公开(公告)号：US20140061970A1

公开(公告)日：2014-03-06

申请号：US13985792

申请日：2012-02-14

申请人： Hitoshi Sekine ,  Yasuhiro Takada ,  Hisashi Tanimoto ,  Naoto Yagi

发明人： Hitoshi Sekine ,  Yasuhiro Takada ,  Hisashi Tanimoto ,  Naoto Yagi

IPC分类号： G03F7/075 ,  G03F7/00

CPC分类号： G03F7/0757 ,  B82Y10/00 ,  B82Y40/00 ,  C08F290/068 ,  C09D151/006 ,  G03F7/0002 ,  C08F222/1006

摘要： The present invention provides a nanoimprint curable composition to be used in “nanoimprint lithography” in which a nanoimprint mold is pressed to transfer a fine concave-convex pattern, the nanoimprint curable composition containing a composite resin which has a polysiloxane segment and a polymer segment other than the polysiloxane segment, the polysiloxane segment containing a silanol group and/or hydrolyzable silyl group and having a polymerizable double bond. In addition, the present invention provides a nanoimprint-lithographic molded product, resist film, resin mold, and method for forming a pattern, which each involves use of the nanoimprint composition.

摘要翻译： 本发明提供一种纳米压印光固化组合物，其中纳米压印模具被压制以转移细凹凸图案，纳米压印可固化组合物含有具有聚硅氧烷链段和聚合物链段的复合树脂 聚硅氧烷链段含有硅烷醇基和/或可水解甲硅烷基并具有可聚合双键。 另外，本发明提供纳米压印平版印刷成型体，抗蚀剂膜，树脂模具，以及形成图案的方法，每一种都使用纳米压印组合物。

公开(公告)号：US20130068304A1

公开(公告)日：2013-03-21

申请号：US13577690

申请日：2011-05-24

申请人： Takayuki Kanematsu ,  Naoto Yagi ,  Hisashi Tanimoto ,  Tomoko Shishikura

发明人： Takayuki Kanematsu ,  Naoto Yagi ,  Hisashi Tanimoto ,  Tomoko Shishikura

IPC分类号： C08L83/10 ,  H01L33/56 ,  H01L31/0203

CPC分类号： C09K3/1018 ,  C08G77/442 ,  C08L83/10 ,  H01L31/0481 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/181 ,  Y02E10/50 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： There is provided a sealing material including a composite resin (A) including a polysiloxane segment (a1) having a structural unit represented by general formula (1) and/or general formula (2) and a silanol group and/or a hydrolyzable silyl group and a vinyl-based polymer segment (a2) having an alcoholic hydroxyl group, the vinyl-based polymer segment (a2) being bonded to the polysiloxane segment (a1) through a bond represented by general formula (3), and a polyisocyanate (B), wherein the content of the polysiloxane segment (a1) is 10% to 50% by weight relative to the total solid content of a curable resin composition, and the content of the polyisocyanate (B) is 5% to 50% by weight relative to the total solid content of the curable resin composition. There are also provided a solar cell module and a light-emitting diode that each use the sealing material.

摘要翻译： 提供了一种密封材料，其包括具有由通式（1）和/或通式（2）表示的结构单元的聚硅氧烷链段（a1）和硅烷醇基和/或可水解甲硅烷基的复合树脂（A） 和具有醇羟基的乙烯基类聚合物链段（a2），通过通式（3）表示的键与聚硅氧烷链段（a1）结合的乙烯基类聚合物链段（a2）和多异氰酸酯（B ），其中聚硅氧烷链段（a1）的含量相对于固化性树脂组合物的总固体成分为10〜50重量％，多异氰酸酯（B）的含量相对于5重量％〜50重量％ 相对于固化性树脂组合物的总固体成分。 还提供了各自使用密封材料的太阳能电池模块和发光二极管。