System and method for extracting heat from a printed circuit board assembly
    1.
    发明授权
    System and method for extracting heat from a printed circuit board assembly 失效
    用于从印刷电路板组件提取热量的系统和方法

    公开(公告)号:US06545873B1

    公开(公告)日:2003-04-08

    申请号:US09676383

    申请日:2000-09-29

    IPC分类号: H05K700

    摘要: There is disclosed a printed circuit board assembly mounting tray combined with a hinged thermal tray. The thermal tray, having a plurality of heat pipes and a thermal hinge, transfers heat gathered from heat sources scattered on the printed circuit board assembly and conducted to the mounting tray. The thermal hinge provides a heat transfer connection between the thermal tray and an external heat dissipation apparatus. Additionally, the thermal tray and thermal hinge combination provides easy inspection, board installation and serviceability.

    摘要翻译: 公开了一种印刷电路板组装安装托盘,其与铰接的热盘托结合。 具有多个热管和热铰链的热托盘传递从散布在印刷电路板组件上的热源收集的热量并传导到安装盘。 热铰链提供热托盘和外部散热装置之间的传热连接。 此外,热盘和热铰链组合提供了易于检查,电路板安装和可维护性。