公开(公告)号：US07531059B2

公开(公告)日：2009-05-12

申请号：US10798816

申请日：2004-03-10

申请人： Nicole S Carpenter ,  Joseph R Drennan ,  Alison K Easton ,  Casey J Grant ,  Andrew S Hoadley ,  Kenneth F McAvey, Jr. ,  Joel M Sharrow ,  William A Syverson ,  Kenneth H Yao

发明人： Nicole S Carpenter ,  Joseph R Drennan ,  Alison K Easton ,  Casey J Grant ,  Andrew S Hoadley ,  Kenneth F McAvey, Jr. ,  Joel M Sharrow ,  William A Syverson ,  Kenneth H Yao

IPC分类号： H01L21/00 ,  C23C16/00 ,  C23C14/00

CPC分类号： B08B7/0014

摘要： An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.

摘要翻译： 提供了用于从诸如半导体晶片的衬底表面去除污染颗粒物质的装置和方法。 该方法和装置使用材料，优选液体可固化聚合物，其作为牺牲涂层施加到其上含有污染颗粒物质的基材的表面上。 使用能量源将污染颗粒物质从晶片的表面移走到牺牲涂层中，使得颗粒被部分或完全包封并悬浮在牺牲涂层中。 然后去除牺牲涂层。 涂层优选形成薄膜以通过拉（剥离）提供更清洁的基底表面的薄膜来去除涂层。

公开(公告)号：US07081208B2

公开(公告)日：2006-07-25

申请号：US10320834

申请日：2002-12-16

申请人： Kenneth J McCullough ,  Wayne M Moreau ,  Keith R Pope ,  Robert J Purtell ,  John P Simons ,  William A Syverson ,  Charles J Taft

发明人： Kenneth J McCullough ,  Wayne M Moreau ,  Keith R Pope ,  Robert J Purtell ,  John P Simons ,  William A Syverson ,  Charles J Taft

IPC分类号： B44C1/22 ,  B31D3/00

CPC分类号： B01D67/0032 ,  B01D61/147 ,  B01D67/003 ,  B01D67/0088 ,  B01D67/0093 ,  B01D69/10 ,  B01D2323/225 ,  B01D2323/34

摘要： Methods are provided for making microfilters by subtractive techniques which remove a component or part of a filter material to form pores in the filter material and additive techniques which deposit a filter material onto a porous underlying substrate. All the methods employ a supercritical fluid or mixture which have very high solvency properties and low viscosity and CO2 is the preferred supercritical fluid.

摘要翻译： 提供了用于通过减去技术制造微过滤器的方法，该技术除去过滤材料的组分或部分以在过滤材料中形成孔隙，以及将过滤材料沉积到多孔下面的基底上的添加技术。 所有方法都采用具有非常高的溶解性能和低粘度的超临界流体或混合物，而CO 2 O 2是优选的超临界流体。

公开(公告)号：US06875286B2

公开(公告)日：2005-04-05

申请号：US10320836

申请日：2002-12-16

申请人： John M. Cotte ,  Catherine Ivers ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  Robert J. Purtell ,  John P. Simons ,  William A. Syverson ,  Charles J. Taft

发明人： John M. Cotte ,  Catherine Ivers ,  Kenneth J. McCullough ,  Wayne M. Moreau ,  Robert J. Purtell ,  John P. Simons ,  William A. Syverson ,  Charles J. Taft

IPC分类号： H01L21/304 ,  B08B7/00 ,  C25F1/00 ,  H01L21/30 ,  H01L21/302 ,  H01L21/306

CPC分类号： B08B7/0021 ,  H01L21/02063 ,  Y10S134/902

摘要： A method and apparatus are provided for removing solid and/or liquid residues from electronic components such as semiconductor wafers utilizing liquid or supercritical carbon dioxide which is solidified on the surface of the wafer and then vaporized and removed from the system. In a preferred embodiment the solidification and vaporizing steps are repeated (cycled) before removal of the CO2 from the vessel. The residues are carried away with the vaporized carbon dioxide.

