High voltage transistor scaling tilt ion implant method
    2.
    发明授权
    High voltage transistor scaling tilt ion implant method 失效
    高压晶体管缩放倾斜离子注入法

    公开(公告)号:US07011998B1

    公开(公告)日:2006-03-14

    申请号:US10756573

    申请日:2004-01-12

    IPC分类号: H01L21/336 H01L21/8234

    摘要: The present invention is a high voltage transistor formation method and system that includes a varying or gradient concentration lightly doped drain and source implant region. The lightly doped drain (LDD) implant region has gradient concentration characteristics that provide a higher concentration under a source and drain and lower concentration close to a surface source drain channel formation under a gate. A lightly doped drain tilt implant process is utilized to form a component area (e.g., a transistor source and/or drain area) with gradient doping profiles. The varying concentration profile provides a smooth electrical characteristic transformation between regions that reduces the probability of hot electron generation otherwise associated with electrical fields that cross abrupt changes between different conductivity orientation regions. The higher concentration of the light dopants at the bottom of the source and drain regions also helps reduce the probability of deep junction breakdown.

    摘要翻译: 本发明是一种高压晶体管形成方法和系统,其包括变化或梯度浓度的轻掺杂漏极和源极注入区域。 轻掺杂漏极(LDD)注入区域具有梯度浓度特性,其在靠近栅极处的表面源极沟道形成的源极和漏极以及较低的浓度下提供更高的浓度。 利用轻掺杂的漏极倾斜注入工艺来形成具有梯度掺杂分布的分量区域(例如,晶体管源极和/或漏极区域)。 变化的浓度分布提供了区域之间的平滑电特性转换,其减少热电子产生的可能性,否则与在不同导电取向区域之间交叉突变的电场相关。 在源极和漏极区域底部的较高浓度的光掺杂剂也有助于降低深结击穿的可能性。