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公开(公告)号：US07625218B2
公开(公告)日：2009-12-01
申请号：US12349484
申请日：2009-01-06
Applicant: Philip van Haaster
Inventor： Philip van Haaster
CPC classification number: H01R13/035 , H05K3/341 , H05K3/4015 , H05K2201/0133 , Y10T29/49117 , Y10T29/4913 , Y10T29/49204
Abstract: According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.
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公开(公告)号：US20080166927A1
公开(公告)日：2008-07-10
申请号：US11757819
申请日：2007-06-04
Applicant: Philip van Haaster
Inventor： Philip van Haaster
IPC: H01R13/405
CPC classification number: H01R13/035 , H05K3/341 , H05K3/4015 , H05K2201/0133 , Y10T29/49117 , Y10T29/4913 , Y10T29/49204
Abstract: According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.
Abstract translation: 根据各个方面，提供了可与表面贴装技术兼容的触点的示例性实施例。 触点可以是表面安装的，用于建立从基板上的至少一个导电表面到另一个导电表面（例如，EMI屏蔽，电池触点等）的电路径（例如，电接地触点等） 。 在一个示例性实施例中，触头通常包括弹性介电芯构件。 至少一个外部导电层被电涂覆到弹性介电芯体上。 可焊接的导电基底构件可以连接到弹性芯构件和/或外部导电层。 基底构件可以与外部导电层电接触。
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公开(公告)号：US07135643B2
公开(公告)日：2006-11-14
申请号：US10319797
申请日：2002-12-13
Applicant: Philip van Haaster , Edward Nakauchi , Richard Norman Johnson
Inventor： Philip van Haaster , Edward Nakauchi , Richard Norman Johnson
IPC: H05K9/00
CPC classification number: H05K9/0088 , G02B6/4277 , H01L23/552 , H01L2924/16152 , H05K9/0058 , Y10T428/25
Abstract: Lossy materials can be used to suppress EMI transmission. Disclosed are methods for applying lossy materials to EMI shielded enclosures to improve EMI shielding effectiveness and the EMI shielded enclosures so produced. In some embodiments, the EMI shielded enclosure includes a printed-circuit board mountable device. In one embodiment, lossy material can be applied to the interior of an EMI shielded enclosure using an adhesive. In another embodiment, lossy materials can be applied to the exterior of the EMI enclosure to suppress EMI incident upon the EMI shielded enclosure, thereby reducing the susceptibility of electronics contained within the EMI shielded enclosure. In yet another embodiment, lossy materials can be applied to both the interior and exterior of the EMI enclosure.
Abstract translation: 有损材料可用于抑制EMI传输。 公开了将有害材料应用于EMI屏蔽外壳以提高EMI屏蔽效能的方法和如此制造的EMI屏蔽外壳。 在一些实施例中，EMI屏蔽外壳包括印刷电路板可安装装置。 在一个实施例中，可以使用粘合剂将损耗材料施加到EMI屏蔽外壳的内部。 在另一个实施例中，有损耗材料可以施加到EMI外壳的外部，以抑制入射到EMI屏蔽外壳上的EMI，从而降低EMI屏蔽外壳内的电子元件的敏感性。 在另一个实施例中，损耗材料可以应用于EMI外壳的内部和外部。
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公开(公告)号：USRE42512E1
公开(公告)日：2011-07-05
申请号：US12268250
申请日：2008-11-10
Applicant: Michael R. Lambert , Jeff McFadden , Philip van Haaster
Inventor： Michael R. Lambert , Jeff McFadden , Philip van Haaster
CPC classification number: H05K9/0041
Abstract: Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb. In yet another embodiment, the metallized dielectric honeycomb substrate can be utilized in a framed configuration to provide improved durability.
Abstract translation: 公开了用于在提供EMI屏蔽的同时通过蜂窝式空气滤清器改善弹性和气流的方法和装置。 在一个实施例中，与传统的铝蜂窝体相比，蜂窝体可以由电介质（例如，塑料）基板制造，以提供改进的抗变形性。 电介质蜂窝状基体被金属化以提供EMI屏蔽能力。 金属化蜂窝状基体被切割成稍大的尺寸以适合电子外壳中的开口，这导致弹性周边弹簧指的弹性变形，其用于将金属化的电介质蜂窝保持在适当位置并且在金属化电介质基底和外壳之间提供导电性 ，从而消除了帧的使用。 在另一个实施例中，可以向金属化介电蜂窝体添加额外的导电层。 在另一个实施例中，金属化介电蜂窝体基底可以以框架构型使用以提供改善的耐久性。
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公开(公告)号：US07883340B2
公开(公告)日：2011-02-08
申请号：US12627891
申请日：2009-11-30
Applicant: Philip van Haaster
Inventor： Philip van Haaster
CPC classification number: H01R13/035 , H05K3/341 , H05K3/4015 , H05K2201/0133 , Y10T29/49117 , Y10T29/4913 , Y10T29/49204
Abstract: According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.
