Dynamic allocation and configuration of a computer system's network resources
    2.
    发明申请
    Dynamic allocation and configuration of a computer system's network resources 审中-公开
    动态分配和配置计算机系统的网络资源

    公开(公告)号:US20060029097A1

    公开(公告)日:2006-02-09

    申请号:US11048524

    申请日:2005-02-01

    IPC分类号: H04J3/22

    摘要: A resource allocation application is configured to run on a computer system that is coupled through a plurality of network resources to one or more networks. The resources are initially allocated among one or more teams and a pool. One or more usage policies are established for at least one of the teams. Resource usage is continuously monitored to identify actionable resource usage conditions. The network resources are automatically reconfigured in accordance with the one or more usage policies in response to the actionable resource usage conditions.

    摘要翻译: 资源分配应用被配置为在通过多个网络资源耦合到一个或多个网络的计算机系统上运行。 资源最初分配在一个或多个团队和池中。 为至少一个团队建立一个或多个使用政策。 持续监控资源使用情况,以确定可操作的资源使用条件。 响应于可操作的资源使用条件,根据一个或多个使用策略自动重新配置网络资源。

    Device level identification methodology
    3.
    发明授权
    Device level identification methodology 有权
    设备级识别方法

    公开(公告)号:US6063685A

    公开(公告)日:2000-05-16

    申请号:US131284

    申请日:1998-08-07

    IPC分类号: H01L23/544 H01L21/76

    摘要: A method of identifying individual semiconductor devices with a unique inscription during the manufacturing process for the semiconductor devices. Each individual semiconductor device is marked during a final lithographic stepping exposure with a direct write laser mounted either in the stepper in the lithographic system working concurrently with the stepping fields during the final metal layer lithographic stepping exposure or during a post stepping pre-development treatment. The marking on the devices includes device identification, lot number and die number.

    摘要翻译: 一种在半导体器件的制造过程中识别具有独特铭文的各个半导体器件的方法。 每个单独的半导体器件在最终光刻步进曝光期间被标记,其中直接写入激光器安装在光刻系统中的步进器中,与最终金属层光刻步进曝光期间或在后期步进预处理中的步进场同时工作。 设备上的标记包括设备识别,批号和裸号。

    Method and system for recognizing scratch patterns on semiconductor
wafers
    4.
    发明授权
    Method and system for recognizing scratch patterns on semiconductor wafers 失效
    用于识别半导体晶片上的划痕图案的方法和系统

    公开(公告)号:US5913105A

    公开(公告)日:1999-06-15

    申请号:US564905

    申请日:1995-11-29

    IPC分类号: H01L21/66

    摘要: Method and system for performing semiconductor manufacturing scratch recognition analysis in cooperation with wafer scanning tools is disclosed. The invention comprises a method for determining from scan data associated with defects or other points on a substrate, such as a semiconductor wafer, what defects comprise part of a scratch. The method comprises, for each cluster of defects, determining whether the cluster includes a minimum number of pixels, or defects. For each cluster comprising the minimum number of defects, determining the best fit line for the cluster, rotating the best fit line about its center of gravity to "fine tune" the fitness thereof, and then calculating the line attributes of the fine tuned best fit line to determine whether the cluster is a scratch and classifying the cluster accordingly.

    摘要翻译: 公开了与晶片扫描工具协作进行半导体制造划痕识别分析的方法和系统。 本发明包括一种用于从与衬底(例如半导体晶片)上的缺陷或其他点相关联的扫描数据确定哪些缺陷包括刮痕的一部分的方法。 对于每个缺陷簇,该方法包括确定簇是否包括最小数量的像素或缺陷。 对于包含最少数量缺陷的每个群集,确定群集的最佳拟合线,旋转关于其重心的最佳拟合线以“微调”其适应度,然后计算微调最佳拟合的线属性 行来确定集群是否是划伤并相应地对集群进行分类。

    Saw Chain Sharpening Assembly
    7.
    发明申请
    Saw Chain Sharpening Assembly 失效
    锯链刃磨组装

    公开(公告)号:US20080229883A1

    公开(公告)日:2008-09-25

    申请号:US12089462

    申请日:2006-10-06

    申请人: Michael Mcintyre

    发明人: Michael Mcintyre

    IPC分类号: B23D63/12 B23D63/08 B23D63/16

    CPC分类号: B23D63/16 B23Q11/10

    摘要: A saw chain sharpening assembly including a support member, a grinding head, a clamping device and a cooling system whereby the saw chain sharpening assembly is adapted to provide a means for efficiently sharpening small and/or large chains.

    摘要翻译: 包括支撑构件,磨头,夹紧装置和冷却系统的锯链刃磨组件,由此锯链刃磨组件适于提供用于有效地磨削小型和/或大型链条的装置。

    Method and apparatus for manufacturing data indexing
    8.
    发明申请
    Method and apparatus for manufacturing data indexing 有权
    用于制造数据索引的方法和装置

    公开(公告)号:US20070179663A1

    公开(公告)日:2007-08-02

    申请号:US11341701

    申请日:2006-01-27

    IPC分类号: G06F19/00

    摘要: A method, apparatus, and a system for generating an index for storing data. A pattern associated with a first set of data is determined. The first set of data is stored. A determination is made as to whether the pattern associated with a second set of data corresponds to the pattern associated with the first set of data. An index associated with the first set of data is correlated to the second set of data in response to determining that the pattern associated with the second set of data corresponds to the pattern associated with the first set of data.

    摘要翻译: 一种用于生成用于存储数据的索引的方法,装置和系统。 确定与第一组数据相关联的模式。 第一组数据被存储。 确定与第二组数据相关联的模式是否对应于与第一组数据相关联的模式。 响应于确定与第二组数据相关联的模式对应于与第一组数据相关联的模式,与第一组数据相关联的索引与第二组数据相关。

    Saw chain sharpening assembly
    10.
    发明授权
    Saw chain sharpening assembly 失效
    锯链刃磨组件

    公开(公告)号:US07862406B2

    公开(公告)日:2011-01-04

    申请号:US12089462

    申请日:2006-10-06

    申请人: Michael McIntyre

    发明人: Michael McIntyre

    IPC分类号: B24B27/00

    CPC分类号: B23D63/16 B23Q11/10

    摘要: A saw chain sharpening assembly including a support member, a grinding head, a clamping device and a cooling system whereby the saw chain sharpening assembly is adapted to provide a means for efficiently sharpening small and/or large chains.

    摘要翻译: 包括支撑构件,磨头,夹紧装置和冷却系统的锯链刃磨组件,由此锯链刃磨组件适于提供用于有效地磨削小型和/或大型链条的装置。