Optical device assembly and its preparation using metallic bump bonding
and a stand-off for bonding together two planar optical components
    1.
    发明授权
    Optical device assembly and its preparation using metallic bump bonding and a stand-off for bonding together two planar optical components 失效
    光学元件组件及其使用金属凸块接合的准备以及用于将两个平面光学部件结合在一起的支架

    公开(公告)号:US5734156A

    公开(公告)日:1998-03-31

    申请号:US625674

    申请日:1996-03-29

    摘要: An optical device assembly includes a planar optical filter and a planar sensor having an optically active area. The optical filter and the sensor are joined together with a gap therebetween by a standoff structure extending between the optical filter and the sensor. The standoff structure is positioned at a location outside of the optically active area of the planar sensor. The standoff structure includes a standoff element, a first bonding element between the standoff and the filter, and a second bonding element between the standoff and the sensor. The two bonding elements each preferably comprise a cold-weldable indium bump. If the standoff structure, the filter, or the sensor is made of a material to which indium does not readily cold weld, a bonding pad of a material such as titanium/nickel can be inserted to facilitate the cold welding.

    摘要翻译: 光学装置组件包括平面光学滤光器和具有光学有效区域的平面传感器。 光滤波器和传感器之间具有间隙,通过在滤光器和传感器之间延伸的间隔结构连接在一起。 隔离结构位于平面传感器的光学有效区域外部的位置。 间隔结构包括支架元件,支架和过滤器之间的第一结合元件以及支架和传感器之间的第二结合元件。 两个结合元件各自优选地包括可冷焊的铟凸块。 如果隔离结构,过滤器或传感器由铟不容易冷焊的材料制成,则可以插入诸如钛/镍的材料的焊盘以便于冷焊。

    Optical device assembly having a metallic bump bonding together two
planar optical components, and its preparation
    2.
    发明授权
    Optical device assembly having a metallic bump bonding together two planar optical components, and its preparation 失效
    具有将两个平面光学部件接合在一起的金属凸块的光学器件组件及其制备

    公开(公告)号:US5689106A

    公开(公告)日:1997-11-18

    申请号:US361622

    申请日:1994-12-22

    申请人: Michael J. Dahlin

    发明人: Michael J. Dahlin

    摘要: An optical device assembly includes a planar optical filter and a planar sensor having an optically active area. The optical filter and the sensor are joined together with a gap therebetween by a metallic bump extending between the optical filter and the sensor. The metallic bump, which is preferably indium, is positioned at a location outside of the optically active area of the planar sensor. The metallic bump is preferably formed by vapor depositing an indium subbump on the optical filter and another indium subbump on the planar sensor, in each case outside of their optically active areas, and thereafter pressing the two subbumps together to complete the bonding.

    摘要翻译: 光学装置组件包括平面光学滤光器和具有光学有效区域的平面传感器。 滤光器和传感器之间的间隙通过在滤光器和传感器之间延伸的金属凸块连接在一起。 优选为铟的金属凸块位于平面传感器的光学有效区域外侧的位置。 优选地,金属凸块通过在光学滤光器上气相沉积铟子凸点而在平面传感器上的每个情况下在其光学活性区域之外,然后将两个子凸块按压在一起以完成粘合来形成。