公开(公告)号：US5659256A

公开(公告)日：1997-08-19

申请号：US601923

申请日：1996-02-15

申请人： Richard Gordon Charlton ,  George Charles Correia ,  Mark Andrew Couture ,  Gary Ray Hill ,  Kibby Barth Horsford ,  Anthony Paul Ingraham ,  Michael David Lowell ,  Voya Rista Markovich ,  Gordon Charles Osborne, Jr. ,  Mark Vincent Pierson

发明人： Richard Gordon Charlton ,  George Charles Correia ,  Mark Andrew Couture ,  Gary Ray Hill ,  Kibby Barth Horsford ,  Anthony Paul Ingraham ,  Michael David Lowell ,  Voya Rista Markovich ,  Gordon Charles Osborne, Jr. ,  Mark Vincent Pierson

IPC分类号： G01R1/04 ,  G01R1/073 ,  G01R31/28

CPC分类号： G01R1/0483 ,  G01R1/07307 ,  G01R31/2863 ,  G01R31/2886

摘要： A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.

公开(公告)号：US5672980A

公开(公告)日：1997-09-30

申请号：US602167

申请日：1996-02-15

申请人： Richard Gordon Charlton ,  George Charles Correia ,  Mark Andrew Couture ,  Gary Ray Hill ,  Kibby Barth Horsford ,  Anthony Paul Ingraham ,  Michael David Lowell ,  Voya Rista Markovich ,  Gordon Charles Osborne, Jr. ,  Mark Vincent Pierson

发明人： Richard Gordon Charlton ,  George Charles Correia ,  Mark Andrew Couture ,  Gary Ray Hill ,  Kibby Barth Horsford ,  Anthony Paul Ingraham ,  Michael David Lowell ,  Voya Rista Markovich ,  Gordon Charles Osborne, Jr. ,  Mark Vincent Pierson

IPC分类号： G01R1/04 ,  G01R1/073 ,  G01R31/28

CPC分类号： G01R1/0483 ,  G01R1/07307 ,  G01R31/2863 ,  G01R31/2886

摘要： A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.

摘要翻译： 公开了一种用于测试半导体芯片的方法和装置。 单个半导体芯片具有I / O触点。 该装置设置有具有对应于半导体芯片上的触点的触点的插入器。 芯片和内插器触点都可以是任何已知的类型，包括金属球，凸块或凸片，或者可以设置有树枝状表面。 首先将芯片触点与插入件上的触点进行相对松动的临时接触，然后将大于每芯片接触5克的压缩力施加到芯片上以迫使芯片触头与插入器触点良好地电接触。 然后进行芯片的测试。 测试可能包括加热芯片以及将信号应用于芯片触点。 测试后，芯片从基板上取下。