Manufacturing method for print head
    8.
    发明授权
    Manufacturing method for print head 失效
    打印头制造方法

    公开(公告)号:US06794208B2

    公开(公告)日:2004-09-21

    申请号:US09951941

    申请日:2001-09-12

    IPC分类号: H01L2100

    摘要: A manufacturing method for a print head, in which a substrate member provided with heating elements is laminated to a nozzle-formed member in which ink-ejection nozzles are formed, includes the step of laminating a correcting member having approximately the same coefficient of linear expansion as the substrate member to the nozzle-formed member. A nozzle interval L1 of a nozzle-formed member which doesn't laminate a correcting member at an operating temperature T0 is determined as =L2(1+&agr;2&Dgr;T)/(1+&agr;1&Dgr;T), wherein L2 is the nozzle interval and a heater interval at the operating temperature after the print head is completed; &agr;1 and is the coefficient of linear expansion of the nozzle-formed member; &agr;2 is the coefficient of linear expansion of the correcting member; T1 is the laminating temperature of the nozzle-formed member and the correcting member; and &Dgr;T is the difference between the laminating temperature T1 and the operating temperature T0.

    摘要翻译: 一种打印头的制造方法,其中将具有加热元件的基板部件层压到其上形成有喷墨嘴的喷嘴形成部件,包括层叠具有大致相同的线膨胀系数的校正部件的步骤 作为到喷嘴形成部件的基板部件。 在操作温度T0下不校正校正部件的喷嘴形成部件的喷嘴间隔L1被确定为= L2(1 +α2DeltaT)/(1 +α1DeltaT),其中L2是喷嘴间隔和加热器间隔 在打印头完成后的工作温度下; α1是喷嘴形成部件的线膨胀系数; α2是校正构件的线性膨胀系数; T1是喷嘴形成部件和校正部件的层压温度; 而DeltaT是层压温度T1与工作温度T0之差。

    Ink jet print head, inkjet printer including the inkjet print head, and method of manufacturing inkjet print head
    9.
    发明申请
    Ink jet print head, inkjet printer including the inkjet print head, and method of manufacturing inkjet print head 审中-公开
    喷墨打印头,包括喷墨打印头的喷墨打印机,以及制造喷墨打印头的方法

    公开(公告)号:US20050035998A1

    公开(公告)日:2005-02-17

    申请号:US10494502

    申请日:2002-11-01

    摘要: An inkjet print head includes one nozzle sheet (23) and a plurality of head chips (25) including a plurality of heaters. The nozzle sheet (23) is formed of an electroformed metal layer made of nickel or a material comprising nickel, and has discharge nozzle rows for respective colors disposed so that the discharge nozzles are in staggered arrangements and so that each set of discharge nozzles partly overlaps another set of discharge nozzles in a sheet-feed direction. The head chips are positioned at and affixed to a growth surface side of the nozzle sheet (23) in staggered arrangements so that the positions of the discharge nozzles and the positions of the heaters correspond to each other. Accordingly, reduction in printing quality caused by displacement of any of the discharge nozzles is prevented from occurring, and landing positions of discharged ink on a recording sheet are stabilized.

    摘要翻译: 喷墨打印头包括一个喷嘴片(23)和包括多个加热器的多个头部碎片(25)。 喷嘴片(23)由镍制成的电铸金属层或由镍构成的材料形成,并且具有各种颜色的排出喷嘴排,排出喷嘴呈交错布置,并且每组排出喷嘴部分重叠 另一组排纸嘴在送纸方向。 头部芯片以交错布置的方式定位并固定在喷嘴片(23)的生长表面侧上,使得排出喷嘴的位置和加热器的位置彼此对应。 因此,防止了任何排出喷嘴的位移引起的打印质量的降低,并且排出的油墨在记录纸上的着陆位置稳定。

    Head module, liquid ejection head, liquid ejection apparatus, and method of fabricating head module
    10.
    发明申请
    Head module, liquid ejection head, liquid ejection apparatus, and method of fabricating head module 审中-公开
    头模块,液体喷射头,液体喷射装置和制造头模块的方法

    公开(公告)号:US20070008375A1

    公开(公告)日:2007-01-11

    申请号:US11473585

    申请日:2006-06-23

    IPC分类号: B41J2/14 B41J2/16

    摘要: A head module includes a nozzle sheet, a wiring board, and a module frame having a plurality of head-chip positioning holes formed therein, and a head chip including an electrode. The head chip is disposed in each head-chip positioning hole. The nozzle sheet is disposed on a first surface of the module frame so as to partially cover the head-chip positioning hole. The size of the nozzle sheet is set to a minimum size required for partially covering the head-chip positioning hole. The head chip is disposed from a second surface of the module frame. The electrode is exposed through an area of the head-chip positioning hole not covered by the nozzle sheet. An electrode of the wiring board is electrically connected to the electrode of the head chip and the wiring board is disposed on the first surface of the module frame so as to cover the exposed electrode.

    摘要翻译: 头模块包括喷嘴片,布线板和形成有多个头芯片定位孔的模块框架,以及包括电极的头芯片。 头芯片设置在每个头片定位孔中。 喷嘴片设置在模块框架的第一表面上,以便部分地覆盖头芯片定位孔。 将喷嘴片的尺寸设定为部分覆盖头片定位孔所需的最小尺寸。 头芯片从模块框架的第二表面设置。 电极通过未被喷嘴片覆盖的头芯片定位孔的区域露出。 布线板的电极电连接到头芯片的电极,并且布线板设置在模块框架的第一表面上以覆盖露出的电极。