公开(公告)号：US08179153B2

公开(公告)日：2012-05-15

申请号：US12174743

申请日：2008-07-17

申请人： Michael D. Wedlake

发明人： Michael D. Wedlake

IPC分类号： G01R31/20

CPC分类号： G01R1/07385 ,  G01R3/00 ,  G01R31/2831 ,  H01L21/7684 ,  H01L21/76877 ,  H01L22/14 ,  H01L29/7833 ,  Y10T29/49204

摘要： A probing apparatus includes a set of conductors configured to contact a surface of a workpiece simultaneously. A processor activates subsets of the conductors to determine a four-point-probe parameter, wherein the subset is less than the set of conductors. Another subset determines another four-point-probe parameter. The set of conductors remain in contact with the surface of the workpiece during and between activating each subset. A process of forming a probe head includes a probe substrate and associated conductive leads. An insulating layer is formed over the probe substrate and patterned to expose the leads. Conductors, connected to the leads, are formed over the insulating layer and define a probing area of a least 250 cm2.A process of forming an electronic device includes contacting a surface of a workpiece using conductors. Subset of the conductors are activated to determine four-point-probe parameters at different areas of the workpiece.

摘要翻译： 探测装置包括一组导体，其被配置成同时接触工件的表面。 处理器激活导体的子集以确定四点探针参数，其中该子集小于该组导体。 另一个子集确定另一个四点探针参数。 该组导体在激活每个子集期间和之间保持与工件的表面接触。 形成探针头的过程包括探针基底和相关联的导电引线。 在探针衬底上形成绝缘层，并将其图案化以使引线露出。 连接到引线的导体形成在绝缘层之上，并且限定了至少250cm 2的探测面积。形成电子器件的工艺包括使用导体接触工件的表面。 导体的子集被激活以确定工件不同区域的四点探针参数。

公开(公告)号：US20100013504A1

公开(公告)日：2010-01-21

申请号：US12174743

申请日：2008-07-17

申请人： Michael D. Wedlake

发明人： Michael D. Wedlake

IPC分类号： G01R1/073 ,  H01R43/00

CPC分类号： G01R1/07385 ,  G01R3/00 ,  G01R31/2831 ,  H01L21/7684 ,  H01L21/76877 ,  H01L22/14 ,  H01L29/7833 ,  Y10T29/49204

摘要： A probing apparatus includes a set of conductors configured to contact a surface of a workpiece simultaneously. A processor activates subsets of the conductors to determine a four-point-probe parameter, wherein the subset is less than the set of conductors. Another subset determines another four-point-probe parameter. The set of conductors remain in contact with the surface of the workpiece during and between activating each subset. A process of forming a probe head includes a probe substrate and associated conductive leads. An insulating layer is formed over the probe substrate and patterned to expose the leads. Conductors, connected to the leads, are formed over the insulating layer and define a probing area of at least 250 cm2. A process of forming an electronic device includes contacting a surface of a workpiece using conductors. Subsets of the conductors are activated to determine four-point-probe parameters at different areas of the workpiece.

摘要翻译： 探测装置包括一组导体，其被配置成同时接触工件的表面。 处理器激活导体的子集以确定四点探针参数，其中该子集小于该组导体。 另一个子集确定另一个四点探针参数。 该组导体在激活每个子集期间和之间保持与工件的表面接触。 形成探针头的过程包括探针基底和相关联的导电引线。 在探针衬底上形成绝缘层，并将其图案化以使引线露出。 连接到引线的导体形成在绝缘层上并且限定至少250cm 2的探测面积。 形成电子设备的过程包括使用导体接触工件的表面。 导体的子集被激活，以确定工件不同区域的四点探针参数。