公开(公告)号：US5156983A

公开(公告)日：1992-10-20

申请号：US427413

申请日：1989-10-26

申请人： Randall L. Schlesinger ,  Ralph W. Doe ,  Richard D. Gates ,  Dennis P. Goddard ,  Shih C. Hsu

发明人： Randall L. Schlesinger ,  Ralph W. Doe ,  Richard D. Gates ,  Dennis P. Goddard ,  Shih C. Hsu

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L24/86 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  Y10T29/49121 ,  Y10T29/49126

摘要： This invention involves the selective plating of the outer leads in tape automated bonding section (TAB section). An inner and an outer gasket are mounted over, respectively, an inner and an outer portion of the outer leads and a voltage is applied to a common plane conductor. A barrier material, usually nickel, is applied to the outer leads protruding between the inner and the outer leads and then solder is applied over the nickel layer. The debus areas which connect all the outer leads to the common plane conductor are then excised from the TAB section which is now ready for final test.

摘要翻译： 本发明涉及在带式自动接合部分（TAB部分）中的外引线的选择性电镀。 内部和外部垫圈分别安装在外部引线的内部和外部部分上，并且将电压施加到公共平面导体。 将通常为镍的阻挡材料施加到突出在内引线和外引线之间的外引线，然后将焊料施加在镍层上。 将所有外部引线连接到公共平面导体的脱落区域然后从现在准备好进行最终测试的TAB部分切除。

公开(公告)号：US5298464A

公开(公告)日：1994-03-29

申请号：US890984

申请日：1992-05-29

申请人： Randall L. Schlesinger ,  Ralph W. Doe ,  Richard D. Gates ,  Dennis P. Goddard ,  Shih C. Hsu

发明人： Randall L. Schlesinger ,  Ralph W. Doe ,  Richard D. Gates ,  Dennis P. Goddard ,  Shih C. Hsu

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L21/52 ,  H01L21/58 ,  H01L21/603

CPC分类号： H01L24/86 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  Y10T29/49121 ,  Y10T29/49126

摘要： This invention resides in a curing process for adhesive on a housing member of a tape automated bonding section (TAB section). A force is applied to the housing member and then the entire TAB section is heated to a sufficient temperature and for a sufficient duration to cure the adhesive. The applied force, coupled with the heat squeezes a portion of the adhesive out from between the TAB section and the housing member and onto an inner portion of the outer leads before the adhesive cures. This embeds the inner portion of the outer leads with adhesive so that they are retained in alignment with and electrically isolated from each other.The manner in which the force is applied to the housing member during the curing process is also a novel feature of the invention. The TAB section within the carrier frame is placed on a pedestal in a mounting fixture. A compressor block is then disposed against the TAB section. A compressor bar clamped over the compressor block and to the mounting fixture urges the compressor block against the TAB section. This also causes a centrally-located spring loaded plunger within the compressor block to push against the semiconductor chip but with a reduced force. This reduced force presses the chip against a housing member aperture so that a silver epoxy mounted in the aperture can evenly disperse over the semiconductor chip.

摘要翻译： 本发明涉及一种用于胶带自动粘合部分（TAB部分）的外壳部件上的粘合剂的固化方法。 将力施加到壳体构件，然后将整个TAB区段加热至足够的温度并持续足够的时间固化粘合剂。 在粘合剂固化之前，所施加的力与热量挤压粘合剂的一部分从TAB部分和壳体部件之间挤压到外部引线的内部。 这使得外部引线的内部部分用粘合剂嵌入，使得它们保持与彼此对齐并且彼此电隔离。 在固化过程中将力施加到壳体构件的方式也是本发明的新颖特征。 载体框架内的TAB部分放置在安装夹具中的基座上。 然后将压缩机块设置在TAB部分上。 夹紧在压缩机组件和安装夹具上的压缩机杆促使压缩机块抵靠TAB部分。 这也使得压缩机组件内的位于中心的弹簧加载柱塞推压半导体芯片但是具有减小的力。 这种减小的力将芯片压靠住壳体构件孔，使得安装在孔中的银环氧树脂可以均匀地分散在半导体芯片上。