公开(公告)号：US20240343904A1

公开(公告)日：2024-10-17

申请号：US18580084

申请日：2022-06-15

申请人： POLYPLASTICS-EVONIK CORPORATION

发明人： Mitsuteru MUTSUDA ,  Takuya OCHIAI ,  Daisuke FUJIKI

IPC分类号： C08L77/10 ,  B32B25/04 ,  B32B27/08 ,  B32B27/34 ,  B32B38/00 ,  C08J5/18

CPC分类号： C08L77/10 ,  B32B25/04 ,  B32B27/08 ,  B32B27/34 ,  B32B38/004 ,  C08J5/18 ,  B32B2038/0076 ,  B32B2250/02 ,  B32B2307/51 ,  B32B2319/00 ,  B32B2377/00 ,  C08J2377/10

摘要： The present disclosure provides a thermoplastic resin composition and the like to be used for molding a resin sheet, in which the resin sheet is to be used in cross-linking adhesion with rubber. The thermoplastic resin composition includes a thermoplastic resin including a first polyamide (A) having a melting point of from 180° C. to 230° C. and a block copolymer (B) containing a second polyamide and a polyether. A ratio of a weight of the first polyamide (A) to a weight of the block copolymer (B) is from 65/35 to 85/15, and the thermoplastic resin composition has an amino group concentration of 20 mmol/kg or more.

公开(公告)号：US20230241816A1

公开(公告)日：2023-08-03

申请号：US18013142

申请日：2021-06-09

申请人： Polyplastics-Evonik Corporation

发明人： Mitsuteru MUTSUDA ,  Toshihiko FUJINAKA ,  Daisuke FUJIKI ,  Yoshiki NAKAIE

IPC分类号： B29C45/14 ,  B29C45/00

CPC分类号： B29C45/14811 ,  B29C45/0001 ,  B29K2077/00

摘要： Prepared is a laminate including: a first layer formed of a first resin composition containing a first resin; and a second layer formed of a second resin composition containing a second resin, the first layer and the second layer being in contact with each other and integrated. The first resin includes an alicyclic polyamide resin having 20 mmol/kg or greater of amino groups, and the second resin includes an acid-modified (meth)acrylic resin. The second resin may have 100 mmol/kg or greater of carboxyl groups. The acid-modified (meth)acrylic resin may be an acid-modified polymethylmethacrylate resin. An average thickness of the first layer may be 0.15 times or more of an average thickness of the second layer. The average thickness of the first layer may be 200 μm or greater. When a weight is dropped onto the second layer side, the laminate may have a DuPont impact strength of 500 N/inch or greater. The laminate has excellent transparency, lightness, light resistance, and impact resistance.

公开(公告)号：US20240360307A1

公开(公告)日：2024-10-31

申请号：US18681654

申请日：2023-05-10

申请人： POLYPLASTICS-EVONIK CORPORATION

发明人： Mitsuteru MUTSUDA ,  Yoshiki NAKAIE ,  Daisuke FUJIKI

IPC分类号： C08L63/00 ,  C08L77/06

CPC分类号： C08L63/00 ,  C08L77/06 ,  C08L2205/14

摘要： The present disclosure provides a thermosetting resin composition which can give a cured product having high toughness and in which the resin particles are unlikely to absorb moisture, and the like. The present disclosure relates to a thermosetting resin composition containing a thermosetting resin and resin particles, in which the resin particles contain a polyamide resin and a polyolefin resin, and the content of the polyamide resin in the resin particles is 50% by weight or more, and the like.