公开(公告)号：US20180181001A1

公开(公告)日：2018-06-28

申请号：US15736262

申请日：2016-06-20

申请人： NISSAN CHEMICAL INDUSTRIES, LTD.

发明人： Takafumi ENDO ,  Daigo SAITO ,  Ryo KARASAWA ,  Rikimaru SAKAMOTO

IPC分类号： G03F7/11 ,  C09D163/00 ,  C09D5/00 ,  G03F7/004 ,  H01L21/308 ,  G03F7/16 ,  G03F7/20 ,  G03F7/26

CPC分类号： G03F7/11 ,  C08G59/182 ,  C08G59/184 ,  C08G59/186 ,  C09D5/006 ,  C09D163/00 ,  G03F7/0045 ,  G03F7/091 ,  G03F7/094 ,  G03F7/16 ,  G03F7/2002 ,  G03F7/2037 ,  G03F7/26 ,  H01L21/3081 ,  H01L21/3086

摘要： A resist underlayer film-forming composition in which a coating film having high flattening properties is formed on a substrate. A resist underlayer film-forming composition including an epoxy adduct (C) obtained by reacting an epoxy group-containing compound (A) with an epoxy adduct-forming compound (B), wherein one or both of the epoxy group-containing compound (A) and the epoxy adduct-forming compound (B) contain an optionally branched alkyl group having a carbon atom number of three or more. The epoxy adduct-forming compound (B) is at least one compound selected from the group consisting of carboxylic acid (B1), carboxylic anhydride (B2), a phenol compound (B3), a hydroxyl group-containing compound (B4), a thiol compound (B5), an amino compound (B6), and an imide compound (B7). The optionally branched alkyl group having a carbon atom number of three or more is contained in the epoxy adduct-forming compound (B). The optionally branched alkyl group has a C3-19 alkyl group.

公开(公告)号：US09884960B2

公开(公告)日：2018-02-06

申请号：US15044347

申请日：2016-02-16

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Yoshihiro Tsutsumi ,  Tadashi Tomita

IPC分类号： C08L63/00 ,  C08L53/00 ,  C08L33/06 ,  C08G59/20 ,  C08G59/32 ,  C08G59/42 ,  C08K3/22 ,  C08K9/00 ,  C08K13/06 ,  C08K3/00 ,  C08K3/36 ,  C08K5/00 ,  C08K5/09 ,  C08K5/3447 ,  C08K9/02 ,  H01L33/56 ,  H01L23/06 ,  H01L33/60 ,  C09C1/00 ,  C09C1/36 ,  C08G59/18 ,  C08L63/06 ,  H01L33/00

CPC分类号： C08L63/00 ,  C08G59/186 ,  C08G59/3245 ,  C08G59/42 ,  C08K2003/2241 ,  C08L33/06 ,  C08L53/00 ,  C08L63/06 ,  H01L33/00 ,  H01L33/56

摘要： Provided are a white heat-curable epoxy resin composition having a high strength, high toughness and superior heat resistance; and a semiconductor device whose light receiving and other semiconductor elements are encapsulated by a cured product of such composition. The composition includes: (A) a prepolymer obtained by heating, melting and mixing components (A-1) triazine derivative epoxy resin, (A-2) acid anhydride and (A-3) acrylic block copolymer so as to react them at an epoxy group equivalent in the component (A-1)/acid anhydride group equivalent of the component (A-2) ratio of 0.6 to 2.0; (B) a white pigment including at least a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.

公开(公告)号：US09701864B2

公开(公告)日：2017-07-11

申请号：US14403741

申请日：2013-05-29

申请人： DOW GLOBAL TECHNOLOGIES LLC

发明人： Yinzhong Guo ,  Susan Machelski ,  Christian Piechocki

IPC分类号： C09D163/00 ,  C09D163/02 ,  C08L63/00 ,  C08L67/02 ,  C08G59/16 ,  C08G59/18 ,  C08G59/22 ,  C08G59/42 ,  C09D5/02

CPC分类号： C09D163/00 ,  C08G59/186 ,  C08G59/226 ,  C08G59/4246 ,  C08L67/02 ,  C09D5/02

摘要： The present invention relates to compounds comprising the epoxide functional reaction product of: (a) at least one molecule comprising two terminal epoxy-reactive moieties; with (b) two molecules comprising two epoxide moieties; wherein, said compound comprises, pendent to the residue of (a) (i.e. as a side chain of the molecule), one or more polyoxyalkylene or polyoxyalkylene alkyl ether radical(s) having a weight average molecular weight of at least 400. Also provided are aqueous coating compositions comprising such compounds.

