公开(公告)号：US08390087B2

公开(公告)日：2013-03-05

申请号：US12683546

申请日：2010-01-07

申请人： Hsiu-Wen Tu ,  Ren-Long Kuo ,  Young-Houng Shiao ,  Tsao-Pin Chen ,  Mon-Nam Ho ,  Chih-Cheng Hsu ,  Chin-Fu Lin ,  Chung-Hsien Hsin

发明人： Hsiu-Wen Tu ,  Ren-Long Kuo ,  Young-Houng Shiao ,  Tsao-Pin Chen ,  Mon-Nam Ho ,  Chih-Cheng Hsu ,  Chin-Fu Lin ,  Chung-Hsien Hsin

IPC分类号： H01L31/0203

CPC分类号： H01L27/14618 ,  H01L24/73 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.

摘要翻译： 本发明公开了一种具有大空气腔的图像传感器封装结构。 图像传感器封装结构包括基板，芯片，盖和封装材料。 芯片与基板结合。 盖的塑料片粘附到芯片上，并且盖的透明盖与塑料片组合以在芯片的增感区域上提供覆盖物以形成空气腔。 封装材料布置在基板上并封装在芯片和盖子周围。 具有预定厚度的塑料片可以增加透明盖和芯片之间的距离，以扩大空气腔。 因此，可以提高图像传感器封装结构的图像感测效果，并且可以最小化由多次折射和多次反射引起的重影图像问题。

公开(公告)号：US20110024862A1

公开(公告)日：2011-02-03

申请号：US12683546

申请日：2010-01-07

申请人： Hsiu-Wen Tu ,  Ren-Long Kuo ,  Young-Houng Shiao ,  Tsao-Pin Chen ,  Mon-Nam Ho ,  Chih-Cheng Hsu ,  Chin-Fu Lin ,  Chung-Hsien Hsin

发明人： Hsiu-Wen Tu ,  Ren-Long Kuo ,  Young-Houng Shiao ,  Tsao-Pin Chen ,  Mon-Nam Ho ,  Chih-Cheng Hsu ,  Chin-Fu Lin ,  Chung-Hsien Hsin

IPC分类号： H01L31/0203

CPC分类号： H01L27/14618 ,  H01L24/73 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.

摘要翻译： 本发明公开了一种具有大空气腔的图像传感器封装结构。 图像传感器封装结构包括基板，芯片，盖和封装材料。 芯片与基板结合。 盖的塑料片粘附到芯片上，并且盖的透明盖与塑料片组合以在芯片的增感区域上提供覆盖物以形成空气腔。 封装材料布置在基板上并封装在芯片和盖子周围。 具有预定厚度的塑料片可以增加透明盖和芯片之间的距离，以扩大空气腔。 因此，可以提高图像传感器封装结构的图像感测效果，并且可以最小化由多次折射和多次反射引起的重影图像问题。

公开(公告)号：US20110024861A1

公开(公告)日：2011-02-03

申请号：US12603591

申请日：2009-10-22

申请人： Hsiu-Wen Tu ,  Ren-Long Kuo ,  Young-Houng Shiao ,  Tsao-Pin Chen ,  Mon-Nam Ho ,  Chih-Cheng Hsu ,  Chin-Fu Lin ,  Chung-Hsien Hsin

发明人： Hsiu-Wen Tu ,  Ren-Long Kuo ,  Young-Houng Shiao ,  Tsao-Pin Chen ,  Mon-Nam Ho ,  Chih-Cheng Hsu ,  Chin-Fu Lin ,  Chung-Hsien Hsin

IPC分类号： H01L31/02 ,  H01L31/18

CPC分类号： H01L31/0203 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure.

摘要翻译： 公开了一种用于模制图像传感器封装结构的制造方法及其图像传感器封装结构。 该制造方法包括以下步骤：提供用于封装的半成品图像传感器，在半成品图像传感器的透明盖的外围设置坝，将半成品图像传感器定位在模具内，以及注入模具 复合成模具的模腔。 大坝布置在透明盖的顶表面上，模具的内表面可以与坝的顶表面精确接触，从而防止注入模腔中的模具复合体被大坝溢出到透明盖。 此外，大坝和模具化合物的布置可以增加包装区域，并将堵塞扩大到侵入性水分，从而提高图像传感器封装结构的可靠性。