公开(公告)号：US5203798A

公开(公告)日：1993-04-20

申请号：US720001

申请日：1991-06-24

申请人： Masahiro Watanabe ,  Mitsuyoshi Otake ,  Megumi Hamano

发明人： Masahiro Watanabe ,  Mitsuyoshi Otake ,  Megumi Hamano

IPC分类号： B08B3/12 ,  G11B5/84 ,  H01L21/00 ,  H01L21/304

CPC分类号： H01L21/67017 ,  B08B3/12 ,  Y10S134/902

摘要： A cleaning apparatus capable of substantially complete removal of contaminations generated during the manufacturing process of glass substrates, semiconductor wafers, magnetic disk substrates, magnetic head substrates or the like. The cleaning apparatus comprises a cleaning bath which is greater in cross section than the material to be cleaned and which has an opening portion for insertion of the material to be cleaned, and an ultrasonic transducer attached to the cleaning bath. The apparatus precludes various defects arising from contaminations, and enhances reliability and yield of the substrates manufactured.

摘要翻译： 能够基本上完全去除在玻璃基板，半导体晶片，磁盘基板，磁头基板等的制造过程中产生的污染物的清洗装置。 清洁装置包括清洗槽，该清洗槽的横截面大于待清洁材料的清洗槽，并且具有用于插入待清洁的材料的开口部分和附接到清洗槽的超声波换能器。 该装置排除了由污染引起的各种缺陷，提高了制造的基板的可靠性和产量。

公开(公告)号：US5226969A

公开(公告)日：1993-07-13

申请号：US666027

申请日：1991-03-07

申请人： Masahiro Watanabe ,  Mitsuyoshi Otake ,  Megumi Hamano ,  Yoshiharu Takizawa

发明人： Masahiro Watanabe ,  Mitsuyoshi Otake ,  Megumi Hamano ,  Yoshiharu Takizawa

IPC分类号： B08B3/10 ,  B08B3/06 ,  B08B7/02 ,  B24B31/00 ,  H01L21/304 ,  H05K3/26

CPC分类号： H05K3/26 ,  B08B3/06 ,  B08B7/02 ,  B24B31/003 ,  H05K2201/0209 ,  H05K2203/025 ,  H05K2203/0743 ,  H05K2203/0783 ,  H05K2203/0786

摘要： A method for cleaning a solid surface which is effective for a substance to be cleaned having a complicated structure and which uses no solvent such as CFC or the like which is harmful to the environment of the earth. A cleaning liquid is obtained by mixing insoluble particles in a liquid and brought into an eddy-flow state so that a surface to be cleaned can be uniformly cleaned.