摘要翻译： 提供了一种方法和装置，用于从诸如半导体晶片的电子部件中除去固体和/或液体残留物，其中所述液体或超临界二氧化碳在晶片的表面上固化，然后蒸发并从系统中除去。 在优选的实施方案中，在从容器中除去CO 2之前重复（循环）固化和蒸发步骤。 残余物被蒸发的二氧化碳带走。

公开(公告)号：US06776171B2

公开(公告)日：2004-08-17

申请号：US09892954

申请日：2001-06-27

申请人： Nicole S. Carpenter ,  Joseph R. Drennan ,  Alison K. Easton ,  Casey J. Grant ,  Andrew S. Hoadley ,  Kenneth F. McAvey, Jr. ,  Joel M. Sharrow ,  William A. Syverson ,  Kenneth H. Yao

发明人： Nicole S. Carpenter ,  Joseph R. Drennan ,  Alison K. Easton ,  Casey J. Grant ,  Andrew S. Hoadley ,  Kenneth F. McAvey, Jr. ,  Joel M. Sharrow ,  William A. Syverson ,  Kenneth H. Yao

IPC分类号： B08B700

CPC分类号： B08B7/0014

摘要： An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.

公开(公告)号：US06565666B1

公开(公告)日：2003-05-20

申请号：US09723069

申请日：2000-11-27

申请人： Russell H. Arndt ,  Glenn Walton Gale ,  Frederick William Kern, Jr. ,  Kenneth T. Settlemyer, Jr. ,  William A. Syverson

发明人： Russell H. Arndt ,  Glenn Walton Gale ,  Frederick William Kern, Jr. ,  Kenneth T. Settlemyer, Jr. ,  William A. Syverson

IPC分类号： B08B700

CPC分类号： H01L21/67034 ,  Y10S134/902 ,  Y10S438/906 ,  Y10T428/24 ,  Y10T428/24124 ,  Y10T428/24273 ,  Y10T428/24298 ,  Y10T428/24405 ,  Y10T428/24413

摘要： Disclosed is a method of removing liquid from a surface of a semiconductor wafer that comprises the steps of providing a plurality of capillary channels, each said capillary channel having a first opening and a second opening, and then placing said first openings in contact with the liquid in a manner effective in drawing away the liquid by capillary action.

摘要翻译： 公开了一种从半导体晶片的表面去除液体的方法，包括以下步骤：提供多个毛细通道，每个所述毛细通道具有第一开口和第二开口，然后将所述第一开口与液体接触 以有效地通过毛细作用抽出液体的方式。

公开(公告)号：US5427622A

公开(公告)日：1995-06-27

申请号：US276684

申请日：1994-07-18

申请人： David Stanasolovich ,  William A. Syverson ,  Ronald A. Warren

发明人： David Stanasolovich ,  William A. Syverson ,  Ronald A. Warren

IPC分类号： E04B1/84 ,  H01L21/00 ,  B08B3/12

CPC分类号： H01L21/67057 ,  E04B2001/8419 ,  Y10S134/902

摘要： Apparatus and method for cleaning/etching the surface of an article with sonic energy in the megahertz range which employ an anti-reflection mechanism within a recirculation tank. A tank having at least one side wall and a bottom structure holds a cleaning/etching liquid and a megasonic transducer is associated with the tank for projecting megasonic energy into the liquid. The anti-reflection mechanism is disposed within the tank in close association with the at least one sidewall or bottom structure of the tank to thereby minimize reflection of megasonic energy from the associated surface. Preferably, the megasonic transducer is associated with a first tank sidewall which opposes a second tank sidewall, and the anti-reflection mechanism is disposed adjacent the second tank sidewall. By way of example, the anti-reflection mechanism can comprise a stream of gas bubbles, a plurality of anechoic structures, or a combination of both gas bubbles and anechoic structures.

