公开(公告)号：US20060196678A1

公开(公告)日：2006-09-07

申请号：US11070324

申请日：2005-03-02

申请人： Michael Connell ,  James Tucker ,  Perry Courville

发明人： Michael Connell ,  James Tucker ,  Perry Courville

IPC分类号： E21B19/16

CPC分类号： E21B43/103 ,  E21B29/10

摘要： A method for lining tubular includes positioning an expandable liner in a wellbore at a depth of one or more perforations using a downhole depth locator tool. The expandable liner is expanded in the wellbore to line the one or more perforations.

摘要翻译： 用于衬管管的方法包括使用井下深度定位器工具将可膨胀衬套定位在一个或多个穿孔深度的井眼中。 可膨胀衬套在井眼中膨胀以对一个或多个穿孔进行排列。

公开(公告)号：US20060172510A1

公开(公告)日：2006-08-03

申请号：US11385356

申请日：2006-03-21

申请人： Michael Connell ,  Tongbi Jiang

发明人： Michael Connell ,  Tongbi Jiang

IPC分类号： H01L21/78

CPC分类号： H01L21/6836 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10S438/976 ,  Y10T156/1082 ,  Y10T156/1092 ,  Y10T428/12535 ,  Y10T428/1443 ,  Y10T428/1457 ,  Y10T428/1471 ,  Y10T428/1495 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of spaced-apart adhesive pads are defined within the adhesive layer. Each adhesive pad may cover less than the entire back surface area of the component to which it is attached. A mounting member (e.g., dicing tape) may be attached to the adhesive layer and, in some embodiments, the adhesive layer may be treated so that the mounting member is less adherent to the adhesive pads than to other parts of the adhesive layer, easing removal of the adhesive pads with the microelectronic components.

公开(公告)号：US20060033010A1

公开(公告)日：2006-02-16

申请号：US11257041

申请日：2005-10-25

申请人： Tongbi Jiang ,  Michael Connell ,  Jin Li

发明人： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC分类号： H01L27/00

CPC分类号： H01L27/14627 ,  B33Y80/00

摘要： An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

公开(公告)号：US20050274993A1

公开(公告)日：2005-12-15

申请号：US10373785

申请日：2003-02-27

申请人： Tongbi Jiang ,  Michael Connell ,  Jin Li

发明人： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC分类号： H01L27/146 ,  H01L31/062 ,  H01L31/113

CPC分类号： H01L27/14625 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14643 ,  H01L27/14685

摘要： The subject invention is directed to use of photoconductors as conductors of light to photo diodes in a CMOS chip, wherein said photoconductors are separated by at least one low refractive index material (i.e. air). The present invention offers advantages over previous CMOS imaging technology, including enhanced light transmission to photo diodes. The instant methods for producing a CMOS imaging device and CMOS imager system involve minimal power loss. Since no lens is required, the invention eliminates concerns about radius limitation and about damaging lenses during die attach, backgrind, and mount. The invention also provides little or no cross talk between photo diodes.

摘要翻译： 本发明涉及使用光电导体作为CMOS芯片中的光导体的光导体，其中所述光导体由至少一种低折射率材料（即空气）分开。 本发明提供了优于先前CMOS成像技术的优点，包括对光电二极管的增强的光传输。 用于制造CMOS成像装置和CMOS成像器系统的即时方法涉及最小的功率损耗。 由于不需要镜头，本发明消除了对于半径限制以及关于在芯片附着，后研磨和安装期间损坏的透镜的担忧。 本发明还提供了很少或没有光二极管之间的串扰。

公开(公告)号：US20050061950A1

公开(公告)日：2005-03-24

申请号：US10667390

申请日：2003-09-23

申请人： Tongbi Jiang ,  Michael Connell ,  Jin Li

发明人： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC分类号： H01J3/14 ,  H01J5/16 ,  H01L27/00

CPC分类号： H01L27/14627 ,  B33Y80/00

摘要： An improved image sensor wherein a first micro-lens array comprised of one pr more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor id also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

摘要翻译： 一种改进的图像传感器，其中包括一个更多的微透镜的第一微透镜阵列位于空腔上方，使得入射光聚焦在图像传感器的光传感器上。 第一微透镜阵列可以将入射光准直并聚焦到图像传感器的光传感器上，或者可以校准入射光并将其引导到第二微透镜阵列，然后将第二微透镜阵列聚焦到光传感器上。 还提供了一种制造改进的图像传感器id的方法，其中通过使用牺牲材料形成空腔和第一微透镜阵列。

公开(公告)号：US20050039925A1

公开(公告)日：2005-02-24

申请号：US10646482

申请日：2003-08-22

申请人： Michael Connell

发明人： Michael Connell

IPC分类号： E21B23/04 ,  E21B34/14 ,  E21B34/06

CPC分类号： E21B34/14 ,  E21B19/22 ,  E21B23/04

摘要： A ball drop tool for dropping an actuating ball to a ball seat located in a tool or tool string therebelow. The ball drop tool includes a housing with a ball drop cage positioned therein. The ball drop cage has a rocker arm pivotably attached thereto. In a first position, the rocker arm retains the actuating ball in the housing and in the second position releases the actuating ball so that it is displaced downwardly to engage the ball seat therebelow in the tool string. The ball drop cage may be connected to a releasing seat sleeve thereabove. Downward movement of the releasing seat sleeve from a first position to a second position after landing a releasing ball on the releasing sleeve moves the ball drop cage from the first position to the second position to release the actuating ball.

