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1.发明申请Head module, liquid jetting head, liquid jetting apparatus, method of manufacturing head module, and method of manufacturing liquid jetting head 审中-公开头模块，液体喷射头，液体喷射装置，头模块的制造方法以及制造液体喷射头的方法公开(公告)号：US20070165077A1
公开(公告)日：2007-07-19
申请号：US11713767
申请日：2007-03-02
申请人： Toru Tanikawa , Shinji Kayaba , Naoshi Ando , Masayuki Takakura , Makoto Ando , Shinichi Horii , Takaaki Murakami , Manabu Tomita
发明人： Toru Tanikawa , Shinji Kayaba , Naoshi Ando , Masayuki Takakura , Makoto Ando , Shinichi Horii , Takaaki Murakami , Manabu Tomita
IPC分类号： B41J2/05
CPC分类号： B41J2/14072 , B41J2/14024 , B41J2/155 , B41J2/1603 , B41J2/1623 , B41J2/1631 , B41J2/1634 , B41J2202/20
摘要： A head module includes a head chip provided with an array of heat generating elements, a nozzle sheet provided with nozzles, a barrier layer for forming ink liquid chambers, a module frame adhered to the nozzle sheet to thereby support the nozzle sheet and provided with a head chip arranging hole for arranging the head chip therein, and a buffer tank which is so disposed as to cover the head chip arranging hole from a surface, on the opposite side of the surface of adhesion to the nozzle sheet, of the module frame and which is for forming a common liquid conduit communicated with all the ink chambers of the head chip.
摘要翻译： 头模块包括设置有发热元件阵列的头芯片，设置有喷嘴的喷嘴片，用于形成墨液室的阻挡层，粘附到喷嘴片的模块框架，从而支撑喷嘴片并设置有 用于将头部芯片布置在其中的头部芯片布置孔，以及缓冲罐，其设置成从模块框架的与喷嘴板的粘附表面的相反侧的表面覆盖头部芯片布置孔，并且 其用于形成与头芯片的所有墨室连通的公共液体导管。
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2.发明申请Liquid ejection head, liquid ejection apparatus, and manufacturing method of the liquid ejection head 失效液体喷射头，液体喷射装置和液体喷射头的制造方法公开(公告)号：US20050195238A1
公开(公告)日：2005-09-08
申请号：US11062419
申请日：2005-02-22
IPC分类号： B41J29/38
CPC分类号： B41J2/155 , B41J2202/03 , B41J2202/08
摘要： A line head includes a nozzle plate, a frame-shaped outer frame, a plurality of head chips, and a head support member arranged within the outer frame. The linear expansion coefficients of the nozzle plate and the head support member are larger than that of the outer frame. The nozzle plate is joined onto the outer frame and a tensile stress is produced in the nozzle plate by the outer frame. The head support member is joined and fitted with the outer frame. When the head support member thermally expands relative to the outer frame, a compression stress is produced in the head support member while a strain of the head support member is restricted by the outer frame.
摘要翻译： 线头包括喷嘴板，框状外框架，多个头部芯片以及设置在外框架内的头部支撑构件。 喷嘴板和头部支撑构件的线膨胀系数大于外框架的线性膨胀系数。 喷嘴板被接合到外框上，并且通过外框在喷嘴板中产生拉伸应力。 头部支撑构件与外框架接合并配合。 当头部支撑构件相对于外框架热膨胀时，在头部支撑构件的应变被外框限制的同时在头部支撑构件中产生压缩应力。
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3.发明申请Head module, liquid jetting head, liquid jetting apparatus, method of manufacturing head module, and method of manufacturing liquid jetting head 审中-公开头模块，液体喷射头，液体喷射装置，头模块的制造方法以及制造液体喷射头的方法公开(公告)号：US20050116995A1
公开(公告)日：2005-06-02
申请号：US10971673
申请日：2004-10-22
申请人： Toru Tanikawa , Shinji Kayaba , Naoshi Ando , Masayuki Takakura , Makoto Ando , Shinichi Horii , Takaaki Murakami , Manabu Tomita
发明人： Toru Tanikawa , Shinji Kayaba , Naoshi Ando , Masayuki Takakura , Makoto Ando , Shinichi Horii , Takaaki Murakami , Manabu Tomita
CPC分类号： B41J2/14072 , B41J2/14024 , B41J2/155 , B41J2/1603 , B41J2/1623 , B41J2/1631 , B41J2/1634 , B41J2202/20
摘要： A head module includes a head chip provided with an array of heat generating elements, a nozzle sheet provided with nozzles, a barrier layer for forming ink liquid chambers, a module frame adhered to the nozzle sheet to thereby support the nozzle sheet and provided with a head chip arranging hole for arranging the head chip therein, and a buffer tank which is so disposed as to cover the head chip arranging hole from a surface, on the opposite side of the surface of adhesion to the nozzle sheet, of the module frame and which is for forming a common liquid conduit communicated with all the ink chambers of the head chip.
