公开(公告)号：US20190279887A1

公开(公告)日：2019-09-12

申请号：US15915037

申请日：2018-03-07

Applicant: Kuo Yang Ma ,  Zhi Kai Huang ,  Mu-Chun Ho ,  Wei Chuan Chou ,  Chun-Fu Wang ,  Yi-Hsiang Chen ,  Ying Hsien Cheng

Inventor： Kuo Yang Ma ,  Zhi Kai Huang ,  Mu-Chun Ho ,  Wei Chuan Chou ,  Chun-Fu Wang ,  Yi-Hsiang Chen ,  Ying Hsien Cheng

IPC: H01L21/67 ,  H01L21/673

Abstract: A vapor reduction device for a semiconductor wafer has a plurality of heat plates which are spaced arranged longitudinally for receiving a plurality of wafers, the heat plates are integrated into a heating frame which is further placed into a casing. The movements of the heat plates within the casing causes that the wafers can be heated rapidly and uniformly so as to evaporated vapor effectively. The heat plates are separable from the heating frame and thus a number of the heat plates is selectable as desired. The heating temperature for the heat plates is controllable independently so that the temperatures of the wafers are controllable so that the temperature differences of the wafers are controllable to be uniformly distributed.

公开(公告)号：US20190244787A1

公开(公告)日：2019-08-08

申请号：US15886844

申请日：2018-02-02

Applicant: Wei-Chuan Chou ,  Zhi Kai Huang ,  Mu-Chun Ho ,  Chun-Fu Wang ,  Yi-Hsiang Chen ,  Hsin-Chih Chiu ,  Yao-Syuan Cheng

Inventor： Wei-Chuan Chou ,  Zhi Kai Huang ,  Mu-Chun Ho ,  Chun-Fu Wang ,  Yi-Hsiang Chen ,  Hsin-Chih Chiu ,  Yao-Syuan Cheng

IPC: H01J37/32

CPC classification number: H01J37/32082 ,  H01J37/32532 ,  H01J2237/334

Abstract: A plasma etching reaction chamber includes a casing having a receiving chamber; a base liftably installed below the receiving chamber; a first electrode and a second electrode; and a radio frequency electrode rod. The second electrode has a plurality of water channels and a bottom of the second electrode is installed with two cooling water tubes which are communicated with the plurality of water channels; upper sides of the two cooling water tubes are hidden within the driving rod and lower sides thereof extend downwards to be out of the casing so that external cooling water can flow into the cooling water tubes and then to the water channels to achieve the object of cooling.