公开(公告)号：US06653725B2

公开(公告)日：2003-11-25

申请号：US10321427

申请日：2002-12-18

申请人： Moon Bong Ahn ,  Chan Wang Park ,  Yong Chil Choi

发明人： Moon Bong Ahn ,  Chan Wang Park ,  Yong Chil Choi

IPC分类号： H01L2348

CPC分类号： H01L23/4922 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01078 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package includes a chip having a first surface provided with a first terminal and a second surface provided with at least one second terminal, the second surface being opposite to the first surface, a first substrate arranged on the first surface of the chip and having a first conductive via hole connected to the first terminal, a second substrate arranged on the second surface of the chip and having at least one second conductive via hole connected to the second terminal, and a resin molding part formed around the chip between the first substrate and the second substrate. And the present invention provides a chip package assembly including the chip package. Further, a method of manufacturing the chip package and an assembly including the chip package are provided. The chip package does not use a bonding wire and additional conductive lands, thereby reducing the size of the package and simplifying the manufacturing process.

摘要翻译： 芯片封装包括具有设置有第一端子的第一表面和设置有至少一个第二端子的第二表面的芯片，所述第二表面与第一表面相对，布置在芯片的第一表面上的第一衬底具有 连接到第一端子的第一导电通孔，布置在芯片的第二表面上并具有连接到第二端子的至少一个第二导电通孔的第二基板，以及在第一基板之间的芯片周围形成的树脂模制部件 和第二基板。 并且本发明提供了一种包括芯片封装的芯片封装组件。 此外，提供了一种制造芯片封装的方法和包括芯片封装的组件。 芯片封装不使用接合线和附加的导电焊盘，从而减小封装的尺寸并简化制造工艺。

公开(公告)号：US06774492B2

公开(公告)日：2004-08-10

申请号：US10321595

申请日：2002-12-18

申请人： Moon Bong Ahn ,  Bang Won Oh ,  Kwang Cheol Cho

发明人： Moon Bong Ahn ,  Bang Won Oh ,  Kwang Cheol Cho

IPC分类号： H01L2348

CPC分类号： H01L23/3121 ,  H01L23/4922 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/4848 ,  H01L2224/85051 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/181 ,  H01L2224/48465 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package includes a chip having a first surface provided with a first terminal and a second surface provided with at least one second terminal, the second surface being opposite to the first surface, a first conductive layer formed on the first surface of the chip, a second conductive layer formed on the second surface of the chip, and a substrate attached to the second surface of the chip and including at least one conductive via hole connected to the second terminal of the chip. And the present invention provides a chip package assembly including the chip package. Further, a method of manufacturing the chip package and an assembly including the chip package are provided. The chip package does not use a bonding wire and additional conductive lands, thereby reducing the size of the package and simplifying the manufacturing process.

摘要翻译： 芯片封装包括具有设置有第一端子的第一表面和设置有至少一个第二端子的第二表面的芯片，第二表面与第一表面相对，形成在芯片的第一表面上的第一导电层， 形成在所述芯片的第二表面上的第二导电层，以及附着到所述芯片的第二表面的基板，并且包括连接到所述芯片的第二端子的至少一个导电通孔。 并且本发明提供了一种包括芯片封装的芯片封装组件。 此外，提供了一种制造芯片封装的方法和包括芯片封装的组件。 芯片封装不使用接合线和附加的导电焊盘，从而减小封装的尺寸并简化制造工艺。