摘要:
A head module includes a head chip provided with an array of heat generating elements, a nozzle sheet provided with nozzles, a barrier layer for forming ink liquid chambers, a module frame adhered to the nozzle sheet to thereby support the nozzle sheet and provided with a head chip arranging hole for arranging the head chip therein, and a buffer tank which is so disposed as to cover the head chip arranging hole from a surface, on the opposite side of the surface of adhesion to the nozzle sheet, of the module frame and which is for forming a common liquid conduit communicated with all the ink chambers of the head chip.
摘要:
A head module includes a head chip provided with an array of heat generating elements, a nozzle sheet provided with nozzles, a barrier layer for forming ink liquid chambers, a module frame adhered to the nozzle sheet to thereby support the nozzle sheet and provided with a head chip arranging hole for arranging the head chip therein, and a buffer tank which is so disposed as to cover the head chip arranging hole from a surface, on the opposite side of the surface of adhesion to the nozzle sheet, of the module frame and which is for forming a common liquid conduit communicated with all the ink chambers of the head chip.
摘要:
A print head is provided with at least ink-pressurizing cells, heating elements, and ink-ejection nozzles. In addition, the print head includes substrate members which form side surfaces and one end surface of the ink-pressurizing cells, and which are provided with the heating elements; a nozzle-formed member which forms the other end surface of the ink-pressurizing cells, and in which the ink-ejection nozzles, which individually correspond to the ink-pressurizing cells, are formed; and a head frame which supports the nozzle-formed member.
摘要:
A print head is provided with at least ink-pressurizing cells, heating elements, and ink-ejection nozzles. In addition, the print head includes substrate members which form side surfaces and one end surface of the ink-pressurizing cells, and which are provided with the heating elements; a nozzle-formed member which forms the other end surface of the ink-pressurizing cells, and in which the ink-ejection nozzles, which individually correspond to the ink-pressurizing cells, are formed; and a head frame which supports the nozzle-formed member.
摘要:
A print head is provided with at least ink-pressurizing cells, heating elements, and ink-ejection nozzles. In addition, the print head includes substrate members which form side surfaces and one end surface of the ink-pressurizing cells, and which are provided with the heating elements; a nozzle-formed member which forms the other end surface of the ink-pressurizing cells, and in which the ink-ejection nozzles, which individually correspond to the ink-pressurizing cells, are formed; and a head frame which supports the nozzle-formed member.
摘要:
A print head is provided with at least ink-pressurizing cells, heating elements, and ink-ejection nozzles. In addition, the print head includes substrate members which form side surfaces and one end surface of the ink-pressurizing cells, and which are provided with the heating elements; a nozzle-formed member which forms the other end surface of the ink-pressurizing cells, and in which the ink-ejection nozzles, which individually correspond to the ink-pressurizing cells, are formed; and a head frame which supports the nozzle-formed member.
摘要:
A print head is provided with at least ink-pressurizing cells, heating elements, and ink-ejection nozzles. In addition, the print head includes substrate members which form side surfaces and one end surface of the ink-pressurizing cells, and which are provided with the heating elements; a nozzle-formed member which forms the other end surface of the ink-pressurizing cells, and in which the ink-ejection nozzles, which individually correspond to the ink-pressurizing cells, are formed; and a head frame which supports the nozzle-formed member.
摘要:
A manufacturing method for a print head, in which a substrate member provided with heating elements is laminated to a nozzle-formed member in which ink-ejection nozzles are formed, includes the step of laminating a correcting member having approximately the same coefficient of linear expansion as the substrate member to the nozzle-formed member. A nozzle interval L1 of a nozzle-formed member which doesn't laminate a correcting member at an operating temperature T0 is determined as =L2(1+&agr;2&Dgr;T)/(1+&agr;1&Dgr;T), wherein L2 is the nozzle interval and a heater interval at the operating temperature after the print head is completed; &agr;1 and is the coefficient of linear expansion of the nozzle-formed member; &agr;2 is the coefficient of linear expansion of the correcting member; T1 is the laminating temperature of the nozzle-formed member and the correcting member; and &Dgr;T is the difference between the laminating temperature T1 and the operating temperature T0.
摘要:
An inkjet print head includes one nozzle sheet (23) and a plurality of head chips (25) including a plurality of heaters. The nozzle sheet (23) is formed of an electroformed metal layer made of nickel or a material comprising nickel, and has discharge nozzle rows for respective colors disposed so that the discharge nozzles are in staggered arrangements and so that each set of discharge nozzles partly overlaps another set of discharge nozzles in a sheet-feed direction. The head chips are positioned at and affixed to a growth surface side of the nozzle sheet (23) in staggered arrangements so that the positions of the discharge nozzles and the positions of the heaters correspond to each other. Accordingly, reduction in printing quality caused by displacement of any of the discharge nozzles is prevented from occurring, and landing positions of discharged ink on a recording sheet are stabilized.
摘要:
A head module includes a nozzle sheet, a wiring board, and a module frame having a plurality of head-chip positioning holes formed therein, and a head chip including an electrode. The head chip is disposed in each head-chip positioning hole. The nozzle sheet is disposed on a first surface of the module frame so as to partially cover the head-chip positioning hole. The size of the nozzle sheet is set to a minimum size required for partially covering the head-chip positioning hole. The head chip is disposed from a second surface of the module frame. The electrode is exposed through an area of the head-chip positioning hole not covered by the nozzle sheet. An electrode of the wiring board is electrically connected to the electrode of the head chip and the wiring board is disposed on the first surface of the module frame so as to cover the exposed electrode.