公开(公告)号：US4746397A

公开(公告)日：1988-05-24

申请号：US3716

申请日：1987-01-15

申请人： Nobuhisa Maeda ,  Takashi Suzuki ,  Shigeyuki Yamamoto

发明人： Nobuhisa Maeda ,  Takashi Suzuki ,  Shigeyuki Yamamoto

IPC分类号： H01L21/00 ,  H01L21/306 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06

CPC分类号： H01L21/67023

摘要： A treatment method for plate-shaped substrate capable of uniformly performing the treating operation, performing a large amount of treatment, and facilitating the automation of the work independently of the surface nature of the substrate such as base plates of Si wafer for integrated circuit manufacturing use. The method is achieved by making it easier for the whole substrate surface to be wetted with the treatment liquid, through exposing the substrate to liquid or gas material which is soluble mutually with a treatment liquid prior to treatment with the treating liquid, to avoid treatment and thus uneven treatment to improve the yield.

摘要翻译： 一种板状基板的处理方法，其能够均匀地进行处理操作，进行大量处理，并且便于独立于诸如用于集成电路制造用途的Si晶片的基板的基板的表面性质的工作自动化 。 该方法是通过使处理液更容易地将整个基材表面润湿，通过在用处理液处理之前将基材暴露于与处理液相溶的液体或气体材料，以避免处理和 因此不均匀处理提高产量。

公开(公告)号：US4524160A

公开(公告)日：1985-06-18

申请号：US577948

申请日：1984-01-27

申请人： Nobuhisa Maeda ,  Tadashi Sakairi ,  Tamotsu Wakahata

发明人： Nobuhisa Maeda ,  Tadashi Sakairi ,  Tamotsu Wakahata

IPC分类号： C08K9/00 ,  C08K9/04 ,  C08L1/00 ,  C08L7/00 ,  C08L21/00 ,  C08L23/00 ,  C08L27/00 ,  C08L51/00 ,  C08L51/02 ,  C08L101/00 ,  C08K7/00

CPC分类号： C08K9/04

摘要： A directly moldable resin composition for a composite plastic is disclosed, which comprises a predetermined amount of a mixture of pellets of a thermoplastic synthetic resin having an average size of 2.0 mm or larger and particles of a thermoplastic resin having an average size in a predetermined range, or particles of a thermoplastic resin alone having an average size of below 900 microns, and the balance of at least one filler such as particulate inorganic fillers or fibrous fillers. The particles of a thermoplastic resin should preferably be contained in an amount equal to or higher than 100% by volume of the at least one filler. When determined by a suspending tensile failure method at a tension speed of 2 mm/cm.sup.2, a particulate filler should preferably have an adhesion force in the range of below 4 g/cm.sup.2. Greater amounts of the mixture or the particles of thermoplastic resins can be used when the filler is treated on the surface thereof with organic compounds with a H.L.B. value below 13 so as to improve affinity for synthetic resins.

摘要翻译： 公开了一种用于复合塑料的可直接模塑的树脂组合物，其包含预定量的平均尺寸为2.0mm以上的热塑性合成树脂颗粒和平均尺寸在预定范围内的热塑性树脂颗粒 ，或平均粒径小于900微米的单独的热塑性树脂的颗粒，余量的至少一种填料如颗粒无机填料或纤维填料。 优选热塑性树脂的颗粒的含量应等于或高于至少一种填料的100体积％。 当以拉伸速度为2mm / cm 2的悬浮拉伸破坏方法测定时，颗粒填料应优选具有在4g / cm 2以下的粘合力。 当使用具有H.L.B的有机化合物在其表面上处理填料时，可以使用更大量的混合物或热塑性树脂颗粒。 值低于13，以提高对合成树脂的亲和力。

公开(公告)号：US5190590A

公开(公告)日：1993-03-02

申请号：US682110

申请日：1991-04-08

申请人： Masaki Suzuki ,  Hidetoshi Kawa ,  Shigeyuki Yamamoto ,  Nobuhisa Maeda

发明人： Masaki Suzuki ,  Hidetoshi Kawa ,  Shigeyuki Yamamoto ,  Nobuhisa Maeda

IPC分类号： C23C14/54 ,  C23C14/24 ,  C23C14/26 ,  C23C14/50 ,  C23C14/56 ,  H01L21/203 ,  H01L21/285

CPC分类号： C23C14/26 ,  C23C14/243 ,  C23C14/50

摘要： A vacuum coating apparatus for coating films on the surfaces of objects to be deposited under vacuum is provided with a vacuum deposition chamber, a carrier accommodated in the vacuum deposition chamber for carrying the objects, a rotary mechanism extending through the vacuum deposition chamber and being rotatable with respect to the carrier, and a container mounted on the rotary mechanism and accommodated in the vacuum deposition chamber. The container accommodates a material to be evaporated and is rotated by the rotary mechanism during a deposition operation while the objects are maintained stationary.

摘要翻译： 在真空沉积物体的表面上涂覆薄膜的真空镀膜装置设置有真空沉积室，容纳在真空沉积室中用于承载物体的载体，延伸穿过真空沉积室的旋转机构，并且可旋转 以及安装在旋转机构上并容纳在真空沉积室中的容器。 容器容纳待蒸发的材料，并且在沉积操作期间由旋转机构旋转，同时物体保持静止。