公开(公告)号：US20060163073A1

公开(公告)日：2006-07-27

申请号：US10562712

申请日：2004-06-25

申请人： Nobuhiro Higashihara ,  Hideto Sakoda ,  Atsuyuki Nakagawa ,  Yoshiharu Dan ,  Katsunori Kita ,  Kouichirou Ikeuchi

发明人： Nobuhiro Higashihara ,  Hideto Sakoda ,  Atsuyuki Nakagawa ,  Yoshiharu Dan ,  Katsunori Kita ,  Kouichirou Ikeuchi

IPC分类号： C25D1/10 ,  C25D17/00

CPC分类号： H01G13/00 ,  C25D1/04 ,  H05K3/205 ,  H05K3/4629

摘要： A process for producing a metal plating film, comprising providing a base element with convex curved surface, depositing a metal plating film on the base element surface and detaching the metal plating film from the base element. The base element surface on which the metal plating film is deposited is convex curved, so that the metal plating film of convex sectional configuration is formed on the base element surface. Internal stress (tensile stress) occurs within the thus formed metal plating film, so that when the metal plating film is detached from the base element and transferred on a dielectric sheet, the metal plating film is transfigured toward planarization. Therefore, on transfer recipient materials, such as the dielectric sheet, having a metal plating film transferred thereonto, deformation and damaging of such a metal plating film can be effectively prevented to thereby contribute to an improvement of production efficiency.

摘要翻译： 一种金属电镀膜的制造方法，其特征在于，具有凸部的基体元件，在所述基体材料表面上形成金属电镀膜，从所述基体元件剥离所述金属电镀膜。 沉积有金属镀膜的基底表面是凸曲的，从而在基体表面上形成凸形截面形状的金属镀膜。 内部应力（拉伸应力）发生在这样形成的金属镀膜中，使得当金属镀膜从基体元件分离并转印到电介质片上时，金属镀膜变为平坦化。 因此，可以有效地防止在其上转印有金属镀膜的转印容器材料，例如电介质片材，从而有助于提高生产效率。

公开(公告)号：US06898069B2

公开(公告)日：2005-05-24

申请号：US10809251

申请日：2004-03-25

申请人： Katsuyoshi Yamaguchi ,  Nobuhiro Higashihara ,  Hideto Sakoda

发明人： Katsuyoshi Yamaguchi ,  Nobuhiro Higashihara ,  Hideto Sakoda

IPC分类号： H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01G13/00

CPC分类号： H01G4/30 ,  H01G4/012 ,  Y10T29/43 ,  Y10T29/435

摘要： A multilayer electronic component of the present invention includes dielectric layers (7) and internal electrode layers (5) that are alternatively laminated. The internal electrode layers (5) are exposed alternatively to opposite sides in a laminating direction. The multilayer electronic component has at both ends thereof external electrodes (3) connected to the internal electrode layers (5), and the thickness of a connected end of the internal electrode layers (5) with the external electrodes (3) is greater than the thickness of a non-connecting end. Therefore, even if the internal electrode layers (5) are thinned, the multilayer electronic component is excellent in electrical connection property between the internal electrode layer (5) and the external electrodes (5), thereby obtaining high electrostatic capacity.

摘要翻译： 本发明的多层电子部件包括层叠的电介质层（7）和内部电极层（5）。 内部电极层（5）以层叠方向交替地暴露于相对侧。 多层电子部件的两端部分与内部电极层（5）连接的外部电极（3），内部电极层（5）与外部电极（3）的连接端的厚度大于 不连接端的厚度。 因此，即使内部电极层（5）变薄，多层电子部件的内部电极层（5）和外部电极（5）的电连接性也优异，因此获得高的静电容量。