摘要:
A carboxyl resin according to the present invention is obtained by a process including following steps: epoxy groups on a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.85 mol of a monocarboxylic acid (b) per one epoxy-group equivalent weight to obtain a reaction product (c); the epoxy group or groups on the reaction product (c) are made to react with 0.15-0.95 mol of a polybasic acid (d) per one epoxy-group equivalent weight to obtain a reaction product (e); and the epoxy group or groups on the reaction product (e) are further made to react with 1.0-5.0 mol of a monocarboxylic acid (f) per one epoxy-group equivalent weight. The carboxyl resin thus obtained has an acid value within a range from 20 to 200 mgKOH/g and is soluble in an organic solvent.
摘要:
A carboxyl resin according to the present invention is obtained by a process including following steps: epoxy groups on a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.85 mol of a monocarboxylic acid (b) per one epoxy-group equivalent weight to obtain a reaction product (c); the epoxy group or groups on the reaction product (c) are made to react with 0.15-0.95 mol of a polybasic acid (d) per one epoxy-group equivalent weight to obtain a reaction product (e); and the epoxy group or groups on the reaction product (e) are further made to react with 1.0-5.0 mol of a monocarboxylic acid (f) per one epoxy-group equivalent weight. The carboxyl resin thus obtained has an acid value within a range from 20 to 200 mgKOH/g and is soluble in an organic solvent.
摘要:
An ultraviolet-curable type photo solder resist ink comprises the following components (A) to (E). That is. the component (A) is an ultraviolet-curable resin having at least two ethylenically unsaturated groups and a carboxyl group per one molecule thereof. The component (B) is an epoxy compound having at least two epoxy groups per one molecule thereof. The component (C) is at least one selected from a compound having at least one carboxyl group and a polycarboxylic acid anhydride. The component (D) is a photopolymerization initiator. The component (E) is a diluent. This photo solder resist ink shows a good developing property even when a developer having a pH value of about 10 is used, and is excellent in a storage stability of resist, electrical corrosion resistance, electric performance, chemical resistance, plating resistance, heat resistance to solder, adhesion, and pencil hardness.