公开(公告)号：US20090032893A1

公开(公告)日：2009-02-05

申请号：US11882441

申请日：2007-08-01

申请人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chung Peter Zung

发明人： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chung Peter Zung

IPC分类号： H01L31/0203 ,  H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14683 ,  H01L21/304 ,  H01L21/76898 ,  H01L24/06 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2224/10

摘要： An image sensor package and method for fabricating the same is provided. The image sensor package includes a first substrate comprising a via hole therein, a driving circuit and a first conductive pad thereon. A second substrate comprising a photosensitive device and a second conductive pad thereon is bonded to the first substrate, so that the driving circuit, formed on the first substrate, can electrically connect to and further control the photosensitive device, formed on the second substrate. A solder ball is formed on a backside of the first substrate and electrically connects to the via hole for transmitting a signal from the driving circuit. Because the photosensitive device and the driving circuit are fabricated individually on the different substrates, fabrication and design thereof is more flexible. Moreover, the image sensor package is relatively less thick, thus, the dimensions thereof are reduced.

摘要翻译： 提供了一种图像传感器封装及其制造方法。 图像传感器封装包括其中包括通孔的第一基板，驱动电路和其上的第一导电焊盘。 包括其上的光敏器件和第二导电焊盘的第二衬底被结合到第一衬底，使得形成在第一衬底上的驱动电路可以电连接到并进一步控制形成在第二衬底上的光敏器件。 在第一基板的背面上形成焊球，并且电连接到用于传输来自驱动电路的信号的通孔。 由于感光装置和驱动电路分别制造在不同的基板上，所以其制造和设计更灵活。 此外，图像传感器封装相对较薄，因此其尺寸减小。