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公开(公告)号:US20230145854A1
公开(公告)日:2023-05-11
申请号:US18093455
申请日:2023-01-05
发明人: YanYan JIANG , Xi REN , ZhenZhong WANG , LiGuo XIAO
CPC分类号: C08G73/1067 , B29C39/36 , B29C39/38 , C08G73/1003 , C08L79/08 , B29K2279/08
摘要: A polyimide precursor solution is disclosed, and a colorless transparent polyimide film manufactured from the polyimide precursor solution. The polyimide precursor solution has diamines, a first dianhydride represented by biphenyl dianhydride, a second dianhydride represented by rigid alicyclic dianhydride, a third dianhydride represented by non-alicyclic dianhydrides and organic solvent. The colorless polyimide films have a modulus of 4.5 GPa or higher, a glass-transition temperature (Tg) of 370° C. or higher, and a yellow index of 3.0 or lower. These polyimide films can be used as substrates for thin film transistor (TFT), touch sensor panel (TSP), and cover window applications in flexible display such as organic light-emitting diode (OLED), flexible liquid crystal display (LCD) and other fields.
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公开(公告)号:US11827749B2
公开(公告)日:2023-11-28
申请号:US16842074
申请日:2020-04-07
发明人: Karthikeyan Perumal , Jonathan Robert Parquette , Kuppusamy Kanakarajan , Xi Ren , ZhenZhong Wang
CPC分类号: C08G73/14 , B29C41/003 , B29C41/46 , C08G73/1021 , C08G73/1032 , C08J5/18 , B29K2079/08 , B29K2995/0026 , B29L2007/008 , B29L2031/3475 , C08J2379/08
摘要: A method of preparing a colorless transparent copolyamide-imide resin solution and its fabrication as a thin film has been disclosed. The method details formulations derived from a reaction between one or more units of dianhydride and one or more units of diamine monomers with one or more of the monomers containing fluorine atoms in their structural unit. It enables the fabrication of thin films with superior thermal and mechanical properties along with co-efficient of thermal expansion values as low as 2 ppm/° C. and a tensile modulus as high as 9 GPa. The transparent copolyamide-imide film thus prepared has the potential for utilization in flexible displays such as substrates for thin film transistors (TFT), touch sensor panels (TSP) and cover window in organic light emitting diode (OLED) and liquid crystal display (LCD) applications.
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3.
公开(公告)号:US20230303786A1
公开(公告)日:2023-09-28
申请号:US18198304
申请日:2023-05-17
发明人: Zhenzhong Wang , Changdan Tang , Zhaorong Li
CPC分类号: C08J5/18 , C08G73/1007 , C08G73/1039 , C08G73/1042 , C08G73/1078 , C08G73/1085 , C08J2379/08
摘要: Disclosed in the present disclosure are an ultra-high modulus and high-transmittance polyimide thin film, and a preparation method and application therefor. The ultra-high modulus and high-transmittance polyimide thin film is prepared by means of mixing and dissolving polydiamine and polydianhydride in a solvent, adding an end-capping reagent, and performing polymerization reaction and imidization. The ultra-high modulus and high-transmittance polyimide thin film has an ultra-high modulus and high transmittance, and is applicable to fields such as flexible photoelectricity and aerospace, especially to a structural member, a reinforcement layer or a substrate of flexible display and transparent display.
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4.
公开(公告)号:US11697710B2
公开(公告)日:2023-07-11
申请号:US16533911
申请日:2019-08-07
发明人: YanYan Jiang , ZhenZhong Wang , Xi Ren , Wei Zhang
CPC分类号: C08G73/1067 , B29C41/003 , B29C41/46 , C08G73/1021 , C08G73/1032 , C08G73/1078 , C08J5/18 , B29K2079/08 , B29K2995/0026 , B29L2007/008 , C08J2379/08 , H10K77/111
摘要: A polyimide film contains fluorinated substituents and cardo structures. The polyimide film exhibits excellent heat-resistance, transparency and mechanical properties. The polyimide film has a glass-transition temperature (Tg) of at least 360° C., a coefficient of thermal expansion (CTE) of 50 ppm/° C. or lower, a modulus of at least 4.0 Gpa, a b* value of 5 or lower and yellowness index of 8 or less. The polyimide film can be used as a display substrate or an optical film in a liquid crystal display (LCD), an organic light-emitting diode (OLED) and in other fields where the characteristic features are required.
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