公开(公告)号：US09235121B2

公开(公告)日：2016-01-12

申请号：US14237618

申请日：2012-08-09

申请人： Toshimasa Nagoshi ,  Shigeo Tanaka

发明人： Toshimasa Nagoshi ,  Shigeo Tanaka

IPC分类号： G03F7/038 ,  G03F7/004 ,  G03F7/027 ,  H05K3/28 ,  C08G59/18 ,  C08L63/00 ,  C08L63/10

CPC分类号： G03F7/0388 ,  C08G59/1455 ,  C08G59/186 ,  C08L63/00 ,  C08L63/10 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0385 ,  H05K3/287 ,  H05K2201/0209

摘要： The present invention provides a photosensitive resin composition comprising an (a) component: an acid-modified epoxy resin, a (b) component: a photopolymerizable monomer having an ethylenically unsaturated group, a (c) component: a photopolymerization initiator, a (d) component: an epoxy resin, and an (e) component: an inorganic filler, wherein the (a) component comprises an acid-modified bisphenol novolak type epoxy resin and further the photosensitive resin composition satisfies a predetermined condition, and provides a photosensitive film, a permanent resist and a method for producing a permanent resist using the same.

摘要翻译： 本发明提供一种感光性树脂组合物，其包含（a）成分：酸改性环氧树脂，（b）成分：具有烯键式不饱和基团的光聚合性单体，（c）成分：光聚合引发剂，（d ）组分：环氧树脂和（e）组分：无机填料，其中（a）组分包含酸改性的双酚型酚醛清漆型环氧树脂，并且感光性树脂组合物还满足预定条件，并提供感光性膜 永久抗蚀剂和使用其的永久抗蚀剂的制造方法。

公开(公告)号：US20140154628A1

公开(公告)日：2014-06-05

申请号：US14237618

申请日：2012-08-09

申请人： Toshimasa Nagoshi ,  Shigeo Tanaka

发明人： Toshimasa Nagoshi ,  Shigeo Tanaka

IPC分类号： G03F7/038

CPC分类号： G03F7/0388 ,  C08G59/1455 ,  C08G59/186 ,  C08L63/00 ,  C08L63/10 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0385 ,  H05K3/287 ,  H05K2201/0209

摘要： The present invention provides a photosensitive resin composition comprising an (a) component: an acid-modified epoxy resin, a (b) component: a photopolymerizable monomer having an ethylenically unsaturated group, a (c) component: a photopolymerization initiator, a (d) component: an epoxy resin, and an (e) component: an inorganic filler, wherein the (a) component comprises an acid-modified bisphenol novolak type epoxy resin and further the photosensitive resin composition satisfies a predetermined condition, and provides a photosensitive film, a permanent resist and a method for producing a permanent resist using the same.

摘要翻译： 本发明提供一种感光性树脂组合物，其包含（a）成分：酸改性环氧树脂，（b）成分：具有烯键式不饱和基团的光聚合性单体，（c）成分：光聚合引发剂，（d ）组分：环氧树脂和（e）组分：无机填料，其中（a）组分包含酸改性的双酚型酚醛清漆型环氧树脂，并且感光性树脂组合物还满足预定条件，并提供感光性膜 永久抗蚀剂和使用其的永久抗蚀剂的制造方法。

公开(公告)号：US08702943B2

公开(公告)日：2014-04-22

申请号：US12344753

申请日：2008-12-29

申请人： Timothy S December ,  Abdellatif Chouai ,  Cynthia A Stants

发明人： Timothy S December ,  Abdellatif Chouai ,  Cynthia A Stants

IPC分类号： C25D13/06 ,  C08G59/42

CPC分类号： C25D13/12 ,  C08G59/186 ,  C08G59/304 ,  C08G59/621 ,  C08L63/00 ,  C09D5/4411 ,  C09D5/4449 ,  C09D163/00 ,  C25D13/02

摘要： An aqueous electrodeposition coating composition comprising a cathodically electrodepositable binder, the binder comprising a phosphorylated resin and a carboxyl group separated by from 2 to 4 carbons from an ester group, provides corrosion protection equivalent to that obtained by the conventional phosphate pretreatment-electrodeposition coating process.

