公开(公告)号：US07001795B2

公开(公告)日：2006-02-21

申请号：US10373785

申请日：2003-02-27

申请人： Tongbi Jiang ,  Michael Connell ,  Jin Li

发明人： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC分类号： H01L21/00 ,  H01L31/0232

CPC分类号： H01L27/14625 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14643 ,  H01L27/14685

摘要： The subject invention is directed to use of photoconductors as conductors of light to photo diodes in a CMOS chip, wherein said photoconductors are separated by at least one low refractive index material (i.e. air). The present invention offers advantages over previous CMOS imaging technology, including enhanced light transmission to photo diodes. The instant methods for producing a CMOS imaging device and CMOS imager system involve minimal power loss. Since no lens is required, the invention eliminates concerns about radius limitation and about damaging lenses during die attach, backgrind, and mount. The invention also provides little or no cross talk between photo diodes.

摘要翻译： 本发明涉及使用光电导体作为CMOS芯片中的光导体的光导体，其中所述光导体由至少一种低折射率材料（即空气）分开。 本发明提供了优于先前CMOS成像技术的优点，包括对光电二极管的增强的光传输。 用于制造CMOS成像装置和CMOS成像器系统的即时方法涉及最小的功率损耗。 由于不需要镜头，本发明消除了对于半径限制以及关于在芯片附着，后研磨和安装期间损坏的透镜的担忧。 本发明还提供了很少或没有光二极管之间的串扰。

公开(公告)号：US06995442B2

公开(公告)日：2006-02-07

申请号：US10757589

申请日：2004-01-15

申请人： Tongbi Jiang ,  Michael Connell ,  Jin Li

发明人： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC分类号： H01L31/0232 ,  H01L21/00

CPC分类号： H01L27/14625 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14643 ,  H01L27/14685

摘要： The subject invention is directed to use of photoconductors as conductors of light to photo diodes in a CMOS chip, wherein said photoconductors are separated by at least one low refractive index material (i.e. air). The present invention offers advantages over previous CMOS imaging technology, including enhanced light transmission to photo diodes. The instant methods for producing a CMOS imaging device and CMOS imager system involve minimal power loss. Since no lens is required, the invention eliminates concerns about radius limitation and about damaging lenses during die attach, backgrind, and mount. The invention also provides little or no cross talk between photo diodes.

公开(公告)号：US07557337B2

公开(公告)日：2009-07-07

申请号：US11257041

申请日：2005-10-25

申请人： Tongbi Jiang ,  Michael Connell ,  Jin Li

发明人： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC分类号： H01J3/14

CPC分类号： H01L27/14627 ,  B33Y80/00

摘要： An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

摘要翻译： 一种改进的图像传感器，其中由一个或多个微透镜组成的第一微透镜阵列位于空腔上方，使得入射光聚焦在图像传感器的光传感器上。 第一微透镜阵列可以将入射光准直并聚焦到图像传感器的光传感器上，或者可以校准入射光并将其引导到第二微透镜阵列，然后将第二微透镜阵列聚焦到光传感器上。 还提供了一种制造改进的图像传感器的方法，其中腔和第一微透镜阵列通过使用牺牲材料形成。

公开(公告)号：US20060038112A1

公开(公告)日：2006-02-23

申请号：US11257039

申请日：2005-10-25

申请人： Tongbi Jiang ,  Michael Connell ,  Jin Li

发明人： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC分类号： H01L27/00

CPC分类号： H01L27/14627 ,  B33Y80/00

摘要： An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

公开(公告)号：US20060033010A1

公开(公告)日：2006-02-16

申请号：US11257041

申请日：2005-10-25

申请人： Tongbi Jiang ,  Michael Connell ,  Jin Li

发明人： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC分类号： H01L27/00

CPC分类号： H01L27/14627 ,  B33Y80/00

摘要： An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

公开(公告)号：US20050274993A1

公开(公告)日：2005-12-15

申请号：US10373785

申请日：2003-02-27

申请人： Tongbi Jiang ,  Michael Connell ,  Jin Li

发明人： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC分类号： H01L27/146 ,  H01L31/062 ,  H01L31/113

CPC分类号： H01L27/14625 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14643 ,  H01L27/14685

摘要： The subject invention is directed to use of photoconductors as conductors of light to photo diodes in a CMOS chip, wherein said photoconductors are separated by at least one low refractive index material (i.e. air). The present invention offers advantages over previous CMOS imaging technology, including enhanced light transmission to photo diodes. The instant methods for producing a CMOS imaging device and CMOS imager system involve minimal power loss. Since no lens is required, the invention eliminates concerns about radius limitation and about damaging lenses during die attach, backgrind, and mount. The invention also provides little or no cross talk between photo diodes.

