摘要:
An anomalous arc discharge detection apparatus, including multiplicity of ultrasonic detectors placed at different sections of a plasma processing chamber such that an ultrasonic wave accompanying an anomalous discharge is detected by the ultrasonic detectors at different propagation times or with different delay times. The detected signals are compared with each other on the same time axis to obtain the maximum range of variation of the detected waveforms and the differences in delay time of the respective ultrasonic detectors. From the comparison of the maximum range of variation and the delay times of the ultrasonic detectors, the position of the source point, and the level as well, of the anomalous arc discharge are determined, which can be displayed on a monitor and utilized to issue an alarm if necessary. The position of the anomalous discharge may be obtained by an asymptotic approximation based on recursive calculations of the distances from the source point to the respective ultrasonic detectors using formulas which define the distances in terms of the delay times. This can be done using only four ultrasonic detectors arranged on the wall of the processing chamber. An AE sensor hold case is provided to accommodate an AE sensor. The hold sensor has a lower cover which has one end to be glued onto an appropriate position of the processing chamber, and an upper cover which pushes the AE sensor against the lower cover with an adequate pressure.
摘要:
This invention relates to a detection port type probe, a plasma monitoring device, and a plasma processing apparatus. It is intended to directly and conveniently detect a state of plasma generated by an application of a radio frequency or a high voltage, and the detection port type probe is provided with at least an electroconductive supporting member (5) having an opening formed on at least a part of a surface thereof facing to plasma and a dielectric member (1) having a probe electrode (2) formed on one side thereof positioned at the opening of the electroconductive supporting member (5).
摘要:
In a plasma processing apparatus having an electrostatic chuck for holding a semiconductor wafer by an electrostatic adsorption force and a DC power supply for applying an electrostatic adsorption voltage to the electrostatic chuck, abnormal discharge in plasma is suppressed by providing the apparatus with a signal detector that detects a foresee signal that foresees occurrence of abnormal discharge in plasma, and a controller that controls ESC leakage current based upon the foresee signal. If the foresee signal is outside a prescribed range, control is exercised so as to reduce the absolute value of the electrostatic adsorption voltage, thereby suppressing the occurrence of an abnormal discharge.
摘要:
In a plasma processing apparatus having an electrostatic chuck for holding a semiconductor wafer by an electrostatic adsorption force and a DC power supply for applying an electrostatic adsorption voltage to the electrostatic chuck, abnormal discharge in plasma is suppressed by providing the apparatus with a signal detector that detects a foresee signal that foresees occurrence of abnormal discharge in plasma, and a controller that controls ESC leakage current based upon the foresee signal. If the foresee signal is outside a prescribed range, control is exercised so as to reduce the absolute value of the electrostatic adsorption voltage, thereby suppressing the occurrence of an abnormal discharge.