Abstract translation: 根据各个方面，提供了可与表面贴装技术兼容的触点的示例性实施例。 触点可以是表面安装的，用于建立从基板上的至少一个导电表面到另一个导电表面（例如，EMI屏蔽，电池触点等）的电路径（例如，电接地触点等） 。 在一个示例性实施例中，触头通常包括弹性介电芯构件。 至少一个外部导电层被电涂覆到弹性介电芯体上。 可焊接的导电基底构件可以连接到弹性芯构件和/或外部导电层。 基底构件可以与外部导电层电接触。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20090114438A1
公开(公告)日：2009-05-07
申请号：US12025231
申请日：2008-02-04
Applicant: Philip van Haaster
Inventor： Philip van Haaster
IPC: H05K9/00
CPC classification number: H05K9/0015 , Y10S277/92
Abstract: According to various aspects, exemplary embodiments are provided of fabric-over-foam EMI gaskets. In one exemplary embodiment, a fabric-over-foam EMI gasket generally includes a resiliently compressible foam core and an outer electrically-conductive fabric layer. At least one slit extends generally transversely across an upper surface portion of a longitudinally extending region of the gasket.
Abstract translation: 根据各个方面，提供了泡沫织物EMI垫片的示例性实施例。 在一个示例性实施例中，泡沫织物EMI垫片通常包括可弹性压缩的泡沫芯和外部导电织物层。 至少一个狭缝大致横向延伸穿过垫圈的纵向延伸区域的上表面部分。
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公开(公告)号：US20090111290A1
公开(公告)日：2009-04-30
申请号：US12349484
申请日：2009-01-06
Applicant: Philip van Haaster
Inventor： Philip van Haaster
CPC classification number: H01R13/035 , H05K3/341 , H05K3/4015 , H05K2201/0133 , Y10T29/49117 , Y10T29/4913 , Y10T29/49204
Abstract: According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.
Abstract translation: 根据各个方面，提供了可与表面贴装技术兼容的触点的示例性实施例。 触点可以是表面安装的，用于建立从基板上的至少一个导电表面到另一个导电表面（例如，EMI屏蔽，电池触点等）的电路径（例如，电接地接触等） 。 在一个示例性实施例中，触头通常包括弹性介电芯构件。 至少一个外部导电层被电涂覆到弹性介电芯体上。 可焊接的导电基底构件可以连接到弹性芯构件和/或外部导电层。 基底构件可以与外部导电层电接触。
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公开(公告)号：USD728773S1
公开(公告)日：2015-05-05
申请号：US29420326
申请日：2012-05-08
Applicant: Philip van Haaster
Designer： Philip van Haaster
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公开(公告)号：US20100266246A1
公开(公告)日：2010-10-21
申请号：US12761115
申请日：2010-04-15
Applicant: Philip van Haaster
Inventor： Philip van Haaster
CPC classification number: G02B6/4201 , G02B6/4246 , G02B6/4277 , H05K9/0016 , Y10T29/49826
Abstract: An electromagnetic interference (EMI) shielding and/or grounding gasket generally includes one or more sides and slots along the one or more sides. Finger elements are defined by the slots. The finger elements include contact portions for electrically contacting at least one electrically conductive surface adjacent to a mounting surface when the gasket is mounted thereto with its one or more sides disposed about and in electrical contact with the mounting surface. The gasket may thus be operable for establishing an electrically conductive pathway between the electrically-conductive surface and the mounting surface.
Abstract translation: 电磁干扰（EMI）屏蔽和/或接地垫片通常包括沿一个或多个侧面的一个或多个侧面和狭槽。 手指元素由插槽定义。 手指元件包括接触部分，用于当垫圈被安装到其上时，使其至少一个与安装表面相邻的导电表面电接触，其一个或多个侧面设置在安装表面周围并与安装表面电接触。 因此，垫圈可操作用于在导电表面和安装表面之间建立导电路径。
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公开(公告)号：USRE41594E1
公开(公告)日：2010-08-31
申请号：US11516803
申请日：2006-09-05
Applicant: Michael Lambert , Jeff McFadden , Philip van Haaster
Inventor： Michael Lambert , Jeff McFadden , Philip van Haaster
CPC classification number: H05K9/0041
Abstract: Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb. In yet another embodiment, the metallized dielectric honeycomb substrate can be utilized in a framed configuration to provide improved durability.
Abstract translation: 公开了用于在提供EMI屏蔽的同时通过蜂窝式空气滤清器改善弹性和气流的方法和装置。 在一个实施例中，与传统的铝蜂窝体相比，蜂窝体可以由电介质（例如，塑料）基板制造，以提供改进的抗变形性。 电介质蜂窝状基体被金属化以提供EMI屏蔽能力。 金属化蜂窝状基体被切割成稍大的尺寸以适合电子外壳中的开口，这导致弹性周边弹簧指的弹性变形，其用于将金属化的电介质蜂窝保持在适当位置并且在金属化电介质基底和外壳之间提供导电性 ，从而消除了帧的使用。 在另一个实施例中，可以向金属化介电蜂窝体添加额外的导电层。 在另一个实施例中，金属化介电蜂窝体基底可以以框架构型使用以提供改善的耐久性。
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