POST SPUTTER WASH PROCESS MODULE
    1.
    发明申请
    POST SPUTTER WASH PROCESS MODULE 审中-公开
    POST SPUTTER洗衣流程模块

    公开(公告)号:US20110030733A1

    公开(公告)日:2011-02-10

    申请号:US12139383

    申请日:2008-06-13

    IPC分类号: B08B3/10 B08B13/00

    摘要: In one embodiment, a method for cleaning a substrate in a cleaning module is disclosed. The method includes an operation that receives the substrate into a first level of the cleaning module. In another operation, the substrate is spun while contemporaneously applying a cleaning fluid to top and bottom surfaces of the substrate. In yet another operation, the substrate is spun at a second level of the cleaning module. The method also includes an operation to dry the substrate in an enclosed cavity at a third level of the cleaning module.

    摘要翻译: 在一个实施例中,公开了一种用于清洁清洁模块中的基板的方法。 该方法包括将衬底接收到清洁模块的第一级中的操作。 在另一种操作中,将基材同时喷涂到基材的顶表面和底表面上。 在另一个操作中,衬底在清洁模块的第二级旋转。 该方法还包括在清洁模块的第三级别的封闭空腔中干燥基板的操作。