摘要翻译： 一种用于将致动球落到位于其下方的工具或工具串中的球座的球滴工具。 球滴工具包括其中定位有球滴笼的壳体。 球滴笼具有可枢转地附接到其上的摇臂。 在第一位置，摇臂将致动球保持在壳体中，并且在第二位置释放致动球，使得其向下移位以接合工具串中的球座。 球滴笼可以连接到其上方的释放座套筒。 释放座套筒在释放套筒上着陆之后从第一位置向第二位置的向下运动使球下落架从第一位置移动到第二位置以释放致动球。

公开(公告)号：US20050026395A1

公开(公告)日：2005-02-03

申请号：US10933770

申请日：2004-09-02

申请人： Michael Connell ,  Tongbi Jiang

发明人： Michael Connell ,  Tongbi Jiang

IPC分类号： H01L21/58 ,  H01L21/68 ,  H01L21/98 ,  H01L21/44 ,  H01L21/301 ,  H01L21/48

CPC分类号： H01L21/6836 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10S438/976 ,  Y10T156/1082 ,  Y10T156/1092 ,  Y10T428/12535 ,  Y10T428/1443 ,  Y10T428/1457 ,  Y10T428/1471 ,  Y10T428/1495 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of spaced-apart adhesive pads are defined within the adhesive layer. Each adhesive pad may cover less than the entire back surface area of the component to which it is attached. A mounting member (e.g., dicing tape) may be attached to the adhesive layer and, in some embodiments, the adhesive layer may be treated so that the mounting member is less adherent to the adhesive pads than to other parts of the adhesive layer, easing removal of the adhesive pads with the microelectronic components.

摘要翻译： 堆叠的微电子器件的制造通过生产其中粘合垫以批次方式施加到多个微电子部件的背面的子组件而得到促进。 在一个实施例中，粘合剂支付者被施加在晶片的后表面上。 多个间隔开的粘合剂垫限定在粘合剂层内。 每个粘合垫可以覆盖小于其所附接的部件的整个后表面区域。 安装构件（例如，切割带）可以附接到粘合剂层，并且在一些实施例中，可以对粘合剂层进行处理，使得安装构件比粘合剂层的其它部分更不粘附到粘合剂垫，减轻 用微电子部件去除粘合垫。

公开(公告)号：US20060170760A1

公开(公告)日：2006-08-03

申请号：US11145620

申请日：2005-06-06

申请人： Tazwell Anderson ,  Michael Connell

发明人： Tazwell Anderson ,  Michael Connell

IPC分类号： H04N7/14

CPC分类号： H04N7/17318 ,  H04N7/181 ,  H04N21/21805 ,  H04N21/8133 ,  H04N21/84

摘要： A video content distribution and management system is provided that comprises an event content recorder recording video content associated with an event as an event recording. A workstation stores and edits the event recording to form a composite event review file that is passed to a system manager over a restricted access network. The workstation is located remote from a system manager. The system manager automatically routes the composite event review file to the workstation which enables a user to designate a video segment from the composite event review file. The workstation forms a video clip from the video segment and enables the user to add annotation information to the video clip to form an annotated video clip. The workstation conveys the annotated video clip to the system manager for redistribution.

摘要翻译： 提供了一种视频内容分发和管理系统，其包括事件内容记录器，记录与事件相关联的视频内容作为事件记录。 工作站存储和编辑事件记录，以形成复合事件审查文件，该文件通过受限访问网络传递给系统管理员。 工作站位于远离系统管理器的位置。 系统管理器自动将复合事件审查文件路由到工作站，使工作站能够从复合事件审查文件中指定视频段。 工作站从视频段形成视频剪辑，并使用户能够向视频剪辑添加注释信息，以形成一个带注释的视频剪辑。 工作站将注释的视频剪辑传送到系统管理器进行重新分配。

公开(公告)号：US20060159947A1

公开(公告)日：2006-07-20

申请号：US11386208

申请日：2006-03-22

申请人： Michael Connell ,  Tongbi Jiang

发明人： Michael Connell ,  Tongbi Jiang

IPC分类号： H01L21/44 ,  H01L21/50

CPC分类号： H01L21/6836 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10S438/976 ,  Y10T156/1082 ,  Y10T156/1092 ,  Y10T428/12535 ,  Y10T428/1443 ,  Y10T428/1457 ,  Y10T428/1471 ,  Y10T428/1495 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of spaced-apart adhesive pads are defined within the adhesive layer. Each adhesive pad may cover less than the entire back surface area of the component to which it is attached. A mounting member (e.g., dicing tape) may be attached to the adhesive layer and, in some embodiments, the adhesive layer may be treated so that the mounting member is less adherent to the adhesive pads than to other parts of the adhesive layer, easing removal of the adhesive pads with the microelectronic components.

公开(公告)号：US07037756B1

公开(公告)日：2006-05-02

申请号：US10369849

申请日：2003-02-19

申请人： Tongbi Jiang ,  Michael Connell

发明人： Tongbi Jiang ,  Michael Connell

IPC分类号： H01L21/50

CPC分类号： H01L24/32 ,  H01L24/33 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Certain methods of the invention permit spacerless manufacture of stacked microelectronic devices by mechanically supporting a second microelectronic component with a wire coating. This wire coating may be sufficiently adhesive to also mechanically bond the second microelectronic component to a first microelectronic component. Other embodiments of the invention provide spacerless stacked microelectronic devices wherein a second microelectronic component is mechanically supported by a wire coating.

摘要翻译： 本发明的某些方法允许通过机械地支撑具有线涂层的第二微电子部件来不间断地制造堆叠的微电子器件。 该线涂层可以是足够的粘合剂，以将第二微电子部件机械地结合到第一微电子部件。 本发明的其它实施例提供了无间隔堆叠的微电子器件，其中第二微电子部件由线涂机械地支撑。