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1.发明授权Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink 失效导热基板压装在PC板孔中，用于将热量从IC传递到散热片
公开(公告)号：US6018193A
公开(公告)日：2000-01-25
申请号：US343161
申请日：1999-06-28
CPC分类号： H05K1/0204 , H01L23/3677 , H01L23/4006 , H01L24/50 , H01L2924/14 , H05K2201/10409 , H05K2201/10416 , H05K2201/1059 , H05K2201/10681 , H05K2203/0191 , Y10T29/49126 , Y10T29/4913
摘要： A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery of the substrate.
摘要翻译： 导热基板安装在印刷电路板的通孔内。 然后将集成电路安装到导热基板的一侧，同时将散热器固定成与基板的另一侧热接触。 IC和PC板之间没有直接的热接触通过对基板的多个部分的法向表面施加受控压力将导热基板安装到PC板。 这样的压力减小了厚度，并将压制部分的面积扩大，将基板锁定到PC板上。 在衬底和PCB板之间，除了衬底的压制区域之外，还发生气隙。 这种压制区域沿着衬底的周边发生。
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2.发明授权Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink 失效导热基板压装在PC板孔中，用于将热量从IC传递到散热片
公开(公告)号：US5960535A
公开(公告)日：1999-10-05
申请号：US958954
申请日：1997-10-28
CPC分类号： H05K1/0204 , H01L23/3677 , H01L23/4006 , H01L24/50 , H01L2924/14 , H05K2201/10409 , H05K2201/10416 , H05K2201/1059 , H05K2201/10681 , H05K2203/0191 , Y10T29/49126 , Y10T29/4913
摘要： A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery of the substrate.
摘要翻译： 导热基板安装在印刷电路板的通孔内。 然后将集成电路安装到导热基板的一侧，同时将散热器固定成与基板的另一侧热接触。 IC和PC板之间没有直接的热接触。 通过对基板的多个部分的正常表面施加受控压力将导热基板安装到PC板。 这样的压力减小了厚度，并将压制部分的面积扩大，将基板锁定到PC板上。 在衬底和PCB板之间，除了衬底的压制区域之外，还发生气隙。 这种压制区域沿着衬底的周边发生。
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3.发明授权Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink 失效安装在PC板上的导热基板用于将热量从IC传递到散热片
公开(公告)号：US5825625A
公开(公告)日：1998-10-20
申请号：US728394
申请日：1996-10-09
IPC分类号： H01L23/36 , H01L23/367 , H01L23/40 , H05K1/02 , H05K7/20
CPC分类号： H05K1/0204 , H01L23/3677 , H01L23/4006 , H01L24/50 , H01L2023/4062 , H01L2023/4068 , H01L2924/07802 , H01L2924/14 , H05K2201/09054 , H05K2201/10409 , H05K2201/10416 , H05K2201/10681 , H05K2203/0191
摘要： A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The substrate is mounted to an undersurface of the PC board and concentrically spaced from the PC board within the opening. An air gap occurs between the substrate and the PC board within the opening to substantially reduce heat conductivity into the PC board.
摘要翻译： 导热基板安装在印刷电路板的通孔内。 然后将集成电路安装到导热基板的一侧，同时将散热器固定成与基板的另一侧热接触。 IC和PC板之间没有直接的热接触。 基板被安装到PC板的下表面并与开口内的PC板同心地间隔开。 在开口之间的衬底和PC板之间产生气隙，以大大降低PC板的导热性。
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