摘要翻译： 包含阴极电沉积粘合剂的水性电沉积涂料组合物，所述粘合剂包含磷酸化树脂和从酯基分离出2至4个碳的羧基，提供与通过常规磷酸盐预处理电沉积涂覆方法获得的腐蚀保护相当的腐蚀保护。

公开(公告)号：US20110220401A1

公开(公告)日：2011-09-15

申请号：US12762892

申请日：2010-04-19

申请人： Yurong Ying ,  John J. McNamara ,  Jing Liang ,  Rong-Chang Liang

发明人： Yurong Ying ,  John J. McNamara ,  Jing Liang ,  Rong-Chang Liang

IPC分类号： B32B27/38 ,  C08L63/00 ,  B32B3/10 ,  H05K1/16

CPC分类号： C09J163/00 ,  C08G18/58 ,  C08G18/758 ,  C08G18/7664 ,  C08G59/186 ,  C08G59/4261 ,  C08G59/50 ,  C08J3/241 ,  C08J2363/00 ,  C08L63/00 ,  C09D163/00 ,  C09J9/02 ,  H05K3/303 ,  H05K3/321 ,  Y10T428/24802 ,  Y10T428/2848 ,  Y10T428/31511 ,  Y10T428/31515

摘要： A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.

摘要翻译： 一种由胺，环氧树脂和弹性体 - 环氧加成物的反应产物组成的环氧树脂固化剂; 含有固化剂和环氧树脂的组合物; 该组合物可用于电子显示器，电路板，半导体器件，倒装芯片和其它应用中。

公开(公告)号：US07906562B2

公开(公告)日：2011-03-15

申请号：US12223793

申请日：2007-12-21

申请人： Kazuo Ishihara

发明人： Kazuo Ishihara

IPC分类号： C08G59/00 ,  C08G59/14 ,  C08G65/04

CPC分类号： C08G59/186 ,  C09D163/00

摘要： An epoxy resin possessing one or more primary hydroxyl groups and one or more epoxy groups in one molecule is useful in a photo-curing method.

摘要翻译： 在一个分子中具有一个或多个伯羟基和一个或多个环氧基的环氧树脂可用于光固化方法。

公开(公告)号：US20100280143A1

公开(公告)日：2010-11-04

申请号：US12546862

申请日：2009-08-25

申请人： Jauder Jeng ,  Man-Lin Chen ,  Pei-Ching Liu ,  Tien-Shou Shieh

发明人： Jauder Jeng ,  Man-Lin Chen ,  Pei-Ching Liu ,  Tien-Shou Shieh

IPC分类号： C08F2/46

CPC分类号： C08G59/186 ,  C08G59/5073 ,  C08K5/07 ,  C08K5/5397 ,  C08L63/10 ,  C08L2666/22 ,  C09J163/10

摘要： A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40° C. and the bisphenol F epoxy resin has a melting point lower than 40° C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator.

摘要翻译： 提供密封剂组合物。 密封剂组合物包含（a）包含不饱和单羧酸改性双酚A环氧树脂和不饱和单羧酸改性双酚F环氧树脂的低聚物，其中双酚A环氧树脂与双酚F环氧树脂的当量比 为0.05:0.95至0.3:0.7，双酚A环氧树脂的熔点高于40℃，双酚F环氧树脂的熔点低于40℃。 （b）具有至少两个或多于两个环氧基团的环氧树脂; 和（c）光引发剂。

公开(公告)号：US06573309B1

公开(公告)日：2003-06-03

申请号：US09914555

申请日：2001-08-31

申请人： Dirk Reitenbach ,  Xaver Muenz

发明人： Dirk Reitenbach ,  Xaver Muenz

IPC分类号： C08J902

CPC分类号： C08J9/0061 ,  C08G59/186 ,  C08G59/4021 ,  C08J9/32 ,  C08J2363/00 ,  C08J2463/00

摘要： Foamable compositions which exhibit reduced surface tack and better handling characteristics are obtained through the use of specific combinations of epoxy resins. One or more solid epoxy resins are utilized together with liquid and/or semi-solid epoxy resins. The compositions, which preferably contain hollow glass microspheres, are capable of providing foams which are useful in the manufacture of reinforced structural members.

摘要翻译： 通过使用环氧树脂的特定组合可获得表现出降低的表面粘着性和更好的操作特性的可发泡组合物。 一种或多种固体环氧树脂与液体和/或半固体环氧树脂一起使用。 优选含有中空玻璃微球的组合物能够提供可用于制造增强结构构件的泡沫。