摘要翻译： 本发明涉及使用光电导体作为CMOS芯片中的光导体的光导体，其中所述光导体由至少一种低折射率材料（即空气）分开。 本发明提供了优于先前CMOS成像技术的优点，包括对光电二极管的增强的光传输。 用于制造CMOS成像装置和CMOS成像器系统的即时方法涉及最小的功率损耗。 由于不需要镜头，本发明消除了对于半径限制以及关于在芯片附着，后研磨和安装期间损坏的透镜的担忧。 本发明还提供了很少或没有光二极管之间的串扰。

公开(公告)号：US20050061950A1

公开(公告)日：2005-03-24

申请号：US10667390

申请日：2003-09-23

申请人： Tongbi Jiang ,  Michael Connell ,  Jin Li

发明人： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC分类号： H01J3/14 ,  H01J5/16 ,  H01L27/00

CPC分类号： H01L27/14627 ,  B33Y80/00

摘要： An improved image sensor wherein a first micro-lens array comprised of one pr more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor id also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

摘要翻译： 一种改进的图像传感器，其中包括一个更多的微透镜的第一微透镜阵列位于空腔上方，使得入射光聚焦在图像传感器的光传感器上。 第一微透镜阵列可以将入射光准直并聚焦到图像传感器的光传感器上，或者可以校准入射光并将其引导到第二微透镜阵列，然后将第二微透镜阵列聚焦到光传感器上。 还提供了一种制造改进的图像传感器id的方法，其中通过使用牺牲材料形成空腔和第一微透镜阵列。

公开(公告)号：US07405385B2

公开(公告)日：2008-07-29

申请号：US11257039

申请日：2005-10-25

申请人： Tongbi Jiang ,  Michael Connell ,  Jin Li

发明人： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC分类号： H01L27/00

CPC分类号： H01L27/14627 ,  B33Y80/00

摘要： An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

摘要翻译： 一种改进的图像传感器，其中由一个或多个微透镜组成的第一微透镜阵列位于空腔上方，使得入射光聚焦在图像传感器的光传感器上。 第一微透镜阵列可以将入射光准直并聚焦到图像传感器的光传感器上，或者可以校准入射光并将其引导到第二微透镜阵列，然后将第二微透镜阵列聚焦到光传感器上。 还提供了一种制造改进的图像传感器的方法，其中腔和第一微透镜阵列通过使用牺牲材料形成。

公开(公告)号：US07115853B2

公开(公告)日：2006-10-03

申请号：US10667390

申请日：2003-09-23

申请人： Tongbi Jiang ,  Michael Connell ,  Jin Li

发明人： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC分类号： H01L27/00

CPC分类号： H01L27/14627 ,  B33Y80/00

摘要： An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

公开(公告)号：US20110272822A1

公开(公告)日：2011-11-10

申请号：US13187730

申请日：2011-07-21

申请人： Jin Li ,  Tongbi Jiang

发明人： Jin Li ,  Tongbi Jiang

IPC分类号： H01L23/48

CPC分类号： H01L21/76898 ,  H01L21/6836 ,  H01L24/16 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05025 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05178 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/27416 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/013

摘要： A semiconductor component includes a semiconductor substrate, conductive vias in the substrate having terminal portions, a polymer layer on the substrate and back side conductors formed by the terminal portions of the conductive vias embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another.

摘要翻译： 半导体部件包括半导体衬底，具有端子部分的衬底中的导电通孔，衬底上的聚合物层和由嵌入聚合物层中的导电通孔的端子部分形成的背面导体。 堆叠的半导体部件包括具有彼此电连通的对准的导电通孔的多个部件。