摘要翻译： 头模块包括设置有发热元件阵列的头芯片，设置有喷嘴的喷嘴片，用于形成墨液室的阻挡层，粘附到喷嘴片的模块框架，从而支撑喷嘴片并设置有 用于将头部芯片布置在其中的头部芯片布置孔，以及缓冲罐，其设置成从模块框架的与喷嘴板的粘附表面的相反侧的表面覆盖头部芯片布置孔，并且 其用于形成与头芯片的所有墨室连通的公共液体导管。
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4.发明授权Liquid ejection head, liquid ejection apparatus, and manufacturing method of the liquid ejection head 失效液体喷射头，液体喷射装置和液体喷射头的制造方法公开(公告)号：US07156486B2
公开(公告)日：2007-01-02
申请号：US11062419
申请日：2005-02-22
CPC分类号： B41J2/155 , B41J2202/03 , B41J2202/08
摘要： A line head includes a nozzle plate, a frame-shaped outer frame, a plurality of head chips, and a head support member arranged within the outer frame. The linear expansion coefficients of the nozzle plate and the head support member are larger than that of the outer frame. The nozzle plate is joined onto the outer frame and a tensile stress is produced in the nozzle plate by the outer frame. The head support member is joined and fitted with the outer frame. When the head support member thermally expands relative to the outer frame, a compression stress is produced in the head support member while a strain of the head support member is restricted by the outer frame.
摘要翻译： 线头包括喷嘴板，框状外框架，多个头部芯片以及设置在外框架内的头部支撑构件。 喷嘴板和头部支撑构件的线膨胀系数大于外框架的线性膨胀系数。 喷嘴板被接合到外框上，并且通过外框在喷嘴板中产生拉伸应力。 头部支撑构件与外框架接合并配合。 当头部支撑构件相对于外框架热膨胀时，在头部支撑构件的应变被外框限制的同时在头部支撑构件中产生压缩应力。
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公开(公告)号：US20060033777A1
公开(公告)日：2006-02-16
申请号：US11198501
申请日：2005-08-05
申请人： Toshio Fukuda , Naoshi Ando , Masayuki Takakura , Iwao Ushinohama
发明人： Toshio Fukuda , Naoshi Ando , Masayuki Takakura , Iwao Ushinohama
IPC分类号： B41J2/05
CPC分类号： B41J2/14024 , B41J2/14072 , B41J2002/14491 , B41J2202/03
摘要： A liquid ejection head mounted in a liquid ejection apparatus for ejecting liquid includes a first substrate including a pressure generating element for applying pressure to the liquid, a second substrate including a control circuit for controlling the drive of the pressure generating element, an external wiring member for electrically connecting the first substrate to the second substrate, a nozzle sheet having a nozzle for ejecting the liquid and a window portion through which a connection portion between the external wiring member and the first substrate is exposed to the outside. The window portion is sealed with a resin material and a seal portion formed from the resin material is cured so as to have a Shore D hardness of more than or equal to 55.
摘要翻译： 安装在用于喷射液体的液体喷射装置中的液体喷射头包括：第一基板，包括用于向液体施加压力的压力产生元件;第二基板，包括用于控制压力产生元件的驱动的控制电路;外部布线构件 用于将第一基板电连接到第二基板，具有用于喷射液体的喷嘴的喷嘴板和外部配线构件和第一基板之间的连接部分通过该窗口部暴露于外部。 窗口部分用树脂材料密封，并且由树脂材料形成的密封部分被固化以具有大于或等于55的肖氏D硬度。
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