Heating furnace in combination with electronic circuit modules
    2.
    发明授权
    Heating furnace in combination with electronic circuit modules 失效
    加热炉结合电子电路模块

    公开(公告)号:US5413164A

    公开(公告)日:1995-05-09

    申请号:US751944

    申请日:1991-08-29

    摘要: For use in the fabrication of electronic circuit modules, there is provided a heating furnace which can be arbitrarily set in a desired temperature profile. The furnace includes a plural number of independently controllable heaters located in spaced positions to provide a plural number of heating zones in the furnace, and a plural number of cooling panels provided in the heating zones of the respective heaters. Each heater is independently controlled according to a specified type of substrate to establish a temperature profile for the specified substrate type in the furnace to carry out the curing of a sealing synthetic resin material of a semiconductor device and the reflow soldering of surface mounting devices in one and single furnace.

    摘要翻译: 为了用于电子电路模块的制造,提供了可以任意设置在所需温度分布中的加热炉。 该炉包括位于间隔位置的多个可独立控制的加热器,以在炉中提供多个加热区,以及设置在各加热器的加热区中的多个冷却板。 每个加热器根据指定类型的基板独立地控制,以建立炉中指定基板类型的温度曲线,以执行半导体器件的密封合成树脂材料的固化和表面安装装置的回流焊接 和单炉。