利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

16 条记录 (耗时 0.049 秒)

    IMAGE SENSOR PACKAGE STRUCTURE
    6.
    发明申请
    IMAGE SENSOR PACKAGE STRUCTURE 有权
    图像传感器包装结构

    公开(公告)号：US20110024610A1

    公开(公告)日：2011-02-03

    申请号：US12579493

    申请日：2009-10-15

    申请人： Hsiu-Wen Tu ,  Ren-Long Kuo ,  Young-Houng Shiao ,  Tsao-Pin Chen ,  Mon-Nan Ho ,  Chih-Cheng Hsu ,  Chin-Fu Lin ,  Chung-Hsien Hsin

    发明人： Hsiu-Wen Tu ,  Ren-Long Kuo ,  Young-Houng Shiao ,  Tsao-Pin Chen ,  Mon-Nan Ho ,  Chih-Cheng Hsu ,  Chin-Fu Lin ,  Chung-Hsien Hsin

    IPC分类号： H01J5/02

    CPC分类号： H01L27/14618 ,  H01L23/04 ,  H01L23/10 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.

    摘要翻译： 本发明公开了一种图像传感器封装结构。 图像传感器封装结构包括基板，芯片，透明盖，第一壳体和封装材料。 透明盖子覆盖了芯片的敏化区域，并且还粘附在衬底上的芯片上。 附着在透明盖上的第一壳体形成开口，使得光线可以穿过开口和透明盖子进入致敏区域。 封装材料围绕芯片和透明盖子覆盖并填充在基板和第一壳体之间。 由于布置在第一壳体和透明盖之间以及透明盖和芯片之间的粘合剂层的布置，所以来自湿气的阻塞区域被拉长。 因此，可以提高图像传感器封装结构的可靠性。

    Manufacturing method and structure of a wafer level image sensor module with package structure
    7.
    发明授权
    Manufacturing method and structure of a wafer level image sensor module with package structure 失效
    具有封装结构的晶片级图像传感器模块的制造方法和结构

    公开(公告)号：US08378441B2

    公开(公告)日：2013-02-19

    申请号：US13010880

    申请日：2011-01-21

    申请人： Hsiu-Wen Tu ,  Chung-Hsien Hsin ,  Han-Hsing Chen ,  Ming-Hui Chen ,  Ren-Long Kuo ,  Chih-Cheng Hsu ,  Young-Houng Shiao ,  Tsao-Pin Chen

    发明人： Hsiu-Wen Tu ,  Chung-Hsien Hsin ,  Han-Hsing Chen ,  Ming-Hui Chen ,  Ren-Long Kuo ,  Chih-Cheng Hsu ,  Young-Houng Shiao ,  Tsao-Pin Chen

    IPC分类号： H01L33/0232 ,  H01L21/00

    CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/13 ,  H01L2924/181 ,  H01L2924/00

    摘要： The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof.

    摘要翻译： 本发明公开了一种具有封装结构的晶片级图像传感器模块的制造方法和结构。 具有封装结构的晶片级图像传感器模块的结构包括半成品，多个焊球和密封剂。 半成品包括图像感测芯片和晶片级透镜组件。 密封剂设置在图像感测芯片和晶片级透镜组件的侧面上。 此外，制造方法包括以下步骤：提供硅晶片，切割硅晶片，提供透镜组件晶片，制造多个半成品，执行封装工艺，安装焊球以及切割密封剂。 因此，密封剂通过设置在其两侧而封装每个半成品。