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公开(公告)号:US06667226B2
公开(公告)日:2003-12-23
申请号:US10024091
申请日:2001-12-14
IPC分类号: H01L21425
CPC分类号: H01L21/76264 , H01L21/76283
摘要: A semiconductor device and a method for constructing a semiconductor device is disclosed. A deep trench isolation structure (108) is formed proximate a surface of a semiconductor substrate (106). A deep trench plug (122) layer is deposited within the deep trench isolation structure (108). A shallow trench isolation structure (130) is formed where the deep trench isolation structure (108) meets the surface of the semiconductor substrate (106). A shallow trench plug layer (133) is deposited within the shallow trench isolation structure (130).