus and allowed to settle into two or more predominant layers separated by an interface. Surface preparation techniques which may benefit from the present invention include etching, cleaning or drying processes and the like.

摘要翻译： 一种用于制备工件表面的方法，其使用两种不同密度和混溶性的流体，其产生一个或多个流体界面，其中选择流体使得流体之一的溶解度或亲和力对于从工件中去除的材料是高的 而另一种流体对待除去的材料具有低溶解度或亲和性。 通过使工件通过流体界面来处理工件表面。 两种或更多种流体优选地分配到装置中并允许沉降到由界面分开的两个或更多个主要层中。 可受益于本发明的表面处理技术包括蚀刻，清洗或干燥过程等。

公开(公告)号：US06356653B2

公开(公告)日：2002-03-12

申请号：US09116680

申请日：1998-07-16

申请人： Jeffrey A. Brigante ,  Glenn W. Gale ,  Maurice R. Hevey ,  Frederick W. Kern, Jr. ,  Ben Kim ,  Joel M. Sharrow ,  William A. Syverson

发明人： Jeffrey A. Brigante ,  Glenn W. Gale ,  Maurice R. Hevey ,  Frederick W. Kern, Jr. ,  Ben Kim ,  Joel M. Sharrow ,  William A. Syverson

IPC分类号： G06K900

CPC分类号： H01L22/20 ,  H01L21/268

摘要： A method for removing one or more particles from a surface of an object is provided. The method has first and second steps of detecting and locating the one or more particles on the surface of the object. In a third step, focused energy is directed onto one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface. In preferred variations of the method of the present invention, the object is a semiconductor wafer and the directed focused energy is in the form of a laser. Also provided is an apparatus for removing the plurality of particles from the surface of the object. The apparatus includes a detector for detecting and locating the plurality of particles on the surface of the object, and a laser for directing focused energy on one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface.

摘要翻译： 提供了从物体表面去除一个或多个颗粒的方法。 该方法具有检测和定位物体表面上的一个或多个颗粒的第一和第二步骤。 在第三步骤中，将聚焦的能量引导到一个或多个检测到的颗粒上以破坏一个或多个颗粒与表面之间的键能，从而从表面除去一个或多个颗粒。 在本发明方法的优选变型中，目的是半导体晶片，并且定向的聚焦能是激光的形式。 还提供了用于从物体的表面去除多个颗粒的装置。 该装置包括用于检测和定位物体表面上的多个颗粒的检测器和用于将聚焦能量引导到一个或多个检测到的颗粒上的激光器，以破坏一个或多个颗粒与表面之间的结合能，由此 从表面去除一个或多个颗粒。