Module for a data carrier with improved bump counterparts
    1.
    发明授权
    Module for a data carrier with improved bump counterparts 有权
    用于具有改进的凸块对应物的数据载体的模块

    公开(公告)号:US07045711B2

    公开(公告)日:2006-05-16

    申请号:US10511460

    申请日:2003-04-03

    IPC分类号: H01L23/28

    摘要: In a data carrier (1), or a module (3) for such a data carrier (1), the module (3) has an integrated component (4) with at least two projecting connection contacts (5, 6) and, for each connection contact (5, 6), a connecting part (7, 8) which is electrically conductively connected thereto, the connecting parts (7, 8) consisting of metal, being constructed so as to be plate-shaped, and including remnants (11) of raised portions which have been formed by mechanical deformation of the connecting parts (7, 8).

    摘要翻译: 在数据载体(1)或用于这种数据载体(1)的模块(3)中,模块(3)具有具有至少两个突出连接触点(5,6)的集成部件(4),并且 每个连接触点(5,6),与其导电连接的连接部分(7,8),由金属构成的连接部分(7,8)被构造成板状,并且包括残余物( 11)通过连接部(7,8)的机械变形而形成的凸部。

    Module for a data carrier with improved bump counterparts
    2.
    发明申请
    Module for a data carrier with improved bump counterparts 有权
    用于具有改进的凸块对应物的数据载体的模块

    公开(公告)号:US20050230482A1

    公开(公告)日:2005-10-20

    申请号:US10511460

    申请日:2003-04-03

    摘要: In a data carrier (1), or a module (3) for such a data carrier (1), the module (3) has an integrated component (4) with at least two projecting connection contacts (5, 6) and, for each connection contact (5, 6), a connecting part (7, 8) which is electrically conductively connected thereto, the connecting parts (7, 8) consisting of metal, being constructed so as to be plate-shaped, and including remnants (11) of raised portions which have been formed by mechanical deformation of the connecting parts (7, 8).

    摘要翻译: 在数据载体(1)或用于这种数据载体(1)的模块(3)中,模块(3)具有具有至少两个突出连接触点(5,6)的集成部件(4),并且 每个连接触点(5,6),与其导电连接的连接部分(7,8),由金属构成的连接部分(7,8)被构造成板状,并且包括残余物( 11)通过连接部(7,8)的机械变形而形成的凸部。