摘要翻译： 用于在兆赫兹范围内用声能量清洁/蚀刻物品的表面的装置和方法，其在循环罐内采用防反射机构。 具有至少一个侧壁和底部结构的罐保持清洁/蚀刻液体，并且兆声波换能器与用于将兆声波能量投射到液体中的罐相关联。 防反射机构设置在罐内与罐的至少一个侧壁或底部结构紧密相关联，从而最小化来自相关联表面的兆声波能量的反射。 优选地，兆声波换能器与第二坦克侧壁相对，第一坦克侧壁与第二坦克侧壁相对，并且防反射机构邻近第二坦克侧壁设置。 作为示例，防反射机构可以包括气泡流，多个消声结构或两个气泡和消声结构的组合。

公开(公告)号：US5579792A

公开(公告)日：1996-12-03

申请号：US599007

申请日：1996-02-09

申请人： David Stanasolovich ,  William A. Syverson ,  Ronald A. Warren

发明人： David Stanasolovich ,  William A. Syverson ,  Ronald A. Warren

IPC分类号： E04B1/84 ,  H01L21/00 ,  B08B3/10

CPC分类号： H01L21/67057 ,  E04B2001/8419 ,  Y10S134/902

摘要： Apparatus and method for cleaning/etching the surface of an article with sonic energy in the megahertz range which employ an anti-reflection mechanism within a recirculation tank. A tank having at least one side wall and a bottom structure holds a cleaning/etching liquid and a megasonic transducer is associated with the tank for projecting megasonic energy into the liquid. The anti-reflection mechanism is disposed within the tank in close association with the at least one sidewall or bottom structure of the tank to thereby minimize reflection of megasonic energy from the associated surface. Preferably, the megasonic transducer is associated with a first tank sidewall which opposes a second tank sidewall, and the anti-reflection mechanism is disposed adjacent the second tank sidewall. By way of example, the anti-reflection mechanism can comprise a stream of gas bubbles, a plurality of anechoic structures, or a combination of both gas bubbles and anechoic structures.

公开(公告)号：US5533540A

公开(公告)日：1996-07-09

申请号：US370714

申请日：1995-01-10

申请人： David Stanasolovich ,  William A. Syverson ,  Ronald A. Warren

发明人： David Stanasolovich ,  William A. Syverson ,  Ronald A. Warren

IPC分类号： E04B1/84 ,  H01L21/00 ,  B08B3/10

CPC分类号： H01L21/67057 ,  E04B2001/8419 ,  Y10S134/902

摘要： Apparatus and method for cleaning/etching the surface of an article with sonic energy in the megahertz range which employ an anti-reflection mechanism within a recirculation tank. A tank having at least one side wall and a bottom structure holds a cleaning/etching liquid and a megasonic transducer is associated with the tank for projecting megasonic energy into the liquid. The anti-reflection mechanism is disposed within the tank in close association with the at least one sidewall or bottom structure of the tank to thereby minimize reflection of megasonic energy from the associated surface. Preferably, the megasonic transducer is associated with a first tank sidewall which opposes a second tank sidewall, and the anti-reflection mechanism is disposed adjacent the second tank sidewall. By way of example, the anti-reflection mechanism can comprise a stream of gas bubbles, a plurality of anechoic structures, or a combination of both gas bubbles and anechoic structures.

摘要翻译： 用于在兆赫兹范围内用声能量清洁/蚀刻物品的表面的装置和方法，其在循环罐内采用防反射机构。 具有至少一个侧壁和底部结构的罐保持清洁/蚀刻液体，并且兆声波换能器与用于将兆声波能量投射到液体中的罐相关联。 防反射机构设置在罐内与罐的至少一个侧壁或底部结构紧密相关联，从而最小化来自相关联表面的兆声波能量的反射。 优选地，兆声波换能器与第二坦克侧壁相对，第一坦克侧壁与第二坦克侧壁相对，并且防反射机构邻近第二坦克侧壁设置。 作为示例，防反射机构可以包括气泡流，多个消声结构或两个气泡和消声结构的组合。

