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公开(公告)号:US4257834A
公开(公告)日:1981-03-24
申请号:US27324
申请日:1979-04-05
申请人: Kosuke Iida , Tadayuki Morikawa , Mitsuo Aoki , Isamu Ueda , Takashi Butsuda , Osami Tsuda
发明人: Kosuke Iida , Tadayuki Morikawa , Mitsuo Aoki , Isamu Ueda , Takashi Butsuda , Osami Tsuda
IPC分类号: B29C65/00 , B28B1/30 , B29B7/00 , B29C31/00 , B29C39/00 , B29C39/16 , B29C39/20 , B29C39/24 , B29C41/28 , B29C43/22 , B29C61/00 , B29C67/00 , B29D7/00 , B29D99/00 , B29K105/04 , B29L7/00 , D06N7/00 , B29J5/00 , B32B5/16
CPC分类号: B29C43/22 , B29C70/58 , D06N7/0052 , B29L2007/00 , Y10T156/1023 , Y10T156/1052 , Y10T428/166 , Y10T428/25 , Y10T428/252 , Y10T428/253 , Y10T428/254 , Y10T428/256 , Y10T428/29
摘要: A process for manufacturing a sheet having a chip-like design composed of a plurality of chips densely aligned in a plane without overlapping and a solidified binder uniformly filling the interstices among the chips and firmly and integrally bonding the chips to one another in sheet form. The sheet is useful as a floor material, wall material, and the like.
摘要翻译: 一种用于制造具有芯片状设计的片材的方法,该芯片状设计由在不平面重叠的平面中密集排列的多个芯片组成,并且固化的粘合剂均匀地填充芯片之间的间隙,并且以片状形式将芯片彼此牢固且一体地结合。 该片材可用作地板材料,壁材料等。