公开(公告)号：US5928754A

公开(公告)日：1999-07-27

申请号：US676394

申请日：1996-07-22

Applicant: Michio Kondo ,  Takashi Butsuda ,  Xue Fang Song

Inventor： Michio Kondo ,  Takashi Butsuda ,  Xue Fang Song

IPC: B32B27/18 ,  B32B27/32 ,  D06N3/00 ,  D06N3/04 ,  D06N7/02 ,  B32B9/00

CPC classification number: D06N3/0056 ,  B32B27/18 ,  B32B27/32 ,  D06N3/0061 ,  D06N3/045 ,  Y10S524/914 ,  Y10T428/23979 ,  Y10T428/24372 ,  Y10T428/24504 ,  Y10T428/24777 ,  Y10T428/24942 ,  Y10T428/249982 ,  Y10T428/254 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/2982

Abstract: A floor material which generates no harmful gas such as hydrogen chloride at the time of a fire, is suitable for dry maintenance with a high speed buffing machine and has excellent resistances against flaws, stains, abrasion and the like, which is also a floor material having markedly excellent adhesiveness to the floor ground. This invention is characterized in that a wax is contained in an amount of from 1 to 10% by weight in at least the surface layer of the floor material in which an olefinic resin is used as the base material and an inorganic filler is blended therein. Preferably, a back side layer of an ethylene-vinyl acetate copolymer or a mixed resin of said copolymer and other olefinic resin is used as its base material having an inorganic filler is blended therein is laminated on the under side of the surface layer, and 1 to 10% by weight of rosin is included in said back side layer. The inventive floor material can be used broadly as the flooring in, for example, constructions such as buildings, apartment houses and the like and transportation means such as cars, ships, aircraft and the like.

Abstract translation: PCT No.PCT / JP95 / 01282 Sec。 371日期：1996年7月22日 102（e）日期1996年7月22日PCT提交1995年6月27日PCT公布。 WO96 / 16803 PCT出版物 日期1996年6月6日在火灾时不产生氯化氢等有害气体的地板材料适用于高速抛光机的干燥维护，并且具有优异的抗瑕疵，污渍，磨损等的耐受性， 也是具有与地面接地性能显着优异粘合性的地板材料。 本发明的特征在于，在使用烯烃树脂作为基材的地板材料的至少表面层中掺入1〜10重量％的蜡和无机填料。 优选地，将乙烯 - 乙酸乙烯酯共聚物的背面层或所述共聚物和其它烯烃树脂的混合树脂用作其中混合有无机填料的基材层压在表面层的下侧，并且将1 至10重量％的松香包括在所述背面层中。 本发明的地板材料可以广泛地用作例如建筑物，公寓等的结构以及诸如汽车，船舶，飞机等的运输工具的地板。

公开(公告)号：US4257834A

公开(公告)日：1981-03-24

申请号：US27324

申请日：1979-04-05

Applicant: Kosuke Iida ,  Tadayuki Morikawa ,  Mitsuo Aoki ,  Isamu Ueda ,  Takashi Butsuda ,  Osami Tsuda

Inventor： Kosuke Iida ,  Tadayuki Morikawa ,  Mitsuo Aoki ,  Isamu Ueda ,  Takashi Butsuda ,  Osami Tsuda

IPC: B29C65/00 ,  B28B1/30 ,  B29B7/00 ,  B29C31/00 ,  B29C39/00 ,  B29C39/16 ,  B29C39/20 ,  B29C39/24 ,  B29C41/28 ,  B29C43/22 ,  B29C61/00 ,  B29C67/00 ,  B29D7/00 ,  B29D99/00 ,  B29K105/04 ,  B29L7/00 ,  D06N7/00 ,  B29J5/00 ,  B32B5/16

CPC classification number: B29C43/22 ,  B29C70/58 ,  D06N7/0052 ,  B29L2007/00 ,  Y10T156/1023 ,  Y10T156/1052 ,  Y10T428/166 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/253 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/29

Abstract: A process for manufacturing a sheet having a chip-like design composed of a plurality of chips densely aligned in a plane without overlapping and a solidified binder uniformly filling the interstices among the chips and firmly and integrally bonding the chips to one another in sheet form. The sheet is useful as a floor material, wall material, and the like.

Abstract translation: 一种用于制造具有芯片状设计的片材的方法，该芯片状设计由在不平面重叠的平面中密集排列的多个芯片组成，并且固化的粘合剂均匀地填充芯片之间的间隙，并且以片状形式将芯片彼此牢固且一体地结合。 该片材可用作地板材料，壁材料等。