公开(公告)号：US06939408B1

公开(公告)日：2005-09-06

申请号：US09650103

申请日：2000-08-29

申请人： Francis A. Abramovich ,  Nicole S. Carpenter ,  Joseph R. Drennan ,  Rick H. Gaylord ,  Casey J. Grant ,  Kenneth F. McAvey, Jr. ,  Mark A. Pakulski ,  Joel M. Sharrow ,  William A. Syverson ,  Alison K. Easton ,  Kenneth H. Yao

发明人： Francis A. Abramovich ,  Nicole S. Carpenter ,  Joseph R. Drennan ,  Rick H. Gaylord ,  Casey J. Grant ,  Kenneth F. McAvey, Jr. ,  Mark A. Pakulski ,  Joel M. Sharrow ,  William A. Syverson ,  Alison K. Easton ,  Kenneth H. Yao

IPC分类号： B08B3/00 ,  B08B3/08 ,  H01L21/00 ,  H01L21/306

CPC分类号： H01L21/02052 ,  B08B3/08 ,  H01L21/02019 ,  H01L21/30604 ,  H01L21/67086 ,  Y10S134/902

摘要： A method for preparing a workpiece surface utilizing two more fluids of differing density and miscibility which create one or more fluid interfaces wherein the fluids are chosen such that the solubility or affinity of one of the fluids is high for a material to be removed from the workpiece surface while the other fluid has a low solubility or affinity for the material to be removed. The workpiece surface is treated by passing the workpiece through the fluid interface. The two or more fluids are preferably dispensed into an apparatus and allowed to settle into two or more predominant layers separated by an interface. Surface preparation techniques which may benefit from the present invention include etching, cleaning or drying processes and the like.

摘要翻译： 一种用于制备工件表面的方法，其使用两种不同密度和混溶性的流体，其产生一个或多个流体界面，其中选择流体使得流体之一的溶解度或亲和力对于从工件中去除的材料是高的 而另一种流体对待除去的材料具有低溶解度或亲和性。 通过使工件通过流体界面来处理工件表面。 两种或更多种流体优选地分配到装置中并允许沉降到由界面分开的两个或更多个主要层中。 可受益于本发明的表面处理技术包括蚀刻，清洗或干燥过程等。

公开(公告)号：US06356653B2

公开(公告)日：2002-03-12

申请号：US09116680

申请日：1998-07-16

申请人： Jeffrey A. Brigante ,  Glenn W. Gale ,  Maurice R. Hevey ,  Frederick W. Kern, Jr. ,  Ben Kim ,  Joel M. Sharrow ,  William A. Syverson

发明人： Jeffrey A. Brigante ,  Glenn W. Gale ,  Maurice R. Hevey ,  Frederick W. Kern, Jr. ,  Ben Kim ,  Joel M. Sharrow ,  William A. Syverson

IPC分类号： G06K900

CPC分类号： H01L22/20 ,  H01L21/268

摘要： A method for removing one or more particles from a surface of an object is provided. The method has first and second steps of detecting and locating the one or more particles on the surface of the object. In a third step, focused energy is directed onto one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface. In preferred variations of the method of the present invention, the object is a semiconductor wafer and the directed focused energy is in the form of a laser. Also provided is an apparatus for removing the plurality of particles from the surface of the object. The apparatus includes a detector for detecting and locating the plurality of particles on the surface of the object, and a laser for directing focused energy on one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface.

摘要翻译： 提供了从物体表面去除一个或多个颗粒的方法。 该方法具有检测和定位物体表面上的一个或多个颗粒的第一和第二步骤。 在第三步骤中，将聚焦的能量引导到一个或多个检测到的颗粒上以破坏一个或多个颗粒与表面之间的键能，从而从表面除去一个或多个颗粒。 在本发明方法的优选变型中，目的是半导体晶片，并且定向的聚焦能是激光的形式。 还提供了用于从物体的表面去除多个颗粒的装置。 该装置包括用于检测和定位物体表面上的多个颗粒的检测器和用于将聚焦能量引导到一个或多个检测到的颗粒上的激光器，以破坏一个或多个颗粒与表面之间的结合能，由此 从表面去除一个或多个颗粒。