摘要:
There is disclosed a printed circuit board assembly mounting tray combined with a hinged thermal tray. The thermal tray, having a plurality of heat pipes and a thermal hinge, transfers heat gathered from heat sources scattered on the printed circuit board assembly and conducted to the mounting tray. The thermal hinge provides a heat transfer connection between the thermal tray and an external heat dissipation apparatus. Additionally, the thermal tray and thermal hinge combination provides easy inspection, board installation and serviceability.