Method to form polycide local interconnects between narrowly-spaced
features while eliminating stringers
    2.
    发明授权
    Method to form polycide local interconnects between narrowly-spaced features while eliminating stringers 失效
    在窄间隔特征之间形成多晶硅局部互连的方法,同时消除桁条

    公开(公告)号:US6093602A

    公开(公告)日:2000-07-25

    申请号:US356007

    申请日:1999-07-16

    摘要: A method of fabricating local interconnects of polycide has been achieved. A substrate is provided. Narrowly spaced features, such as MOS transistor gates and polysilicon traces, are provided overlying the substrate. A dielectric layer is deposited overlying the substrate and the narrowly spaced features. The dielectric layer is patterned to form openings between the narrowly spaced features for planned contacts to the surface of the substrate. A doped polysilicon layer is deposited overlying the dielectric layer and filling the openings. The doped polysilicon layer is etched down to the top surface of the narrowly spaced features. The doped polysilicon layer remains in the spaces between the narrowly spaced features. A polycide layer is formed overlying the narrowly spaced features and the doped polysilicon layer. The polycide layer and the doped polysilicon layer are patterned to complete the contacts and create the local interconnects of polycide, and the integrated circuit device is completed.

    摘要翻译: 已经实现了制造多孔体的局部互连的方法。 提供基板。 在衬底上提供窄间隔的特征,例如MOS晶体管栅极和多晶硅迹线。 沉积在衬底上的电介质层和狭窄间隔的特征。 对电介质层进行图案化以在狭缝间隔的特征之间形成开口,用于与衬底表面的规划接触。 沉积覆盖介质层并填充开口的掺杂多晶硅层。 掺杂的多晶硅层被蚀刻到窄间隔的特征的顶表面。 掺杂多晶硅层保留在狭窄间隔的特征之间的空间中。 覆盖窄间隔的特征和掺杂多晶硅层形成多晶硅化物层。 将多晶硅层和掺杂多晶硅层图案化以完成触点并产生多晶硅化物的局部互连,并且完成集成电路器件。