公开(公告)号：US20050082697A1

公开(公告)日：2005-04-21

申请号：US10684677

申请日：2003-10-15

申请人： Tsung-Ming Shiao ,  Ming-Sing Lai

发明人： Tsung-Ming Shiao ,  Ming-Sing Lai

IPC分类号： B29D11/00 ,  B32B38/06 ,  G03H1/02 ,  B42D15/00 ,  G03H1/00

CPC分类号： G03H1/028 ,  B29D11/0073 ,  B32B38/06 ,  B32B2038/0076 ,  B32B2307/40 ,  B32B2310/0831 ,  G03H1/0244 ,  G03H2001/185 ,  G03H2250/36 ,  G03H2250/39

摘要： A solvent-resisting holographic film is a plastic film combined with an UV resin film, the UV resin film has a holographic pattern thereon, the outer surface of the holographic pattern is combined with a evaporation plating layer with a high refractive index material, each of another sides of said plastic film and said evaporation plating layer is combined with a well chemical-resisting UV resin film. The present invention can save production cost and attains a faster speed in manufacturing a holographic film. And, the film is well resistant to every king of solvent and capable of solving the problems of the bad solvent resistance of a general holographic film product at present causing the holographic pattern thereof to disappear easily.

摘要翻译： 耐溶剂全息膜是与UV树脂膜结合的塑料膜，UV树脂膜具有全息图案，全息图案的外表面与具有高折射率材料的蒸发镀层组合， 所述塑料膜和所述蒸发镀层的另一侧与耐化学品性UV树脂膜组合。 本发明可以节省生产成本并且在制造全息膜时获得更快的速度。 而且，该膜对每一种溶剂王都具有良好的抵抗力，能够解决目前普通全息膜产品的耐溶剂性差的问题，使其全息图容易消失。

公开(公告)号：US20090026470A1

公开(公告)日：2009-01-29

申请号：US11781279

申请日：2007-07-23

申请人： Kou-Rueh Lai ,  Kung-Chi Ho ,  Hu-Chen Tsai ,  Po-Kai Huang ,  Ming-Sing Lai

发明人： Kou-Rueh Lai ,  Kung-Chi Ho ,  Hu-Chen Tsai ,  Po-Kai Huang ,  Ming-Sing Lai

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/44 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A fabrication method of a side-view LED package is provided. A chip carrier is provided. An opaque housing is bonded with the chip carrier. An LED chip electrically connects the chip carrier by performing a chip-bonding process and the opaque housing has a cavity for accommodating the LED chip. A transparent encapsulant is disposed in the cavity wherein the transparent encapsulant has a side-view light output surface uncovered by the opaque housing and light emitted from the LED chip is output via the side-view light output surface. A portion of the opaque housing and a portion of the transparent encapsulant are removed for reducing an overall thickness of the opaque housing such that a top surface of the transparent encapsulant is uncovered by the opaque housing beside the side-view light output surface. An opaque protective layer is formed on the top surface of the transparent encapsulant and the opaque housing.

摘要翻译： 提供了一种侧视LED封装的制造方法。 提供芯片载体。 不透明的壳体与芯片载体结合。 LED芯片通过执行芯片接合工艺来电连接芯片载体，并且不透明壳体具有用于容纳LED芯片的空腔。 透明密封剂设置在空腔中，其中透明密封剂具有未被不透明外壳覆盖的侧视光输出表面，并且经由侧视光输出表面输出从LED芯片发出的光。 除去不透明壳体的一部分和透明密封剂的一部分以减小不透明壳体的总体厚度，使得透明密封剂的顶表面被侧视光输出表面旁边的不透明壳体覆盖。 在透明密封剂和不透明壳体的顶表面上形成不透明的保护层。